Method of manufacturing laminated substrate

A manufacturing method and a technology of laminated substrates, applied in the field of manufacturing such electronic components and manufacturing such laminated substrates, can solve the problems of reduced grinding efficiency, increased risk, and the use of multi-layer wiring substrates, so as to improve grinding accuracy and simplify Grinding process, effect of preventing load concentration
CN1856223AInactive Publication Date: 2006-11-01TDK CORPARATION
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TDK CORPARATION
Publication Date
2006-11-01
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.
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Description

technical field

[0001] The present invention relates to an electronic component typified by a so-called multilayer wiring substrate by laminating metal foils with resin attached on both sides on both sides of a substrate and a method of manufacturing such an electronic component. made. More particularly, the present invention relates to a laminated substrate having a very good surface flatness such that post-processing such as grinding can be efficiently performed on the substrate and a method of manufacturing such a laminated substrate. Background technique

[0002] Electronic components called multilayer wiring substrates have been developed in order to achieve densification of electronic devices. In a multilayer wiring substrate, various wirings for being provided on a printed circuit board are provided in a laminated substrate so that high-density mounting can be realized. In a specific manufacturing method, wiring, electrodes, etc. are formed on the upper and lower su...

Claims

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