CoNiCrCu solid solution for heterogeneous interface bonding and preparation method and application thereof

A heterogeneous interface and solid solution technology, applied in the direction of additive processing, etc., can solve the problems of reducing joint strength, reducing welded joint performance, affecting the strength of steel-aluminum dissimilar metal connection materials, etc., to achieve high connection interface strength and hardness, The effect of reducing the residual stress level and relieving the thermal expansion coefficient

CN111647791AInactive Publication Date: 2020-09-11SUZHOU UNIV
5 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2020-09-11
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a CoNiCrCu solid solution for heterogeneous interface bonding and a preparation method and application thereof. The CoNiCrCu solid solution comprises, by weight, 20-30% of cobalt, 17-27% of chromium, 20-30% of nickel and the balance copper. The CoNiCrCu solid solution is used as a raw material, a laser additive manufacturing or fusion welding means is adopted, a gradient material is synthesized, the difference of the thermal expansion coefficient, the melting point, the elasticity modulus and the like of a heterogeneous interface can be effectively relieved, the residual stress level at the heterogeneous interface in the additive manufacturing process can be reduced, hard and brittle phases are prevented from being separated out, the manufacturing requirement for heterogeneous component bonding can be met, and a high-strength bonding interface is manufactured. The CoNiCrCu solid solution is used for connecting heterogeneous materials, can have high connecting interface strength and hardness and can be widely applied to bonding of steel-aluminum, steel-tungsten or steel-copper and other heterogeneous components.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a CoNiCrCu solid solution for heterogeneous interface bonding, and a preparation method and application of the CoNiCrCu solid solution. Background technique

[0002] With the development of science and technology and the rapid advancement of industry, people have higher and higher requirements for materials. The performance of a single material can no longer meet the requirements of technological development. The composite application of multiple materials has become the trend of the times. The composite of different materials The application can not only achieve higher performance, but also save material cost.

[0003] However, dissimilar materials have many problems in joining due to their different physical properties. Taking the connection of steel-aluminum dissimilar metals as an example, due to the large difference in atomic radius between aluminum and iron, the difference in atomic valence and electronegativity, and the...

Examples

preparation example Construction

[0045] The present invention also provides a method for preparing the above-mentioned CoNiCrCu solid solution for heterogeneous interface bonding, which specifically includes the following process steps:

[0046] (1) Ingredients:

[0047] Metal cobalt, metal chromium, metal nickel, and metal copper are used as raw materials, and are prepared according to the target composition;

[0048] (2) Melting:

[0049] Add the prepared metal cobalt, metal chromium, metal nickel, and metal copper into the intermediate frequency induction furnace, and heat it to melt it. In this smelting step, a small amount of formulated metal cobalt, metal chromium, metal nickel, and metal copper ingredients are added into the intermediate frequency induction furnace for smelting first, and then the remaining ingredients are added to the molten alloy solution as supplementary materials. When feeding the feeding material, the temperature in the medium frequency induction furnace is controlled at 1500°C ...

Embodiment 1

[0061] The ingredients are prepared according to the following proportions, in terms of weight percentage, including: 25% cobalt, 22% chromium, 25% nickel, and 28% copper. Add the prepared metal cobalt, metal chromium, metal nickel, and metal copper into the intermediate frequency induction furnace, and heat it to melt it. The temperature in the intermediate frequency induction furnace is controlled at about 1520°C. After the ingredients are adjusted to pass before the furnace, it is released from the furnace, and the temperature of the furnace is 1460°C.

[0062] The alloy melt is atomized to prepare alloy powder, the atomization medium is argon, and the atomization pressure is 4MPa. A far-infrared dryer is used to dry the atomized alloy powder, and the drying temperature is 210°C. Then the particle size range of 100 is sieved by the sieving machine ~ 350 mesh powder is used as finished powder. The finished powder is directly used as a powdery CoNiCrCu solid solution, and ...

Embodiment 2

[0079] The ingredients are prepared according to the following proportions, in terms of weight percentage, including: 30% cobalt, 27% chromium, 30% nickel and 13% copper. Add the prepared metal cobalt, metal chromium, metal nickel, and metal copper into the intermediate frequency induction furnace, and heat it to melt it. The temperature in the intermediate frequency induction furnace is controlled at about 1520°C. After the ingredients are adjusted to pass before the furnace, it is released from the furnace, and the temperature of the furnace is 1460°C.

[0080] The alloy melt is atomized to prepare alloy powder, the atomization medium is argon, and the atomization pressure is 4MPa. A far-infrared dryer is used to dry the atomized alloy powder, and the drying temperature is 210°C. Then the particle size range of 100 is sieved by the sieving machine ~ 350 mesh powder is used as finished powder. The finished powder is directly used as a powdery CoNiCrCu solid solution, and u...