Device and method for in-situ testing reaction behaviors of refractory material under action of stress

Abstract

The invention discloses a device and method for in-situ testing the reaction behaviors of a refractory material under the action of stress, wherein the device comprises a stress loading system which is used for clamping a test sample and providing pressure stress loading for the test sample when the reaction behaviors of the test sample are tested; an air-cooled thermal shock system which is usedfor providing thermal stress for the test sample when the reaction behaviors of the test sample are tested; a heating system which is used for heating the sample when the reaction behaviors of the sample are tested; an atmosphere control system which is used for providing a vacuum or different atmosphere test environment for the sample when the reaction behaviors of the sample are tested; and a detection system which is used for carrying out the real-time in-situ detection on the reaction behaviors of the sample. According to the present invention, a temperature field, an atmosphere field anda stress field of the sample during the reaction process can be synergistically regulated so as to carry out the in-situ test on the high temperature reaction behaviors of the refractory material under the condition of being closer to an actual service environment.

Description

technical field [0001] The invention belongs to the technical field of performance research of inorganic non-metallic materials, and in particular relates to a device and method for in-situ testing the reaction behavior of refractory materials under stress. Background technique [0002] Refractory materials are widely used in various fields of national economy such as steel, non-ferrous metals, glass, cement, ceramics, petrochemical, electric power and military industry. It plays an irreplaceable important role in the development of production. However, in practical applications, refractory materials are often subject to frequent temperature changes, scour and extrusion of different reaction media, so they are inevitably affected by thermal stress, compressive stress and thermal-compressive coupling complex stress, which will cause the microstructure of the material to change. Changes, micro-cracks and holes, even cracking and peeling, the resulting material failure often b...

AI Technical Summary

Problems solved by technology

However, most of the existing test devices do not consider the influence of stress on refractory materials, and the few test devices cannot take into account the online acquisition of the sample quality and microstructural evolution during the reaction process. Therefore, it is impossible to accurately characterize refractory materials. Damage behavior and mechanism under high temperature stress field

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