Microchip with Cap Layer for Redistribution Circuitry and Method of Manufacturing the Same
a technology of microchips and capacitor layers, applied in the direction of semiconductor devices, semiconductor/solid-state device details, electrical devices, etc., can solve the problems of premature failure of microchips b>100/b>a, particularly problematic close-oriented elements, and short circuits between, so as to prevent the migration of conductive materials
Active Publication Date: 2018-03-22
OMNIVISION TECH INC
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Benefits of technology
The present invention provides a microchip that can withstand extreme temperatures and humidity. It achieves this by using isolation layers that improve adhesion around the redistribution circuitry, which prevents metal migration and short circuits. Another microchip has a substrate and a redistribution layer with first and second sets of electrical contacts. It also has conductive material for redistribution conductors and means for isolating them to prevent migration of the conductive material between adjacent ones.
Problems solved by technology
Such closely-oriented elements are particularly problematic because a key-hole has formed in solder mask layer 220.
Such non-uniformity can cause premature failure of microchip 100A.
However, the structure shown in FIG. 3B has been found to result in short circuits between the conductors 210 of the redistribution layer 222 and premature device failures, especially when microchip 100B is exposed to environments with extreme temperatures and humidity (e.g., during temperature-humidity bias (THB) testing, etc.).
Method used
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Embodiment Construction
[0030]The present invention overcomes the problems associated with the prior art, by providing a microchip that is reliable when exposed to extreme temperature and high humidity. In the following description, numerous specific details are set forth (e.g., particular materials, structures, etc.) in order to provide a thorough understanding of the invention. Those skilled in the art will recognize, however, that the invention may be practiced apart from these specific details. In other instances, details of well-known microchip fabrication practices (e.g., formation of integrated circuitry, routine optimization, etc.) and components have been omitted, so as not to unnecessarily obscure the present invention.
[0031]FIG. 4 shows a cross-section of microchip 100B. The inventors have determined that microchip 100B is unreliable in high temperature and humid environments, because the conductive material (e.g., metal) from which the conductors 210 of the redistribution layer 222 are formed m...
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A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.
Description
BACKGROUND OF THE INVENTIONField of the Invention[0001]This invention relates generally to microchip fabrication, and more particularly to preventing electrical shorts in the redistribution layer (RDL) circuitry of microchips.Description of the Background Art[0002]FIG. 1 shows a microchip 100 mounted on a printed circuit board (PCB) 102. Such microchip-PCB assemblies are used in a wide variety of electronic devices (e.g., digital cameras, computers, etc.). PCB 102 includes a plurality of conductive traces 104 and a plurality of solder pads 106 that electrically interconnect the electronic components (e.g., microchip 100, passive components 108, other active components 110, etc.) mounted thereon. Conductive traces 104 interconnect different regions of PCB 102, and solder pads 106 facilitate electrical connections (e.g., by soldering) with complementary electrical terminals on the electronic components mounted on PCB 102. The layout and circuitry of PCB 102 are not particularly releva...
Claims
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IPC IPC(8): H01L23/498H01L21/56H01L23/00H01L21/02H01L23/31
CPCH01L23/49838H01L21/56H01L24/06H01L2224/0401H01L21/02274H01L23/3171H01L24/03H01L23/5283H01L23/5329H01L2224/131H01L2224/13022H01L24/13H01L24/02H01L2224/0233H01L2224/02331H01L2224/024H01L2224/0239H01L2224/16227H01L2224/81815H01L24/16H01L24/81H01L2224/0346H01L2224/03452H01L2224/0391H01L2224/05647H01L2224/05655H01L2224/05548H01L24/05H01L2924/014H01L2924/00012H01L2924/01029H01L2924/01028H01L2924/00014
InventorLEE, CHI-KUEICHUNG, YINGKUO, YING-CHIHLIN, WEI-FENG
OwnerOMNIVISION TECH INC