Stripping tool for semi-conductive layer of flexible cable

A flexible cable, semi-conductive layer technology, used in cable installation, cable installation devices, equipment for dismantling/armored cables, etc. and other problems, to achieve the effect of quality standards and stability, lowering the technical threshold and less difficulty in manufacturing

Pending Publication Date: 2021-08-31
武汉华仪智能设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a flexible cable semi-conductive layer peeling tool to solve the problem in the related art that the manual operation is not smooth, the spiral cuts cannot be guaranteed, and the cuts may be too deep or too shallow so that the efficiency and quality of construction cannot be guaranteed. question

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  • Stripping tool for semi-conductive layer of flexible cable
  • Stripping tool for semi-conductive layer of flexible cable
  • Stripping tool for semi-conductive layer of flexible cable

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Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] The embodiment of the present invention provides a flexible cable semi-conductive layer peeling tool, which can solve the problem that in the related art, the manual operation is not smooth, and it cannot guarantee that no spiral cuts will be generated, and the cuts may be too deep or too shallow to ensure the efficiency and efficiency ...

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Abstract

The invention relates to a stripping tool for a semi-conductive layer of a flexible cable. The stripping tool comprises an outer sleeve; a positioning mechanism which is arranged in the outer sleeve and is used for positioning the flexible cable; a ring cutting mechanism which is mounted in the outer sleeve, wherein the ring cutting mechanism comprises a ring cutting knife block and a ring cutting adjusting mechanism used for adjusting the distance between the ring cutting knife block and the flexible cable; and a longitudinal cutting mechanism which comprises a longitudinal cutting knife block and a longitudinal cutting adjusting mechanism used for adjusting the distance between the longitudinal cutting knife block and the flexible cable. The embodiment of the invention provides a stripping tool for a semi-conductive layer of a flexible cable, and aims to solve the problems that in the related technology, a cut is not smooth due to manual operation, no spiral cutting mark cannot be generated, and the construction efficiency and quality cannot be guaranteed due to the fact that the cut is possibly too deep or too shallow.

Description

technical field [0001] The invention relates to the field of cable stripping and cutting, in particular to a flexible cable semiconductive layer stripping tool. Background technique [0002] At present, power cables often need to install cable accessories during the construction process. In the process of installing power cable accessories, the semi-conductive layer needs to be stripped to a certain length to ensure sufficient electrical distance between high and low potentials. Therefore, the quality of the stripping of the semiconductive layer of the flexible cable directly affects the safety of the cable and the accuracy of the installation of the cable accessories. [0003] In the related art, the common method for stripping the semiconductive layer of flexible cables is to mechanically scratch the semiconductive layer by manually operating the wallpaper knife or its cutting tool, and then use the clamping tool to peel off the semiconductive layer from the surface of the...

Claims

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Application Information

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IPC IPC(8): H02G1/12
CPCH02G1/1268H02G1/127
Inventor 杨泽亚陈俊曹帅刘铁桥王伦
Owner 武汉华仪智能设备有限公司
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