Method for making electrical behavior connection structure

A manufacturing method and an electrical connection technology, which are applied in the direction of forming the electrical connection of printed components, etc., can solve the problem of reducing the electrical performance and high heat dissipation efficiency of the electrical connection structures 100b and 200b, and the cross-section of the conductive through holes 142 and the conductive micro-holes 242. Area reduction and other issues, to achieve the effect of improving the production yield, reducing the probability of empty holes, and reducing time

Inactive Publication Date: 2006-10-11
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these voids 142a and 242a will reduce the cross-sectional area of ​​the conductive via 142 and the conductive micro-hole 242 respectively, thereby reducing the electrical performance and high heat dissipation efficiency of the electrical connection structures 100b and 200b

Method used

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  • Method for making electrical behavior connection structure
  • Method for making electrical behavior connection structure
  • Method for making electrical behavior connection structure

Examples

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no. 1 example

[0053] see Figure 3A-3F , which is a cross-sectional flowchart of a manufacturing method of an electrical connection structure according to the first embodiment of the present invention. First, see Figure 3A , the manufacturing method of the electrical connection structure of the present invention is applicable to the manufacturing process of a circuit board. A conductive substrate 310 is provided, and the conductive substrate 310 is divided into a first conductive layer 312 and a bump conductive layer 314 , and the bump conductive layer 314 is overlapped on the first conductive layer 312 . In addition, the above-mentioned conductive base material 310 is made of copper, for example.

[0054] see Figure 3B , patterning the conductive bump layer 314 , wherein the conductive bump layer 314 is patterned in a manner such as photolithographic etching, so as to form at least one bump 314 a on the first conductive layer 312 .

[0055] see next Figure 3C , form a dielectric la...

no. 2 example

[0062] The difference between the first embodiment and the second embodiment is that in the first embodiment, the method of forming the lower half of the conductive pillar (i.e., the bump) is a subtractive process, while in the second embodiment The method of forming the lower half of the conductive pillar (ie bump) is an additive process.

[0063] see Figures 4A-4E , which is a cross-sectional flowchart of a manufacturing method of an electrical connection structure according to the second embodiment of the present invention. First, see Figure 4A and Figure 4B , provide a conductive layer 412, and the material of the conductive layer 412 is copper, and then form a patterned photoresist layer (patterned photo resist layer) (not shown in the figure) on the conductive layer 412, and then, for example, by electroplating, and conduct The layer 412 is used as a plating seed layer, and conductive material is formed in the opening (not shown in the figure) of the patterned phot...

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Abstract

The manufacture method for a circuit board comprises: given a board with conductive substrate divided into a first conductive layer and a designed convex conductive layer, forming a dielectric layer on the first conductive layer and convex block; then, forming a second conductive layer on the dielectric layer; forming at least one blind hole to cross the second layer and dielectric layer to expose the top surface of the block; finally, filling conductive material into the hole to form a conductive column. This invention can improve product quality.

Description

technical field [0001] The invention relates to a method for manufacturing an electrical connection structure, in particular to a method for manufacturing an electrical connection structure suitable for circuit board manufacturing processes. Background technique [0002] The circuit board is mainly formed by alternate lamination of multiple patterned circuit layers and multiple dielectric layers. In addition, circuit boards mainly include two types of circuit boards: laminating process and build-up process. Regardless of the above-mentioned types of circuit boards, in order to electrically connect the patterned circuit layers of the circuit board to each other, the prior art usually uses conductive vias. According to the manufacturing process and structure of the conductive hole, common conductive holes include conductive through vias and conductive micro vias. According to the relative positions of the conductive microvias on the circuit board, the conductive microvias in...

Claims

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Application Information

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IPC IPC(8): H05K3/40H05K3/42
Inventor李少谦曾子章李长明
OwnerUNIMICRON TECH CORP