Electronic component carrier sheet, and adhesion device and thin film forming apparatus using same
A technology of electronic components and pasting devices, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as temperature increase, heat cannot be effectively transferred to the platform, and semiconductor chips are damaged, and achieve the effect of preventing warping
Pending Publication Date: 2019-12-06
CNI TECH
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Problems solved by technology
[0015] However, in the case of mounting multiple objects on the platform by fixing multiple objects such as an adhesive sheet, the adhesive sheet and the platform cannot be sufficiently adhered to each other.
That is, the adhesive sheet cannot maintain a flat shape continuously, and many raised parts are formed on the platform where the adhesive sheet is attached
[0016] As mentioned above, if the adhesive sheet cannot be adhered to the platform, the heat generated from the object fixed on the adhesive sheet as the thin film deposition process progresses cannot be effectively transferred to the platform, and the temperature of the object continues to increase, eventually resulting in The problem of having to destroy object bodies
[0017] In particular, the semiconductor package has to be continuously exposed to high temperature in the process of forming a shield against electromagnetic waves, and in this case, the semiconductor chip arranged in the package is damaged due to high-temperature heat or the semiconductor package is bent, etc. , so there is a problem of greatly reducing the manufacturing efficiency and stability of semiconductor packages
Method used
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[0105] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and shapes different from each other can be realized, and the present embodiment is provided only to make the disclosure of the present invention more complete and to inform those who have conventional knowledge of the scope of the invention. In the description, the same reference numerals are assigned to the same structures, and the drawings may partially show exaggerated sizes to accurately illustrate the embodiments of the present invention, and the same reference numerals in the drawings refer to the same constituent elements .
[0106] figure 1 It is a cross-sectional view of an electronic component carrier sheet showing an embodiment of the present invention.
[0107] refer to figure 1 , the electronic component carrier 100 according to an embodiment of t...
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The present invention provides an electronic component carrier sheet, and an adhesion device and a thin film forming apparatus using the same, the electronic component carrier sheet allowing electronic components to be attached thereto so as to form a thin film on the surface of the electronic component while cooling the electronic component.
Description
technical field [0001] The present invention relates to an electronic component carrier sheet, a sticking device using the same, and a thin film forming device. More specifically, it relates to an electronic component that is used to form a thin film on the surface of the electronic component while cooling the electronic component by bonding the electronic component on the electronic component carrier sheet Carrier sheets, bonding devices using them, and film forming devices. Background technique [0002] Recently, since electromagnetic waves are known to be harmful to the human body, techniques for shielding a large amount of electromagnetic waves generated from various electronic products such as portable communication devices, image display devices, and game machines have been developed. [0003] In general, electromagnetic waves are mainly generated by electronic products and electronic components such as semiconductor packages in the upper part, so various techniques ha...
Claims
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Login to View More IPC IPC(8): H01L23/552H01L23/00H01L23/532C23C14/54C23C14/50C23C14/34H01J37/34C23C14/58H01L21/67
Inventor许真韩奎珉李进善郑有燮梁源硕李昊哲李民镇
OwnerCNI TECH