Ebullient cooling device

a cooling device and ebullient technology, applied in the direction of semiconductor devices, lighting and heating apparatus, basic electric elements, etc., can solve the problems of difficult cooling of heat generating bodies, inability to increase the heat transport amount, and inability to secure a size that is compatible with the amount of heat generated, etc., to achieve efficient dissipation of heat, simple structure, and maintain heat conduction efficiency at a high level

Inactive Publication Date: 2013-03-07
NEC CORP
View PDF19 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a cooling system for electronic components. The invention involves using a coolant that can transform between liquid and gas to transfer heat from a heat-generating body to a heat-sinking body. The heat receiving and dissipating members are positioned away from each other, which ensures high heat conduction efficiency without interfering with the gas phase coolant. This design offers efficient heat dissipation in a simple structure, and is particularly suitable for LSIs and ICs with large amounts of heat generation.

Problems solved by technology

However, when attempting to reduce the size and thickness of a device, for a cooler such as a heat sink that is to be mounted on the LSI or IC, the current situation is that it is not possible to secure a size that is compatible with the amount of heat generated.
However, when circulating the liquefied coolant that is produced at the heat dissipating plate 7 to the heat receiving plate 3 by the heat pipe 6, since it goes through the fine mesh wick 9, it is not possible to increase the amount of heat transport.
Accordingly, it is difficult to cool a heat generating body 2 having a large amount of heat.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ebullient cooling device
  • Ebullient cooling device
  • Ebullient cooling device

Examples

Experimental program
Comparison scheme
Effect test

first exemplary embodiment

[0036]A first exemplary embodiment of the present invention shall be described with reference to FIG. 1 to FIG. 3.

[0037]FIG. 1 to FIG. 3 show an ebullient cooling device 20 according to the first exemplary embodiment of the present invention. A heat generating body 10 which is an LSI or IC, for example is joined to the ebullient cooling device 20. More specifically, the heat generating body 10 is joined to a heat receiving plate 22 of the ebullient cooling device 20 by a thermally conductive grease or a thermally conductive sheet. At this time, the heat generating body 10 may be bonded with solder.

[0038]The ebullient cooling device 20 has a plate-shaped hollow chamber 24. This chamber 24 has a side wall portion 21 that is formed in the shape of a quadrilateral frame, a heat receiving plate (heat conducting plate) 22 that covers an upper opening 21A of the side wall portion 21, and a heat dissipating plate (heat conducting plate) 23 that covers a lower opening 21B of the side wall po...

second exemplary embodiment

[0071]Next, a second exemplary embodiment of the present invention shall be described with reference to FIG. 4.

[0072]In the ebullient cooling device 20 of the first exemplary embodiment described above, the heat receiving member 26 is constituted by a plurality of columnar pin fins with their surfaces roughened being provided on the heat receiving plate 22 on which the heat generating body 10 is arranged. The heat receiving member 26 may also be constituted with rectangular fins 30 in which a plurality of cuboid members are arranged at a fixed interval as shown in FIG. 4.

[0073]In the heat receiving member 26 that is constituted with this rectangular fin, it is constituted with cuboid members that have their surfaces roughened, and overall is formed in a comb-like shape.

[0074]Although the greater the surface area of the heat receiving member 26 that is in contact with the coolant C, the better, the surface area in contact with the liquid coolant C and the boiling performance are not ...

third exemplary embodiment

[0075]Next, a third exemplary embodiment of the present invention shall be described with reference to FIG. 5.

[0076]In the ebullient cooling device 20 of the first exemplary embodiment, a plurality of columnar pin fins with their surfaces roughed are made to serve as heat receiving member 26 on the heat receiving plate 22 on which the heat generating body 10 is arranged. The heat receiving member 26 may also be constituted with a cuboid-shaped heat dissipating block 31 that has its surfaces roughened as shown in FIG. 5.

[0077]Even if this heat receiving member 26 is formed in a block shape, there is no significant drop in the boiling performance.

[0078]When considering the productivity, a block shape is easier to manufacture than a pin fin or rectangular fin, and so is advantageous in terms of manufacturing. This heat receiving member 26 may be manufactured integrally with the heat receiving plate 22 by machining or forging. Alternatively, a block that is separately fabricated may be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink.

Description

TECHNICAL FIELD[0001]The present invention relates to an ebullient cooling device that, in an electronic device in which an LSI or IC is mounted, in particular suppresses heat generation of the LSI or IC by utilizing the phase change phenomenon of a coolant that is boiled and liquefied.BACKGROUND ART[0002]In an LSI and IC to be used in an electronic device such as a computer or the like, circuit integration is increasing in an accelerated manner in each circuit generation. Moreover, in recent years, demands for a reduction in size and thickness of devices are increasing. For this reason, the heat generation density of LSIs and ICs is on track to keep increasing from now on. In order to operate these LSIs and ICs at a high speed and in a stable manner, it is necessary to control the operating temperature so as to be a given temperature or less. A cooling method compatible with the amount of heat of the LSI or IC is therefore employed. However, when attempting to reduce the size and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F28D15/02
CPCF28D15/0233F28D15/0283H01L23/427F28F13/187H01L2924/0002H01L2924/00
InventorMATSUNAGA, ARIHIROYOSHIKAWA, MINORUSAKAMOTO, HITOSHI
OwnerNEC CORP