Circuit board

A circuit board and circuit technology, applied in the directions of printed circuits, printed circuits, circuit thermal devices, etc., can solve the problems of affecting the performance of heating devices, damage to heating devices, temperature rise, etc., to reduce the size of circuit boards, reduce volume, Avoid repetitive effects

Active Publication Date: 2021-04-09
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heating device in the circuit board cannot be dissipated in a timely and efficient manner, its temperature will rise, which will affect the working performance of the heating device and even damage the heating device

Method used

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Experimental program
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Effect test

Embodiment Construction

[0049] The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0050] see figure 1 with figure 2 The embodiment of the present application provides a circuit board 100, including a heat generating device 10 embedded in the circuit board 100, a cooling liquid channel 20, and a substrate 60. Optionally, the circuit board 100 may also include a heat sink 30, pins 40, Circuit traces 50 on the substrate. in, figure 1 with figure 2 Take one heating device 10 as an example, but the circuit board 100 may contain multiple heating devices at the same time;figure 1 with figure 2 Take the heating device 10 having two pins (the pin 41 on the left side and the pin 42 on the right side) as an example, but according to the specific design, the heating device can include other numbers of pins; the circuit traces and the pins have corresponding relation, figure 1 with figure 2 Among them, the c...

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PUM

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Abstract

The invention relates to the technical field of circuit boards, and provides a circuit board with good heat dissipation performance in an embodiment. Thecircuit board comprises a substrate serving as a circuit board body, a heating device embedded in the substrate, and a cooling liquid channel arranged in the substrate. The cooling liquid channel passes through the periphery of the heating device so that a cooling liquid flowing in the cooling liquid channel exchanges heat with the heating device, and the effect of heat dissipation of the heating device is achieved. According to the circuit board, the cooling liquid channel is arranged in the circuit board, passes through the periphery of the heating device and exchanges heat with the heating device so that a heat dissipation path is shortened, the heat dissipation efficiency is improved, rapid heat dissipation of the circuit board is facilitated, and the service life of the circuit board is prolonged. Besides, the cooling liquid channel is arranged in the circuit board so that the integration level of the circuit board is improved, and the size of the electronic equipment comprising the circuit board can be reduced.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board with good heat dissipation performance. Background technique [0002] With the continuous development of electronic products in the direction of smaller, lighter and higher power, the integration of heat generating devices in circuit boards using embedded packages (ECP, Embedded Components Package) is getting higher and higher, and the circuit boards are working , the internal heating device will generate a large amount of heat. If the heating device in the circuit board cannot be dissipated in a timely and efficient manner, its temperature will rise, which will affect the working performance of the heating device and even damage the heating device. Therefore, it is necessary to propose a circuit board capable of effectively dissipating heat. Contents of the invention [0003] In view of this, an embodiment of the present application provides a circuit board. A c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0203H05K1/0204H05K1/0272H05K1/185H05K2201/064H05K2201/10416H05K1/182H05K7/20218
Inventor 侯召政廖小景沈超王东兴
Owner HUAWEI DIGITAL POWER TECH CO LTD
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