Multi-layer shock-resistant packaging box for electronic products

Abstract

The invention relates to the technical field of packaging boxes, in particular to a multi-layer shock-resistant packaging box for electronic products. The multi-layer shock-resistant packaging box for the electronic products comprises a box body, mounting grooves are formed in the inner wall of the box body, the two mounting grooves are symmetrical with respect to the center of the box body, spring assemblies are mounted in the two mounting grooves in a matched manner, the two spring assemblies are symmetrical with respect to the center of the box body, each spring assembly comprises a connecting cylinder, a first pressing plate and a second pressing plate, a tightening belt is clamped and installed between the first pressing plate and the second pressing plate, a second partition plate is movably installed in the box body, a first partition plate is further fixedly installed on the inner wall, close to the second partition plate, of the box body, a third partition plate is fixedly installed on the bottom surface in the box body, and an abutting plate is fixedly mounted on the side, close to the tightening belt, of the second partition plate. After the two ends of the tightening belt are wound and tightened, an object is tightened and fixed to the upper surface of the third partition plate, in the transportation process and the like, the vibration and shaking conditions of the object can be reduced, and the shock resistance is improved.

Description

technical field [0001] The invention relates to the technical field of packaging boxes, in particular to a multi-layer shockproof packaging box for electronic products. Background technique [0002] The development and progress of science and technology has accelerated the progress of the manufacturing industry, which has brought substantial changes to our lives. Various electronic products can be seen everywhere in our lives, such as car navigation. Most of the product packaging is cartons made of corrugated paper, which are fixed and filled with anti-seismic materials to form multi-layer protection, and finally packed and transported. Due to the different degrees of external vibration during the transportation and the rapid sorting operation, when placing and fixing electronic products, it is necessary to place some chemical buffer fillers such as foam, which is not easy to fix most objects with different thicknesses. The process is cumbersome and the anti-seismic effect ...

AI Technical Summary

Problems solved by technology

[0004] For the existing electronic products in the process of transportation and rapid sorting operation, they will be subject to different degrees of external force vibration. When placing and fixing electronic products, it is necessary to place some chemical buffer fillers such as foam, which is not easy to adjust for most different thicknesses. The object is fixed, the operation process is cumbersome and the anti-seismic effect is not ideal, so that the products inside the packaging box have serious shaking problems. The invention provides a multi-layer anti-seismic packaging box for electronic products

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