Functional module and electronic equipment

A module and function technology, applied in electrical digital data processing, character and pattern recognition, instruments, etc., can solve the problem that the thickness of functional modules cannot be reduced, and achieve the effect of reducing the thickness

Pending Publication Date: 2020-05-08
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a functional module and electronic equipment to solve the problem that the thickness of the functional module cannot be reduced in the prior art

Method used

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  • Functional module and electronic equipment
  • Functional module and electronic equipment
  • Functional module and electronic equipment

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0022] Aiming at the problem that the thickness of the functional module cannot be reduced in the prior art, the present invention provides a functional module, such as Figure 1 to Figure 6 shown, including:

[0023] protective layer 1;

[0024] An encapsulation layer 2 connected to the protective layer 1, the encapsulation layer 2 is provided with a preset chip 3 and a connecting wire 4;

[0025] The connection layer 5 connected to the packaging la...

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Abstract

The invention provides a functional module and electronic equipment, and the functional module comprises a protection layer; a packaging layer which is connected with the protective layer, wherein a preset chip and a connecting wire are arranged in the packaging layer; and a connecting layer which is connected with the packaging layer, a step-shaped structure sunken towards the connecting layer isarranged at the end corner, away from the connecting layer, of the preset chip, the first end of the connecting wire is connected with the step-shaped structure, and the second end of the connectingwire is connected with the connecting layer; wherein the maximum distance value between a point on the connecting line and the connecting layer is smaller than or equal to the maximum distance value between the upper surface of the preset chip and the connecting layer; wherein the upper surface of the preset chip is the surface, deviating from the connecting layer, of the preset chip. According tothe scheme, the function of the functional module is not influenced while the thickness of the packaging layer is reduced, so that the reduction of the thickness of the functional module is better realized.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a functional module and electronic equipment. Background technique [0002] With the advancement of intelligence, electronic equipment products have become a part of people's lives. At the same time, the requirements for electronic equipment products are getting higher and higher, such as the demand for miniaturization, long battery life, durability and reliability of electronic equipment. While the device design needs to be miniaturized and modularized as much as possible, it is also necessary to ensure the reliability of the module to be better; however, while ensuring the miniaturization, modularization and reliability strength, it will bring some other problems: Take the fingerprint module as an example. In order to ensure the miniaturization, modularization and reliability of electronic equipment, the current design of the capacitive fingerprint module is to pac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F3/044
CPCG06F3/044G06V40/1306
Inventor 袁艳清王建峰
Owner VIVO MOBILE COMM CO LTD
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