Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures

a technology of hermetically sealed microstructures and electrochemical fabrication, which is applied in the direction of waveguides, instruments, waveguide type devices, etc., can solve the problems of destructive separation of masking materials from substrates

Inactive Publication Date: 2008-05-08
MICROFAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

Method used

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  • Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures
  • Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures
  • Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures

Examples

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Embodiment Construction

[0067]FIGS. 1A-1G, 2A-2F, and 3A-3C illustrate various features of one form of electrochemical fabrication. Other electrochemical fabrication techniques are set forth in the '630 patent referenced above, in the various previously incorporated publications, in various other patents and patent applications incorporated herein by reference. Still others may be derived from combinations of various approaches described in these publications, patents, and applications, or are otherwise known or ascertainable by those of skill in the art from the teachings set forth herein. All of these techniques may be combined with those of the various embodiments of various aspects of the invention to yield enhanced embodiments. Still other embodiments may be derived from combinations of the various embodiments explicitly set forth herein.

[0068]FIGS. 4A-4I illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first meta...

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Abstract

In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Description

RELATED APPLICATIONS [0001] This application claims benefit of 60 / 681,788, filed May 16, 2005 and is a continuation of U.S. patent application Ser. No. 11 / 435,809 which is a continuation in part of U.S. patent application Ser. No. 10 / 434,103, filed on May 7, 2003 which in turn claims benefit of U.S. Provisional Patent Application Nos. 60 / 379,182, filed on May 7, 2002, and 60 / 430,809, filed Dec. 2, 2002. Each of the above noted priority applications is hereby incorporated herein by reference as if set forth in full.FIELD OF THE INVENTION [0002] The present invention relates generally to the field of electrochemical fabrication and the associated formation of three-dimensional structures via a layer-by-layer build up of deposited materials. In particular, it relates to the formation of microstructures and the concurrent formation of packaging for such structures, such that for example, sacrificial material(s) are removed from internal cavities of the package and critical portions of t...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): C25D5/10
CPCB81B2201/042B81C1/00293B81C1/00333B81C2201/0197B81C2203/0145G01P15/0802C25D1/003H01P1/202H01P3/06H01P5/183H01P11/00H01P11/005H05K3/4647G01P15/125
InventorCOHEN, ADAM L.LOCKARD, MICHAEL S.SMALLEY, DENNIS R.ARAT, VACITBANG, CHRISTOPHER A.DIXON, JOHN C.
OwnerMICROFAB