Keyed wafer carrier

a keyed wafer and carrier technology, applied in the direction of coatings, metallic material coating processes, chemical vapor deposition coatings, etc., can solve the problems of difficult design of the components of a cvd reactor, unsatisfactory variations in the properties of the resulting semiconductor devices,

Inactive Publication Date: 2017-07-06
VEECO INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides keyed wafer carrier systems and methods that offer several advantages over conventional rotating disc reactor systems and methods.

Problems solved by technology

Minor variations in composition of the reactive gases and in the temperature of the wafer surfaces cause undesired variations in the properties of the resulting semiconductor devices.
Design of the components of a CVD reactor can be difficult.

Method used

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  • Keyed wafer carrier
  • Keyed wafer carrier
  • Keyed wafer carrier

Examples

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Embodiment Construction

[0047]Referring to FIG. 1, the chemical vapor deposition apparatus 10 in accordance with one embodiment of the invention includes a reaction chamber 12 having a gas inlet manifold 14 arranged at one end of the chamber 12. The end of the chamber 12 having the gas inlet manifold 14 is referred to herein as the “top” end of the chamber 12. This end of the chamber typically, but not necessarily, is disposed at the top of the chamber in the normal gravitational frame of reference. Thus, the downward direction as used herein refers to the direction away from the gas inlet manifold 14; whereas the upward direction refers to the direction within the chamber, toward the gas inlet manifold 14, regardless of whether these directions are aligned with the gravitational upward and downward directions. Similarly, the “top” and “bottom” surfaces of elements are described herein with reference to the frame of reference of chamber 12 and manifold 14.

[0048]The chamber 12 has a cylindrical wall 20 that...

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Abstract

A structure for a chemical vapor deposition reactor desirably includes a reaction chamber having an interior, a spindle mounted in the reaction chamber, and a wafer carrier releasably mounted onto the spindle for rotation therewith. The spindle desirably has a shaft extending along a vertical rotational axis and a key projecting outwardly from the shaft. The wafer carrier preferably has a body defining oppositely-facing top and bottom surfaces and at least one wafer-holding feature configured so that a wafer can be held therein with a surface of the wafer exposed at the top surface of the body. The wafer carrier desirably further has a recess extending into the body from the bottom surface of the body and a keyway projecting outwardly from a periphery of the recess along a first transverse axis. The shaft preferably is engaged in the recess and the key preferably is engaged into the keyway.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a divisional of U.S. application Ser. No. 13 / 424,821, filed on Mar. 20, 2012, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]The present invention relates to wafer processing apparatus, to wafer carriers for use in such processing apparatus, and to methods of wafer processing.[0003]Many semiconductor devices are formed by processes performed on a substrate. The substrate typically is a slab of a crystalline material, commonly referred to as a “wafer.” Typically, a wafer is formed by growing a large crystal and slicing the crystal into the shape of a disc. One common process performed on such a wafer is epitaxial growth.[0004]For example, devices formed from compound semiconductors such as III-V semiconductors typically are formed by growing successive layers of the compound semiconductor using metal organic chemical vapor deposition or “MOCVD.” In this process, the wafers ar...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): C23C16/458H01L21/687C23C16/46
CPCC23C16/4584C23C16/4586H01L21/68771H01L21/68764H01L21/68792C23C16/46H01L21/6719
InventorKRISHNAN, SANDEEPMOY, KENGGURARY, ALEXKING, MATTHEWBOGUSLAVSKIY, VADIMKROMMENHOEK, STEVEN
OwnerVEECO INSTR