Chip and mainboard

Abstract

The invention provides a chip and a mainboard. The chip comprises a packaging substrate with a first surface and a second surface which are opposite to each other, and at least one memory bare chip arranged on the first surface of the packaging substrate. The first surface of the packaging substrate is provided with a central processing unit bare chip, and the central processing unit bare chip iselectrically connected with each memory bare chip in the at least one memory bare chip so as to write data into each memory bare chip or read data from each memory bare chip. The second surface of thepackaging substrate is provided with pins used for being electrically connected with the printed circuit board, and the central processor bare chip is further electrically connected with the pins onthe second surface. The central processing unit bare chip and the at least one memory bare chip are packaged on the packaging substrate, and each memory bare chip is electrically connected with the central processing unit bare chip, so that the central processing unit bare chip and the memory bare chip on the packaging substrate can work, the integration degree of the chip and the mainboard is improved. The area of a printed circuit board of a mainboard can be reduced, system design is simplified, and system reliability is improved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a chip and a mainboard. Background technique [0002] With the development of computers at any time, device integration has gradually become a development trend. The connection mode between the central processing unit and the memory module of the motherboard in the prior art is as follows: a central processing unit and a plurality of memory connectors are arranged on the printed circuit board, and a memory bar is plugged into each memory connector. That is, all the memory on the motherboard is provided by the memory sticks on the printed circuit board. Since the size of the memory stick is relatively large, and when the memory connector is arranged on the printed circuit board, it will occupy more area of ​​the printed circuit board, thereby crowding out the installation space of other devices, so that the integration degree of the mainboard is low. Contents of the invention...

AI Technical Summary

Problems solved by technology

Due to the large size of the memory stick, and when the memory connector is set on the printed circuit board, it will occupy more area of ​​the printed circuit board, thereby occupying the setting space of other devices, so that the integration of the motherboard is low.

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