An etching device for capacitor chip processing
A technology for capacitor chips and etching devices, which is applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of consuming etchant, affecting capacitor chips, and not being able to etch capacitor chips, so as to reduce waste and use costs.
Active Publication Date: 2022-04-01
新创电子技术(东莞)有限公司
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[0003] When the existing plate-like capacitor chips are etched on one side by wet etching, some devices use a mask on one side, and then soak the entire silicon chip in the etching solution, and then etch the front side. In order to achieve the purpose of single-sided etching, some devices use the method of spraying the etching solution on one side. Both of these two methods have the following defects: the user cannot perform etching on the capacitor chip as required. One side is etched at a specific position, and the above two sets of device etching methods are likely to affect other positions on the side of the capacitor chip that do not need to be etched, which in turn affects the subsequent use of the capacitor chip and consumes more etching solution , so that the etching cost is higher. Therefore, we propose an etching device for capacitor chip processing
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] see Figure 1-4 : The present invention provides a kind of etching device for capacitor chip processing, comprising, base 1, base 1 top is fixedly provided with receiving platform 2, and receiving platform 2 adopts the mode of bolt to be fixed on base 1 top, and in actual situation, receiving platform 2 The left and right sides of the top are also symmetrically arranged with a chip suction mechanism widely used in this field, which is used to extract an...
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The invention discloses an etching device for capacitor chip processing in the technical field of etching devices, including a base, a receiving platform is fixedly arranged on the top of the base, support columns are fixedly arranged around the top of the base, and four groups of The top of the supporting column is respectively fixed around the bottom of the top plate; the etching component includes a control component 1 slidably arranged in the middle of the bottom of the top plate, the bottom of the control component 1 is provided with a control component 2, and the bottom of the control component 2 is provided with an etching solution barrel assembly. The present invention can select a radial etching method or a lateral etching method according to the specified position on the side of the capacitor chip body to be etched, and can perform rolling etching on the specified position on the capacitor chip body according to the selected etching method. Intermittent liquid supply is realized during etching. On the one hand, it avoids the impact of too much etching liquid on other positions that do not need to be etched when etching the specified position. On the other hand, it reduces the waste of etching solution and reduces the cost of use. .
Description
technical field [0001] The invention relates to the technical field of etching devices, in particular to an etching device for processing capacitor chips. Background technique [0002] In the capacitor chip processing industry, the capacitor chip has to go through the etching process. Among them, the etching process is dry etching and wet etching. Obviously, the difference between them is that the wet method uses a solvent or solution for etching. [0003] When the existing plate-like capacitor chips are etched on one side by wet etching, some devices use a mask on one side, and then soak the entire silicon chip in the etching solution, and then etch the front side. In order to achieve the purpose of single-sided etching, some devices use the method of spraying the etching solution on one side. Both of these two methods have the following defects: the user cannot perform etching on the capacitor chip as required. One side is etched at a specific position, and the above two...
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IPC IPC(8): H01G13/00
CPCH01G13/00
Inventor巩铁凡
Owner新创电子技术(东莞)有限公司