Surface treatment device for integrated circuit lead frame

A surface treatment device and lead frame technology, applied in circuits, electrical components, filter circuits, etc., can solve the problems of cleaning impurities, easy adhesion of impurities, unfavorable processing, etc., and achieve the effect of saving liquid medicine.

Active Publication Date: 2022-03-11
天水华洋电子科技股份有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The lead frame surface treatment device in the prior art mostly uses soaking and spraying to treat the surface of the lead frame. In the process, impurities are easy to stick to the surface of the lead frame, which is not conducive to subsequent processing. In view of this, we propose a surface treatment device for integrated circuit lead frames

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface treatment device for integrated circuit lead frame
  • Surface treatment device for integrated circuit lead frame
  • Surface treatment device for integrated circuit lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations.

[0030] Such as Figure 1 to Figure 9 The shown one is used for the integrated circuit lead frame surface treatment device, comprises housing 1, and housing 1 two sides are symmetrically provided with and is used for the spray cleaning mechanism that is used for spraying the surface of lead frame, and the inner wall of housing 1 is provided with for The conveying mechanism that clamps the lead frame and moves inside the housing 1. A guide plate 2 is fixed on the inner wall of the housing 1. The top surface of the guide plate 2 is inclined. The housing 1 is located at the lowest position of the guide plate 2. Groove 3, a drain tank 4 is fixed on the outer wall of the housing 1, the drain tank 4 communicates w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of lead frame surface treatment, in particular to an integrated circuit lead frame surface treatment device which comprises a shell, and spray washing mechanisms used for conducting spray washing on the surface of a lead frame are symmetrically arranged on the two sides of the shell. A conveying mechanism used for clamping a lead frame to move in the shell is arranged on the inner wall of the shell, a guide plate is fixed to the inner wall of the shell, the top face of the guide plate is inclined, a communicating groove is formed in the position, located at the lowest position of the guide plate, of the shell, and a draining box is fixed to the outer wall of the shell and communicates with the interior of the shell through the communicating groove. A filter opening is formed in the top surface of the guide plate close to the draining box, and a first filter screen is fixed in the filter opening; according to the scheme, liquid medicine is sprayed to the lead frame through the spray-washing mechanism, and the liquid medicine is filtered in time, so that impurities are prevented from adhering to the surface of the lead frame, and subsequent processing of the lead frame is facilitated.

Description

technical field [0001] The invention relates to the field of surface treatment of lead frames, in particular to a surface treatment device for integrated circuit lead frames. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] Some invention patents related to the surface treatment of lead frames have been disclosed in the prior art. The Chinese patent application number is 201711365801.8, which discloses a device for surface treatment of lead frames, including a feeding mechanism, a rec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495B01D36/02
CPCH01L23/495B01D36/02
Inventor 康小明康亮马文龙
Owner 天水华洋电子科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap