Microelectronic Assembly With Thermally and Electrically Conductive Underfill

a microelectronic and underfill technology, applied in the field of microelectronic assembly packaging, can solve the problems of decreasing the number of thermal paths in the microelectronic package over which the heat generated may be transferred for dissipation, such as through heat sinks at the circuit board

Inactive Publication Date: 2015-01-15
INVENSAS CORP
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution effectively manages heat dissipation and minimizes electrical interference, improving the reliability and performance of microelectronic devices by providing a robust thermal path and maintaining electrical insulation.

Problems solved by technology

However, with the microelectronic packages used in electronic devices becoming smaller and smaller, the number of thermal paths existing in the microelectronic packages over which the heat generated may be transferred for dissipation, such as through heat sinks at the circuit board, is decreasing.
The smaller pitches may, in turn, result in increased electrical interference between electrical paths extending from the chip to another element adjacent to and electrically connected with the chip, which may impact operation of an electronic device including such chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microelectronic Assembly With Thermally and Electrically Conductive Underfill
  • Microelectronic Assembly With Thermally and Electrically Conductive Underfill
  • Microelectronic Assembly With Thermally and Electrically Conductive Underfill

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018]A microelectronic assembly 10 including a microelectronic element 12, such as a semiconductor chip, joined with another element 14, such as a substrate consisting essentially of dielectric or semiconductor material, or another microelectronic element, may be fabricated in accordance with an embodiment of the disclosure, as shown in FIGS. 1-4. The elements 12 or 14 may be an unpackaged or packaged semiconductor chip, and such semiconductor chip may embody a plurality of active devices (e.g., transistors, diodes, etc.), a plurality of passive devices (e.g., resistors, capacitors, inductors, etc.), or both active devices and passive devices. In a particular embodiment, the semiconductor chip may be configured to have a predominant function as a logic chip, e.g., a programmable general or special purpose processor, a microcontroller, a field programmable gate array (“FPGA”) device, an application specific integrated circuit (“ASIC”), a digital signal processor, among others. In su...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A microelectronic assembly may include a microelectronic element having a surface and a plurality of contacts at the surface; a first element consisting essentially of at least one of semiconductor or dielectric material, the first element having a surface facing the surface of the microelectronic element and a plurality of first element contacts at the surface of the first element; electrically conductive masses each joining a contact of the plurality of contacts of the microelectronic element with a respective first element contact of the plurality of first element contacts; a thermally and electrically conductive material layer between the surface of the microelectronic element and the surface of the first element and adjacent conductive masses of the conductive masses; and an electrically insulating coating electrically insulating the conductive masses and the surfaces of the microelectronic element and the first element from the thermally and electrically conductive material layer

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a divisional of U.S. Application Ser. No. 13 / 672,750 filed Nov. 9, 2012, the disclosure of which is incorporated by reference herein.FIELD OF THE INVENTION[0002]The present invention relates to microelectronic assemblies and, in particular, packaging of a microelectronic assembly.BACKGROUND OF THE INVENTION[0003]Microelectronic elements such as semiconductor chips commonly are provided with elements which protect the microelectronic element and facilitate its connection to other elements of a larger circuit. For example, a semiconductor chip typically is provided as a small, flat element having oppositely facing front and rear surfaces and contacts at the front surface. The contacts are electrically connected to the numerous electronic circuit elements formed integrally within the chip.[0004]Advances in semiconductor chip design and manufacture have led to semiconductor chips having higher densities and larger numbers o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L23/00H01L21/56
CPCH01L2924/1434H01L2924/186H01L2224/81447H01L2924/1433H01L2924/20106H01L2924/01013H01L2924/1304H01L21/56H01L2224/13082H01L2924/14H01L2224/32225H01L2224/83104H01L24/83H01L2224/2929H01L2924/01079H01L24/27H01L2924/12H01L2924/2064H01L2924/15151H01L2224/83192H01L2924/01028H01L23/295H01L23/3128H01L23/3135H01L23/3185H01L23/3737H01L21/563H01L23/552H01L24/13H01L24/14H01L24/16H01L24/29H01L24/32H01L24/73H01L24/81H01L24/92H01L25/0657H01L2224/0401H01L2224/05571H01L2224/05624H01L2224/05647H01L2224/131H01L2224/1403H01L2224/14051H01L2224/16145H01L2224/16227H01L2224/29339H01L2224/32145H01L2224/73204H01L2224/81191H01L2224/81207H01L2224/81444H01L2224/81455H01L2224/81805H01L2224/8192H01L2224/05568H01L2224/16225H01L2924/01322H01L23/49816H01L23/49827H01L2225/06513H01L2225/06541H01L2225/06565H01L2924/00014H01L2924/12042H01L2924/0665H01L2224/81801H01L2924/014H01L2924/00H01L2224/05552H01L23/498
InventorHABA, BELGACEMMCELREA, SIMON
OwnerINVENSAS CORP