A kind of LED encapsulation dispensing device

Abstract

An LED package dispensing device, which belongs to the technical field of LED circuit manufacturing, includes a housing, a rotor, a bracket, a gas pipe and a needle tube, the rotor is installed on the housing, the bracket is connected to the housing and connected to the driving component, and the gas pipe is installed on the housing On, the needle tube is installed under the housing. The shell includes a cylinder, a closing area, a compression area, a packing area, a pressure head, a cover plate and a through hole. The side of the cylinder is connected to the closing area, and the closing area is connected to the compression area. head, and the pressing head is upwardly connected to the actuating parts of the extrusion operation. A cover plate is installed on the cylinder, and a through hole is arranged on the side of the cover plate, and an air pipe is installed on the through hole. The rotor includes a turntable, a side groove, a glue hole, a chute and a rotating shaft. The turntable is installed in the cylinder, and the side of the turntable is evenly distributed with side grooves. There are also glue holes on the side of the turntable. The side groove and the glue hole are connected, and the glue enters from the side groove. Glue hole, the glue hole runs through the entire turntable from top to bottom, and there is a rotating shaft at the bottom of the turntable, which is connected to the rotating parts.

Description

technical field [0001] The invention belongs to the technical field of LED circuit manufacturing, and in particular relates to a glue dispensing device for LED packaging. Background technique [0002] An important operation in the manufacturing process of LED circuits is to solder the lamp beads to the light strip or board. The lamp beads are bonded at the welding position. This operation is called dispensing in the industry. The amount of glue used in the dispensing operation usually needs to be strictly controlled. For lamp beads with smaller and smaller sizes, too little glue can not achieve the fixing effect. Too much glue may cause the glue to overflow into the pins and affect the welding quality. Therefore, the dispensing operation usually requires strict control of the amount of glue. Contents of the invention [0003] The present invention provides an LED package dispensing device to solve the above-mentioned problems in the background technology. [0004] The te...

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Problems solved by technology

[0002] An important operation in the LED circuit manufacturing process is to solder the lamp beads to the light strip or board. For the surface mount LED circuit, in order to prevent the lamp beads from shifting during the welding process, it is necessary to use a small amount of glue to The lamp beads are bonded at the welding position. This operation is called dispensing in the industry. The amount of glue used in the dispensing operation usually needs to be strictly controlled. For lamp beads with smaller and smaller sizes, too little glue can not achieve the fixing effect. Too much glue may cause the glue to overflow into the pins and affect the welding quality. Therefore, the dispensing operation usually requires strict control of the amount of glue

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