Clamping device

Abstract

The present application discloses a clamping device for clamping a wafer carrier; the clamping device includes a base, a clamping assembly, a driving assembly, a guide mechanism and a baffle assembly; a guide slope is formed on the side of the guide mechanism away from the clamping assembly; the baffle assembly includes a baffle, a connecting mechanism and a guide wheel, the guide slope can abut against the guide wheel and make the guide wheel roll along the guide slope, so that the baffle can be driven by the guide wheel to move to a first position, and when the baffle is in the first position, the baffle covers the opening of the wafer carrier. Through the above arrangement, the protection of the wafer when the wafer carrier is transported can be improved to prevent the wafer from falling from the opening of the wafer carrier.

Description

Technical Field

[0001] The present application relates to the field of wafer carrier handling technology, and in particular to a clamping device. Background Art

[0002] During the semiconductor processing, an overhead crane is needed to clamp the wafer carrier and transport it back and forth between various process machines and the buffer area. The wafer is placed in the wafer carrier. In order to prevent the wafer from moving, bumping, or even falling in the wafer carrier during transportation, causing damage to the wafer, it is required to keep the wafer carrier running smoothly when the overhead crane is transporting the wafer carrier, so as to achieve the purpose of protecting the wafer.

[0003] For an open wafer carrier, there is an opening at one end of the wafer carrier to facilitate the placement and removal of wafers in the wafer carrier. However, the open structure wafer carrier cannot protect the wafer inside from falling, so during the transportation process, the wafer is very likely to fall from the opening, causing damage to the wafer. Summary of the invention

[0004] In order to solve the deficiencies of the prior art, the purpose of the present application is to provide a clamping device, which can improve the protection of wafers and prevent wafers from falling from a wafer carrier.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A clamping device for clamping a wafer carrier; the clamping device comprises a base, a clamping assembly, a driving assembly, a guiding mechanism and a baffle assembly; the clamping assembly is located below the base and is slidably connected to the base, and the clamping assembly is used to clamp the wafer carrier; the driving assembly is fixedly connected to the base and is transmission-connected to the clamping assembly; the guiding mechanism is located on the clamping assembly, and a guiding inclined surface is formed on the side of the guiding mechanism away from the clamping assembly; the baffle assembly is located below the base; the baffle assembly comprises a baffle, a connecting mechanism and a guide wheel, the connecting mechanism is at least partially located above the baffle, the connecting mechanism is respectively connected to the base and the baffle, and the guide wheel is rotationally connected to the baffle; the connecting mechanism has multiple degrees of freedom of movement, and in the process of the clamping assembly clamping the wafer carrier, the clamping assembly drives the guiding mechanism to move, the guiding inclined surface can abut against the guide wheel and make the guide wheel roll along the guiding inclined surface, so that the baffle can be driven by the guide wheel to move to a first position, and when the baffle is in the first position, the baffle covers the opening of the wafer carrier.

[0007] Furthermore, the connecting mechanism includes a fixed rod and a connecting rod, the upper end of the fixed rod is fixedly connected to the base, and the two ends of the connecting rod are rotatably connected to the lower end of the fixed rod and the baffle respectively.

[0008] Furthermore, the fixing rod is made of metal material, and a magnetic part is provided on the side of the baffle close to the fixing rod. When the baffle is in the second position, the magnetic part can make the baffle close to the fixing rod or abut against the fixing rod; when the baffle is in the second position, the guide wheel is separated from the guide inclined surface, the clamping assembly does not clamp the wafer carrier, and there is a gap between the baffle and the opening of the wafer carrier.

[0009] Furthermore, the clamping assembly includes a first clamping mechanism and a second clamping mechanism, and the first clamping mechanism and the second clamping mechanism are arranged in a mirror-symmetrical manner, and the structures of the first clamping mechanism and the second clamping mechanism are consistent. Under the drive of the driving assembly, the first clamping mechanism and the second clamping mechanism can move toward each other to a clamping state or move away from each other to a separated state. When the first clamping mechanism and the second clamping mechanism are in the clamping state, the baffle is in the first position. When the first clamping mechanism and the second clamping mechanism are in the separated state, the clamping assembly does not clamp the wafer carrier.

[0010] Furthermore, two guide mechanisms are provided, and the two guide mechanisms are respectively located on the first clamping mechanism and the second clamping mechanism, and the guide inclined surfaces of the two guide mechanisms are arranged oppositely; two guide wheels are provided, and each guide wheel is matched with a guide inclined surface.

[0011] Furthermore, the first clamping mechanism includes a first clamping member for clamping the wafer carrier and a slider connected to the first clamping member. A linear slide rail is arranged below the base, and the slider is slidably connected to the linear slide rail.

[0012] Furthermore, the first clamping member includes a moving part extending in the vertical direction and a first clamping part extending in the horizontal direction, the moving part is fixedly connected to the slider, and the first clamping part is used to clamp the wafer carrier; the first clamping part and the moving part are integrally formed; and the guide mechanism is located on the moving part.

[0013] Furthermore, the driving assembly includes a driving motor, a screw rod and a nut. The nut is located on the moving part and fixedly connected to the moving part. The nut is also sleeved on the screw rod and transmission connected to the screw rod. One end of the screw rod is transmission connected to the driving motor, and the other end of the screw rod is rotationally connected to the base. The driving motor is also fixedly connected to the base.

[0014] Furthermore, the first clamping mechanism also includes a second clamping member, which is located on the first clamping member and fixedly connected to the first clamping member, and the second clamping member includes a second clamping portion extending in a horizontal direction, and the length of the second clamping portion extending toward the second clamping mechanism is greater than the length of the first clamping portion extending toward the second clamping mechanism.

[0015] Furthermore, the baffle is provided with an avoidance groove for avoiding the guide mechanism, and the avoidance groove is located below the guide wheel.

[0016] In the present application, the clamping assembly is driven to move by the driving assembly so that the clamping assembly clamps the wafer carrier to facilitate the transportation of the wafer carrier. At the same time, the baffle assembly can cover the opening of the wafer carrier with a baffle, thereby playing a role in blocking the opening of the wafer carrier. Therefore, during the transportation of the wafer carrier, it can prevent the wafer from falling from the opening of the wafer carrier, thereby improving the protection effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the combination of the clamping device and the wafer carrier of the present application;

[0018] Figure 2 This is a schematic diagram of the overall structure of the clamping device of the present application;

[0019] Figure 3 This is a schematic diagram of the structure of the baffle assembly of the clamping device of the present application;

[0020] Figure 4 It is a schematic diagram of the state when the clamping device and the wafer carrier of the present application are in the first position;

[0021] Figure 5 This is a schematic diagram of the clamping device of the present application in a first position;

[0022] Figure 6 This is a schematic diagram of the structure of the connection mechanism of the clamping device of the present application;

[0023] Figure 7 It is a schematic diagram of the state when the clamping device and the wafer carrier of the present application are in the second position;

[0024] Figure 8 This is a schematic diagram of the clamping device of the present application in the second position;

[0025] Fig. 9 This is a schematic diagram of the structure of the clamping assembly of the clamping device of the present application;

[0026] Fig.10 It is a schematic diagram of the structure of the wafer carrier of the present application. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0028] It should be noted that the terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantitative limit, but indicate that there is at least one. "Multiple" or "several" means at least two. Unless otherwise specified, words such as "front", "rear", "lower" and / or "upper" are only for the convenience of explanation and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect. The singular forms "a", "said" and "the" used in this specification and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0029] like Figure 1 As shown, a clamping device 100 is used to clamp a wafer carrier 200. In some embodiments, the clamping device 100 is connected to a crane (not shown) through a flexible connection structure such as a lifting belt, and the clamping device 100 is driven by the crane to move, thereby driving the wafer carrier 200 to move, thereby realizing the function of transporting the wafer carrier 200. In the present application, the clamping device 100 and the crane are connected by a lifting belt transmission as an example. In some embodiments, the inner wall of the wafer carrier 200 is provided with a card slot 21 extending in the left and right directions, and the wafer is inserted into the card slot 21 to achieve connection with the wafer carrier 200, so that when the clamping device 100 transports the wafer carrier 200, the clamping device 100 can drive the wafer to move. In some embodiments, the wafer carrier 200 is provided with an opening 22, and the wafer is installed in the wafer carrier 200 or removed from the wafer carrier 200 through the opening 22.

[0030] In order to clearly explain the technical solution of this application, the following is also defined: Figure 1 Front, back, left, right, up and down as shown.

[0031] like Figure 1 , Figure 2 and Figure 3 As shown, as an embodiment, the clamping device 100 includes a base 11, a clamping assembly 12, a driving assembly 13, a guide mechanism 14 and a baffle assembly 15. The clamping assembly 12 is located below the base 11 and is slidably connected to the base 11. The clamping assembly 12 is used to clamp the wafer carrier 200. In some embodiments, the base 11 is connected to the overhead crane through a lifting belt transmission, so that the overhead crane can drive the base 11 to move along the front and rear directions and the left and right directions of the clamping device 100. The lifting belt drives the base 11 to move along the up and down directions of the clamping device 100. Through the above arrangement, the overhead crane can drive the clamping assembly 12 and the wafer carrier 200 to move, so as to achieve the purpose of transporting wafers. The driving assembly 13 is fixedly connected to the base 11 and is in transmission connection with the clamping assembly 12. The clamping assembly 12 is driven to move by the driving assembly 13, so that the clamping assembly 12 can clamp the wafer carrier 200, so as to facilitate the overhead crane to transport the wafer carrier 200. In the present application, the driving component 13 drives the clamping component 12 to move in the left-right direction. The opening 22 is arranged at the rear of the wafer carrier 200 along the front-back direction of the clamping device 100, so that the clamping component 12 will not interfere with the opening 22 of the wafer carrier 200. The guide mechanism 14 is located on the clamping component 12, so that the guide mechanism 14 moves with the clamping component 12, and a guide slope 141 is formed on the side of the guide mechanism 14 away from the clamping component 12. The baffle assembly 15 is located below the base 11. The driving component 13 drives the clamping component 12 to move in the left-right direction, thereby driving the guide mechanism 14 to move in the left-right direction. The guide slope 141 on the guide mechanism 14 can cooperate with the baffle assembly 15, and the baffle assembly 15 can be moved to a position that fits or is close to the opening 22 through the guide slope 141. When the baffle assembly 15 moves to a position that is in contact with or close to the opening 22, the baffle assembly 15 covers the opening 22 of the wafer carrier 200, so that the opening 22 of the wafer carrier 200 can be blocked by the baffle assembly 15, thereby preventing the wafer from falling from the opening 22 of the wafer carrier 200 during the transportation of the wafer carrier 200, thereby improving the protectiveness of the wafer carrier 200 to the wafer.

[0032] Specifically, the baffle assembly 15 includes a baffle 151, a connecting mechanism 152 and a guide wheel 153. The connecting mechanism 152 is at least partially located above the baffle 151, and the connecting mechanism 152 is connected to the base 11 and the baffle 151 respectively, so that the baffle 151 can be connected to the base 11 through the connecting mechanism 152. At the same time, the guide wheel 153 is rotatably connected to the baffle 151. The central axis of the guide wheel 153 extends along the front-to-back direction of the clamping device 100, so that the guide wheel 153 can roll in coordination with the guide inclined surface 141 moving along the left-right direction.

[0033] More specifically, the connecting mechanism 152 has multiple degrees of freedom of movement. The connecting mechanism 152 can enable the guide mechanism 14 to drive the guide wheel 153 and the baffle 151 to move relative to the base 11, so that the guide wheel 153 and the baffle 151 have the freedom of movement relative to the base 11. In the process of the clamping assembly 12 clamping the wafer carrier 200, the clamping assembly 12 drives the guide mechanism 14 to move. In some embodiments, in the process of the clamping assembly 12 driving the guide mechanism 14 to clamp the wafer carrier 200, the guide slope 141 can abut against the guide wheel 153 and make the guide wheel 153 roll along the guide slope 141. When the guide slope 141 abuts against the guide wheel 153, the guide slope 141 can support the guide wheel 153. In some embodiments, the height of the guide slope 141 at one end away from the wafer carrier 200 is higher than the height of the end close to the wafer carrier 200, that is, the guide slope 141 extends in an oblique downward direction from the end away from the wafer carrier 200 to the end close to the wafer carrier 200, so that when the guide slope 141 moves toward the wafer carrier 200 along the left and right direction, the guide slope 141 can drive the guide wheel 153 to move upward.

[0034] like Figure 4 and Figure 5 As shown, in the process of the guide wheel 153 moving upward, the connection mechanism 152 is provided to enable the baffle 151 and the guide wheel 153 to move upward and forward at the same time, so that the baffle 151 can move toward the opening 22, and then the baffle 151 can move to the first position. When the baffle 151 is in the first position, the baffle 151 covers the opening 22 of the wafer carrier 200, so that the baffle 151 blocks the opening 22 of the wafer carrier 200, and the wafer can be prevented from falling from the opening 22 of the wafer carrier 200, thereby improving the protection of the clamping device 100 to the wafer. At the same time, when the baffle 151 moves to the first position, the movement of the baffle 151 is realized only by the guide mechanism 14, without relying on an external drive to drive the baffle 151 to move, thereby simplifying the structure of the clamping device 100. In addition, not relying on an external driving component can reduce the energy consumption of the clamping device 100 , and the baffle 151 is only driven by the guide mechanism 14 , which can improve the movement consistency of the baffle 151 and the guide mechanism 14 , which is beneficial for the baffle 151 to better cover the opening 22 .

[0035] In the present application, the first position refers to the position of the baffle plate 151 when the baffle plate 151 covers the opening 22 of the wafer carrier 200 .

[0036] like Figure 1 , Figure 2 and Figure 6As shown, as an embodiment, the connecting mechanism 152 includes a fixing rod 1521 and a connecting rod 1522. The upper end of the fixing rod 1521 is fixedly connected to the base 11. In some embodiments, the upper end of the fixing rod 1521 is fixed to the base 11 by a screw, and the fixing rod 1521 extends along the up and down direction of the clamping device 100. The two ends of the connecting rod 1522 are rotatably connected to the lower end of the fixing rod 1521 and the baffle 151, respectively. In some embodiments, the plane of rotational movement of the connecting rod 1522 is perpendicular to the left and right direction of the clamping device 100. Through the cooperation of the fixing rod 1521 and the connecting rod 1522, the baffle 151 can have a degree of freedom of movement relative to the base 11, which is conducive to the baffle 151 being able to move smoothly to the first position.

[0037] Specifically, when the clamping assembly 12 drives the guide mechanism 14 to move in the left-right direction to clamp the wafer carrier 200, the guide slope 141 abuts against the guide wheel 153, and the movement of the guide slope 141 drives the guide wheel 153 to roll. At the same time, the guide slope 141 supports the guide wheel 153, so that the guide slope 141 drives the guide wheel 153 to drive the baffle 151 to move upward. In addition, through the limit of the baffle 151 by the connecting rod 1522, during the process of the baffle 151 moving upward, the baffle 151 can be driven to move toward the opening 22, so that the baffle 151 moves to the first position, and then the baffle 151 covers the opening 22 of the wafer carrier 200, so as to achieve the effect of blocking the opening 22 of the wafer carrier 200.

[0038] Furthermore, a first connecting groove 1521a is provided at one end of the fixing rod 1521 away from the base 11, a connecting ear 1511 is provided on the baffle 151, and a second connecting groove 1511a is provided on the connecting ear 1511. Both ends of the connecting rod 1522 are respectively installed in the first connecting groove 1521a and the second connecting groove 1511a, and both ends of the connecting rod 1522 are rotatably connected to the first connecting groove 1521a and the second connecting groove 1511a through a pin shaft, thereby realizing the rotatable connection between the connecting rod 1522 and the fixing rod 1521 and the baffle 151.

[0039] Furthermore, in some embodiments, the number of connecting rods 1522 and the number of first connecting grooves 1521a and second connecting grooves 1511a are all two. The arrangement of the two connecting rods 1522 can improve the movement stability of the baffle 151 when the guide mechanism 14 drives the baffle 151 to move, thereby avoiding the shaking of the baffle 151 and facilitating the baffle 151 to cover the opening 22 of the wafer carrier 200.

[0040] It should be noted that the first connecting groove 1521a, the second connecting groove 1511a and the pin are only a rotational connection method of the connecting rod 1522, the fixing rod 1521 and the baffle 151, and the present application does not limit the rotational connection method of the connecting rod 1522. At the same time, the present application does not limit the number of the connecting rod 1522, the first connecting groove 1521a and the second connecting groove 1511a.

[0041] like Figure 6 , Figure 7 and Figure 8 As shown, as an embodiment, the fixing rod 1521 is made of metal material, and a magnetic member 1512 is provided on the side of the baffle 151 close to the fixing rod 1521. When the baffle 151 is in the second position, the magnetic member 1512 can make the baffle 151 close to the fixing rod 1521 or abut against the fixing rod 1521. In the present application, the second position refers to the position of the baffle 151 when the baffle 151 is separated from the opening 22 of the wafer carrier 200. In some embodiments, the fixing rod 1521 is an iron rod, and the magnetic member 1512 is a magnet. The baffle 151 can be close to the fixing rod 1521 or abut against the fixing rod 1521 through the attraction of the iron rod and the magnet.

[0042] Specifically, when the baffle 151 is in the second position, the guide wheel 153 is separated from the guide slope 141. At this time, the guide slope 141 no longer supports the guide wheel 153, and the baffle 151 falls downward only under the influence of its own gravity, so that the baffle 151 is separated from the opening 22 of the wafer carrier 200. At the same time, the magnetic member 1512 on the baffle 151 and the fixed rod 1521 of the metal material can attract each other, so that when the baffle 151 falls to the second position, the baffle 151 can approach the fixed rod 1521 or abut against the fixed rod 1521, thereby limiting the falling position of the baffle 151, which is conducive to stabilizing the relative position of the baffle 151 and the fixed rod 1521. When the baffle 151 is in the second position, the baffle 151 is only affected by its own gravity and the attraction between the magnetic member 1512 and the fixed rod 1521, and no external driving member is required to drive the baffle 151 to move, thereby simplifying the structure of the clamping device 100. Furthermore, the attraction generated by the magnetic member 1512 can stabilize the position of the baffle 151. When the overhead crane drives the clamping device 100 to shake, the magnetic member 1512 can attract the baffle 151 to avoid shaking of the baffle 151, so that the baffle 151 will not collide with the wafer carrier 200 or other parts of the clamping device 100, thereby improving the service life of the clamping device 100. At the same time, by stabilizing the position of the baffle 151, it is possible to avoid collision between the baffle 151 and the wafer when the lifting belt lifts the clamping device 100, thereby improving the protection of the wafer.

[0043] Furthermore, when the baffle 151 is in the second position, the clamping assembly 12 does not clamp the wafer carrier 200, and there is a gap between the baffle 151 and the opening 22 of the wafer carrier 200, that is, at this time, the baffle 151 does not cover the opening 22 of the wafer carrier 200. When the overhead crane controls the clamping device 100 to move downward, since there is a gap between the baffle 151 and the opening 22 of the wafer carrier 200, the baffle 151 can be prevented from interfering with the wafer carrier 200 during the process of the overhead crane controlling the baffle 151 to move downward, so that the baffle 151 can be smoothly moved to the rear of the opening 22 of the wafer carrier 200, and will not affect the normal operation of the clamping device 100 when clamping the wafer carrier 200.

[0044] like Figure 2 and Fig. 9 As shown, as an embodiment, the clamping assembly 12 includes a first clamping mechanism 121 and a second clamping mechanism 122, the first clamping mechanism 121 and the second clamping mechanism 122 are arranged in mirror symmetry, and the structures of the first clamping mechanism 121 and the second clamping mechanism 122 are consistent. In some embodiments, the first clamping mechanism 121 and the second clamping mechanism 122 are arranged along the left and right directions of the clamping device 100. Under the drive of the driving assembly 13, the first clamping mechanism 121 and the second clamping mechanism 122 can move toward each other to a clamping state or move away from each other to a separated state. When the first clamping mechanism 121 and the second clamping mechanism 122 are in a clamping state, the baffle 151 is in a first position, and when the first clamping mechanism 121 and the second clamping mechanism 122 are in a separated state, the clamping assembly 12 does not clamp the wafer carrier 200, and the baffle 151 is in a second position. In the present application, the driving assembly 13 drives the first clamping mechanism 121 and the second clamping mechanism 122 to move toward each other or away from each other along the left and right directions. The clamping state refers to the state in which the first clamping mechanism 121 and the second clamping mechanism 122 clamp the wafer carrier 200. Meanwhile, the separation state refers to the state in which the first clamping mechanism 121 and the second clamping mechanism 122 no longer clamp the wafer carrier 200, that is, the first clamping mechanism 121 and the second clamping mechanism 122 are separated from the wafer carrier 200. Optionally, the first clamping mechanism 121 and the second clamping mechanism 122 are both provided with a guide mechanism 14, so that the guide mechanism 14 can simultaneously guide the movement of the left and right sides of the baffle 151, so that the movement of the baffle 151 is more stable.

[0045] Specifically, two guide mechanisms 14 are provided, and the two guide mechanisms 14 are respectively located on the first clamping mechanism 121 and the second clamping mechanism 122, and the guide slopes 141 of the two guide mechanisms 14 are arranged opposite to each other. At the same time, two guide wheels 153 are provided, and each guide wheel 153 is matched with one guide slope 141. In some embodiments, the guide wheels 153 are arranged on both sides of the baffle 151 along the left and right directions of the clamping device 100. When the two guide slopes 141 drive the corresponding guide wheels 153 to move, the left and right sides of the baffle 151 can be supported and guided at the same time, thereby improving the movement stability of the baffle 151 driven by the guide wheels 153, so that the baffle 151 can be stably moved to the first position.

[0046] like Figure 2 , Figure 5 and Figure 6 As shown, when the first clamping mechanism 121 and the second clamping mechanism 122 move toward each other in the left-right direction to a clamping state, the first clamping mechanism 121 and the second clamping mechanism 122 respectively drive the two guide mechanisms 14 to move toward each other, so that the two guide slopes 141 on the two guide mechanisms 14 move to the bottom of the corresponding guide wheels 153 and abut against the corresponding guide wheels 153, so that each guide slope 141 supports the corresponding guide wheel 153. During the movement of the first clamping mechanism 121 and the second clamping mechanism 122, the guide slope 141 can drive the guide wheel 153 to move upward, thereby driving the baffle 151 to move upward, and then the movement of the baffle 151 is limited by the connecting rod 1522, so that the baffle 151 can move to the first position at the opening 22, and then the baffle 151 covers the opening 22 of the wafer carrier 200, thereby blocking the opening 22 of the wafer carrier 200.

[0047] When the first clamping mechanism 121 and the second clamping mechanism 122 move in opposite directions to a separated state, the first clamping mechanism 121 and the second clamping mechanism 122 drive the two guide mechanisms 14 to move in opposite directions, and the two guide slopes 141 on the two guide mechanisms 14 no longer abut against the corresponding guide wheels 153, so that the guide slopes 141 no longer support the guide wheels 153. At this time, the baffle 151 falls downward to the second position due to its own gravity. In the process of the baffle 151 falling downward, the baffle 151 can be moved backward by the connection rod 1522 to limit the baffle 151, so that the baffle 151 is separated from the opening 22 of the wafer carrier 200. By cooperating with the magnetic member 1512 and the fixing rod 1521, the baffle 151 can be attracted to be close to or abut against the fixing rod 1521, thereby facilitating limiting the position of the baffle 151 and preventing the baffle 151 from shaking, thereby improving the stability of the baffle 151 when in the second position.

[0048] like Figure 1 and Fig. 9 As shown, as an embodiment, the first clamping mechanism 121 includes a first clamping member 1211 for clamping the wafer carrier 200 and a slider 1212 connected to the first clamping member 1211. A linear slide 111 is provided below the base 11, and the slider 1212 is slidably connected to the linear slide 111. When the driving component 13 drives the first clamping component 12 to move, the movement of the first clamping mechanism 121 can be guided and limited by the cooperation of the slider 1212 and the linear slide 111, thereby improving the movement stability of the first clamping mechanism 121. In the present application, the linear slide 111 extends along the left and right directions of the clamping device 100.

[0049] Since the first clamping mechanism 121 and the second clamping mechanism 122 have the same structure, the present application takes the first clamping mechanism 121 as an example for explanation, and the structure of the second clamping mechanism 122 is not described in detail.

[0050] like Fig. 9 and Fig.10 As shown, as an embodiment, the first clamping member 1211 includes a moving portion 1211a extending in a vertical direction and a first clamping portion 1211b extending in a horizontal direction. In the present application, the vertical direction is the up and down direction of the clamping device 100, and the horizontal direction is the left and right direction of the clamping device 100. The moving portion 1211a is fixedly connected to the slider 1212, and the moving portion 1211a is transmission-connected to the driving assembly 13 so that the driving assembly 13 can drive the moving portion 1211a to move along the linear slide rail 111. In some embodiments, the moving portion 1211a is fixedly connected to the slider 1212 by screws to improve the connection stability between the moving portion 1211a and the slider 1212. The first clamping portion 1211b is used to clamp the wafer carrier 200. In some embodiments, the wafer carrier 200 has an extension portion 23, and the first clamping portion 1211b can extend into the extension portion 23 and clamp with the extension portion 23, so that the first clamping portion 1211b clamps the wafer carrier 200. Among them, the first clamping portion 1211b and the moving portion 1211a are integrally formed. In some embodiments, the first clamping portion 1211b and the moving portion 1211a are integrally formed by casting, thereby improving the connection stability of the first clamping portion 1211b and the moving portion 1211a, thereby improving the clamping stability of the first clamping portion 1211b driving the moving portion 1211a to clamp the wafer carrier 200. At the same time, the guide mechanism 14 is located on the moving portion 1211a. In some embodiments, the guide mechanism 14 is fixedly installed on the moving portion 1211a by screws, so that the movement of the moving portion 1211a can drive the guide mechanism 14 to move, thereby driving the baffle 151 to move.

[0051] Furthermore, the first clamping mechanism 121 also includes a second clamping member 1213, which is located on the first clamping member 1211 and fixedly connected to the first clamping member 1211. In some embodiments, the second clamping assembly 12 is fixed to the first clamping member 1211 by screws. The second clamping member 1213 includes a second clamping portion 1213a extending in a horizontal direction. In the present application, the horizontal direction is the left-right direction of the clamping device 100. Among them, the length of the second clamping portion 1213a extending to the second clamping mechanism 122 is greater than the length of the first clamping portion 1211b extending to the second clamping mechanism 122. In some embodiments, the extension portion 23 of the wafer carrier 200 is provided with a first clamping groove 231 adapted to the first clamping portion 1211b and a second clamping groove 232 adapted to the second clamping portion 1213a. In this embodiment, the distance between the second clamping groove 232 and the second clamping portion 1213a is greater than the distance between the first clamping groove 231 and the first clamping portion 1211b. The length of the second clamping portion 1213a extending to the second clamping mechanism 122 is greater than the length of the first clamping portion 1211b extending to the second clamping mechanism 122, which is conducive to the first clamping portion 1211b extending into the first clamping groove 231 and the second clamping portion 1213a extending into the second clamping groove 232, thereby facilitating the first clamping portion 1211b and the second clamping portion 1213a to clamp the wafer carrier 200.

[0052] Specifically, when the driving component 13 drives the first clamping mechanism 121 to move in the left-right direction to clamp the wafer carrier 200, the first clamping mechanism 121 drives the first clamping portion 1211b and the second clamping portion 1213a on the moving portion 1211a to extend into the first clamping groove 231 and the second clamping groove 232 of the wafer carrier 200 for clamping. When the driving component 13 drives the first clamping mechanism 121 to move away from the wafer carrier 200 in the left-right direction, the first clamping portion 1211b and the second clamping portion 1213a on the moving portion 1211a withdraw from the first clamping groove 231 and the second clamping groove 232, respectively, so as to no longer clamp the wafer carrier 200. During the movement of the movable part 1211a, the cooperation between the slider 1212 and the linear guide rail 111 can play a role in limiting and guiding the movement of the movable part 1211a, thereby improving the movement stability of the movable part 1211a, and further improving the clamping stability of the first clamping part 1211b and the second clamping part 1213a on the wafer carrier 200.

[0053] like Fig. 9 and Fig.10As shown, as an embodiment, the driving assembly 13 includes a driving motor 131, a screw rod 132 and a nut 133, the nut 133 is located on the moving part 1211a and is fixedly connected to the moving part 1211a, and the nut 133 is also sleeved on the screw rod 132 and is transmission-connected to the screw rod 132. In some embodiments, the nut 133 is embedded in the moving part 1211a so that the nut 133 is fixed to the moving part 1211a. When the screw rod 132 rotates, the nut 133 and the moving part 1211a can be driven to move. One end of the screw rod 132 is transmission-connected to the driving motor 131, and the other end of the screw rod 132 is rotationally connected to the base 11. Among them, the screw rod 132 extends along the left-right direction of the clamping device 100, so that the rotation of the screw rod 132 can drive the nut 133 to move in the left-right direction, thereby driving the moving part 1211a to move in the left-right direction through the nut 133, and then driving the first clamping mechanism 121 to move in the left-right direction. In some embodiments, a bearing seat 112 is fixedly installed below the base 11 by screws, and one end of the screw rod 132 away from the drive motor 131 is rotatably connected to the bearing seat 112, and the connection stability between the screw rod 132 and the base 11 is improved by the bearing seat 112. The drive motor 131 is also fixedly connected to the base 11. In some embodiments, a motor mounting plate is fixedly connected to the lower side of the base 11, and the drive motor 131 is fixedly installed on the motor mounting plate by screws, so that the drive motor 131 is connected to the base 11.

[0054] Specifically, the driving motor 131 drives the lead screw 132 to rotate, so that the nut 133 moves in the left-right direction on the lead screw 132. The nut 133 drives the moving portion 1211a on the first clamping mechanism 121 to move toward the wafer carrier 200, thereby driving the first clamping portion 1211b and the second clamping portion 1213a on the first clamping mechanism 121 to move toward the wafer carrier 200, and further driving the first clamping portion 1211b and the second clamping portion 1213a to extend into the first clamping groove 231 and the second clamping groove 232.

[0055] In this embodiment, the number of the driving components 13 is two groups, specifically, the driving components 13 include a first driving component 134 and a second driving component 135, the first driving component 134 is transmission-connected to the first clamping mechanism 121, the second driving component 135 is transmission-connected to the second clamping mechanism 122, and the first driving component 134 and the second driving component 135 are symmetrically arranged on the base 11. In addition, the first driving component 134 and the second driving component 135 have the same structure, so that the first driving component 134 drives the first clamping mechanism 121 and the second driving component 135 drives the second clamping mechanism 122 in the same moving manner, so that the first clamping mechanism 121 and the second clamping mechanism 122 move toward each other, thereby clamping the wafer carrier 200.

[0056] When the driving motor 131 drives the screw rod 132 to reverse, so that the nut 133 on the first clamping mechanism 121 moves away from the wafer carrier 200 in the left-right direction, the moving part 1211a on the first clamping mechanism 121 moves away from the wafer carrier 200 in the left-right direction, and then the first clamping part 1211b and the second clamping part 1213a on the first clamping mechanism 121 are driven to separate from the first clamping groove 231 and the second clamping groove 232 on the wafer carrier 200. At the same time, the driving assembly 13 connected to the second clamping mechanism 122 drives the second clamping mechanism 122 to move in the same way as the first clamping mechanism 121, so that the first clamping mechanism 121 and the second clamping mechanism 122 move away from each other, so that the first clamping mechanism 121 and the second clamping mechanism 122 are separated from the wafer carrier 200. Through the above arrangement, the clamping and separation of the wafer carrier 200 are achieved.

[0057] like Figure 3 As shown, as an embodiment, the baffle 151 is provided with an avoidance groove 1513 for avoiding the guide mechanism 14, and the avoidance groove 1513 is located below the guide wheel 153. By setting the avoidance groove 1513, when the guide mechanism 14 extends below the guide wheel 153, the interference between the guide mechanism 14 and the baffle 151 is avoided. At the same time, when the baffle 151 moves forward, the setting of the avoidance groove 1513 can further avoid the interference between the baffle 151 and the guide mechanism 14, and improve the movement stability of the guide mechanism 14 driving the guide wheel 153 and the baffle 151.

[0058] like Figure 2 As shown, as an embodiment, a buffer 154 is provided on one side of the baffle 151 away from the connection mechanism 152. In some embodiments, the buffer 154 is a silicone pad, and through the setting of the silicone pad, when the baffle 151 covers the opening 22 of the wafer carrier 200, the silicone pad flexibly contacts the wafer, thereby protecting the wafer.

[0059] In the present application, the clamping process of the clamping device 100 is as follows:

[0060] First, the overhead crane drives the clamping device 100 to move downward via a lifting belt, so that the first clamping mechanism 121 and the second clamping mechanism 122 are located on the left and right sides of the wafer carrier 200 , and the baffle assembly 15 is located at the rear side of the wafer carrier 200 .

[0061] Secondly, the driving assembly 13 is started, and the two groups of driving assemblies 13 drive the first clamping mechanism 121 and the second clamping mechanism 122 to move respectively. Specifically, the driving motor 131 drives the screw rod 132 to rotate, and the nut 133 drives the moving part 1211a on the first clamping mechanism 121 to move toward the wafer carrier 200 in the left and right direction, so that the first clamping part 1211b extends into the first clamping groove 231 of the wafer carrier 200, and the second clamping part 1213a extends into the second clamping groove 232 of the wafer carrier 200. Similarly, the second clamping mechanism 122 also moves in the same way as the first clamping mechanism 121, so that the first clamping mechanism 121 and the second clamping mechanism 122 move toward each other, thereby clamping the wafer carrier 200.

[0062] When the moving part 1211a on the first clamping mechanism 121 moves toward the wafer carrier 200, the moving part 1211a drives the guide mechanism 14 to move toward the wafer carrier 200 in the left-right direction, so that the guide slope 141 on the guide mechanism 14 moves to the bottom of the guide wheel 153, so that the guide slope 141 supports the guide wheel 153. Similarly, the second clamping mechanism 122 drives the guide mechanism 14 connected to the second clamping mechanism 122 to move in the same way as the first clamping mechanism 121, so that the two guide slopes 141 of the two guide mechanisms 14 are driven to move toward each other through the first clamping mechanism 121 and the second clamping mechanism 122, and then the corresponding guide wheels 153 are driven to move upward through the guide slopes 141. At this time, the baffle 151 and the guide wheel 153 are limited by the connecting rod 1522 so that the baffle 151 can move toward the opening 22 to the first position, so that the baffle 151 covers the opening 22 of the wafer carrier 200 to achieve blocking of the opening 22 of the wafer carrier 200.

[0063] Then, after the overhead crane drives the clamping device 100 and the wafer carrier 200 to rise and move to the designated position, the overhead crane drives the clamping device 100 to descend to the designated height, and the driving motor 131 drives the screw rod 132 to reverse, thereby driving the nut 133 and the moving part 1211a on the first clamping mechanism 121 to move away from the wafer carrier 200 in the left and right directions, and the first clamping part 1211b and the second clamping part 1213a withdraw from the first clamping groove 231 and the second clamping groove 232 respectively, so that the first clamping mechanism 121 and the second clamping mechanism 122 are separated from the wafer carrier 200. Similarly, the second clamping mechanism 122 moves in the same way as the first clamping mechanism 121, so that the first clamping mechanism 121 and the second clamping mechanism 122 move in opposite directions, so that the clamping device 100 no longer clamps the wafer carrier 200.

[0064] When the moving part 1211a on the first clamping mechanism 121 moves away from the wafer carrier in the left-right direction, the moving part 1211a drives the guide mechanism 14 to move away from the wafer carrier 200 in the left-right direction. Similarly, the guide mechanism 14 on the second clamping mechanism 122 moves in the same way as the first clamping mechanism 121, so that the guide slopes 141 on the left and right sides of the baffle 151 move away from each other to separate, so that the guide slopes 141 withdraw from under the guide wheel 153, and the guide slopes 141 no longer support the guide wheel 153. At this time, under the influence of the gravity of the baffle 151 itself, the baffle 151 will fall downward to the second position, so that the baffle 151 is separated from the opening 22 of the wafer carrier 200. When the baffle 151 falls, the magnetic member 1512 and the fixing rod 1521 are arranged so that the baffle 151 can be brought close to the fixing rod 1521 or abutted against the fixing rod 1521 , thereby fixing the position of the baffle 151 and preventing the baffle 151 from shaking when the clamping device 100 moves.

[0065] During use of the clamping device 100 , the baffle 151 can cover the opening 22 on the wafer carrier 200 , so that when the overhead crane transports the wafer carrier 200 , the wafer will not fall from the opening 22 on the wafer carrier 200 , thereby improving the protection of the wafer.

[0066] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A clamping device for clamping a wafer carrier, characterized in that: The clamping device comprises: Pedestal; A clamping assembly, the clamping assembly is located below the base and is slidably connected to the base, and the clamping assembly is used to clamp the wafer carrier; A driving assembly, the driving assembly is fixedly connected to the base and is drivingly connected to the clamping assembly; A guide mechanism, the guide mechanism is located on the clamping assembly, and a guide slope is formed on a side of the guide mechanism away from the clamping assembly; A baffle assembly, the baffle assembly is located below the base, the baffle assembly comprises a baffle, a connecting mechanism and a guide wheel, the connecting mechanism is at least partially located above the baffle, the connecting mechanism is respectively connected to the base and the baffle, and the guide wheel is rotatably connected to the baffle; The connecting mechanism comprises a fixing rod and a connecting rod, the upper end of the fixing rod is fixedly connected to the base, and the two ends of the connecting rod are rotatably connected to the lower end of the fixing rod and the baffle respectively, and through the cooperation of the fixing rod and the connecting rod, the connecting mechanism has a degree of freedom of movement relative to the base, so that the baffle can move toward the opening of the wafer carrier; During the process of the clamping assembly clamping the wafer carrier, the clamping assembly drives the guide mechanism to move, the guide slope can abut against the guide wheel and make the guide wheel roll along the guide slope, so that the baffle can be driven by the guide wheel to move to the first position, and when the baffle is in the first position, the baffle covers the opening of the wafer carrier.

2. The clamping device according to claim 1, characterized in that: A first connecting groove is provided at one end of the fixing rod away from the base, a connecting ear is provided on the baffle, a second connecting groove is provided on the connecting ear, two ends of the connecting rod are respectively installed in the first connecting groove and the second connecting groove, and both ends of the connecting rod are rotatably connected to the first connecting groove and the second connecting groove through a pin shaft.

3. The clamping device according to claim 1, characterized in that: The fixing rod is made of metal material, and a magnetic member is provided on one side of the baffle plate close to the fixing rod. When the baffle plate is in the second position, the magnetic member can make the baffle plate close to the fixing rod or abut against the fixing rod; When the baffle is in the second position, the guide wheel is separated from the guide slope, the clamping assembly does not clamp the wafer carrier, and there is a gap between the baffle and the opening of the wafer carrier.

4. The clamping device according to claim 1, characterized in that: The clamping assembly includes a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are arranged in mirror symmetry, and the structures of the first clamping mechanism and the second clamping mechanism are consistent. Under the drive of the driving assembly, the first clamping mechanism and the second clamping mechanism can move toward each other to a clamping state or move away from each other to a separation state. When the first clamping mechanism and the second clamping mechanism are in the clamping state, the baffle is in the first position. When the first clamping mechanism and the second clamping mechanism are in the separation state, the clamping assembly does not clamp the wafer carrier.

5. The clamping device according to claim 4, characterized in that: The guide mechanisms are provided with two, the two guide mechanisms are respectively located on the first clamping mechanism and the second clamping mechanism, and the guide inclined surfaces of the two guide mechanisms are arranged opposite to each other; Two guide wheels are provided, and each guide wheel is matched with one guide inclined surface respectively.

6. The clamping device according to claim 4, characterized in that: The first clamping mechanism includes a first clamping member for clamping the wafer carrier and a slider connected to the first clamping member. A linear slide rail is arranged below the base, and the slider is slidably connected to the linear slide rail.

7. The clamping device according to claim 6, characterized in that: The first clamping member includes a moving portion extending in a vertical direction and a first clamping portion extending in a horizontal direction, the moving portion is fixedly connected to the slider, and the first clamping portion is used to clamp the wafer carrier; the first clamping portion and the moving portion are integrally formed; the guide mechanism is located on the moving portion.

8. The clamping device according to claim 7, characterized in that: The driving assembly includes a driving motor, a screw rod and a nut. The nut is located on the moving part and fixedly connected to the moving part. The nut is also sleeved on the screw rod and transmission connected to the screw rod. One end of the screw rod is transmission connected to the driving motor, and the other end of the screw rod is rotationally connected to the base. The driving motor is also fixedly connected to the base.

9. The clamping device according to claim 7, characterized in that: The first clamping mechanism also includes a second clamping member, which is located on the first clamping member and fixedly connected to the first clamping member, and the second clamping member includes a second clamping portion extending along the horizontal direction, and the length of the second clamping portion extending toward the second clamping mechanism is greater than the length of the first clamping portion extending toward the second clamping mechanism.

10. The clamping device according to claim 1, characterized in that: The baffle plate is provided with an avoidance groove for avoiding the guide mechanism, and the avoidance groove is located below the guide wheel.

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