Multi-heat-source heat dissipation module

Abstract

The invention discloses a multi-heat-source heat dissipation module which is arranged between two circuit boards, and the two circuit boards are respectively provided with a high-power chip and a low-power chip. The multi-heat-source heat dissipation module comprises a heat pipe which is used for being attached to each high-power chip; the plurality of radiating fins are respectively and fixedly arranged on the heat pipe and cling to the low-power chips; the radiating fin group is arranged at one end of the heat pipe; the heat pipe is utilized to contact with a chip with higher power, high heat can be directly and quickly conducted to the heat dissipation fin group for heat dissipation, the heat dissipation fins are utilized to contact with a chip with lower power, low heat is indirectly conducted to the heat pipe and then transferred to the heat dissipation fin group for heat dissipation, and different heat dissipation modes are configured for chips with different powers, so that the heat dissipation efficiency can be improved, and the heat dissipation efficiency is improved. And the overall size and weight of the product are reduced.

Description

Technical Field

[0001] This invention relates to a heat dissipation device, and more particularly to a multi-heat source heat dissipation module for heat dissipation chips. Background Technology

[0002] With advancements in wireless transmission technology, wireless networks have now entered the WiFi 7 era. To accommodate the high-speed transmission rates, WiFi 7 signal boosters utilize chips with relatively high instruction cycles, resulting in increased heat generation. Please refer to [link / reference needed]. Figure 11 As shown, this is a heat dissipation device designed for a WiFi 7 signal booster in the prior art. It mainly includes a copper plate 90 and a heat dissipation fin block 91. The shape of the copper plate 90 corresponds to the shape of the circuit board of the signal booster. The heat dissipation fin block 91 is disposed on one side of the copper plate 90. By covering the circuit board with the copper plate 90 and attaching it to each chip, heat conduction and heat dissipation are achieved.

[0003] However, the circuit board of the signal booster mainly includes a motherboard and a WiFi board. During assembly, the motherboard and WiFi board are joined together and the heat sink is sandwiched between them. However, because the chips on the motherboard and the chips on the WiFi board are positioned and have different thicknesses, the contact surface between the chips and the copper plate 90 is easily uneven during the joining process. This reduces the contact area and lowers the heat conduction efficiency, thereby increasing the thermal resistance and affecting the heat dissipation efficiency. In addition, the large area of ​​the copper plate 90 used also increases the overall weight of the signal booster. Therefore, the heat sink of the prior art has the aforementioned problems and shortcomings in its overall structure and needs to be improved. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a multi-heat source heat dissipation module, which improves heat dissipation efficiency and reduces costs by respectively setting heat pipes and heat sinks at the positions of high-power chips and low-power chips on the circuit board.

[0005] To achieve the aforementioned objectives, the present invention employs a multi-heat source heat dissipation module, which is disposed between a first circuit board and a second circuit board spaced apart. The first and second circuit boards are electrically connected. The first circuit board has multiple first main chips and multiple first-stage chips, and the second circuit board has multiple second main chips and multiple second-stage chips. The sides of the first circuit board with each first main chip and each first-stage chip are adjacent to the sides of the second circuit board with each second main chip and each second-stage chip. The power of each first main chip is higher than the power of each first-stage chip, and the power of each second main chip is higher than the power of each second-stage chip. The multi-heat source heat dissipation module includes:

[0006] A heat pipe is used to attach to each of the first main chips and each of the second main chips;

[0007] Multiple heat sinks are provided, each heat sink is fixed to the heat pipe, and each heat sink is used to abut against each of the first chip and each of the second chip;

[0008] A heat dissipation fin assembly is disposed at one end of the heat pipe.

[0009] Furthermore, in the multi-heat source heat dissipation module, the heat pipe is a flat tube with a top surface and a bottom surface, and each heat sink has a first connecting section, a second connecting section and a turning section. The turning section is located between the first connecting section and the second connecting section, and each heat sink is fixed to the heat pipe through the second connecting section.

[0010] Furthermore, in the multi-heat source heat dissipation module, the shape of the heat pipe bend corresponds to the shape formed by the positions of each of the first main chip and each of the second main chips connected together.

[0011] Furthermore, in the multi-heat source heat dissipation module, the heat dissipation fin group includes multiple heat dissipation fins, each heat dissipation fin is arranged at intervals and forms multiple air vents, and the heat dissipation fin group is disposed at one end of the heat pipe.

[0012] Furthermore, in the multi-heat source heat dissipation module, the first circuit board and the second circuit board are disposed within a housing, and a fan is disposed within the housing, with the fan's air outlet aligned with each of the air guides of the heat dissipation fin assembly.

[0013] The advantages of this invention are as follows: by contacting the first and second main chips with higher power or lower temperature limits through heat pipes, high heat can be directly and quickly conducted to the heat sink fins for heat dissipation. By contacting the first and second chips with lower power or higher temperature limits through heat sinks, low heat can be indirectly conducted to the heat pipes and then transferred to the heat sink fins for heat dissipation. Configuring different heat dissipation methods for chips with different power levels not only improves heat dissipation efficiency but also reduces the overall size and weight of the product. Furthermore, the multi-heat source heat dissipation module in this invention can achieve complete contact with chips at different heights, reducing thermal resistance and improving heat conduction efficiency. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present invention;

[0015] Figure 2 This is an exploded view of the main components of the present invention;

[0016] Figure 3This is an exploded view of the main components from another perspective of the present invention;

[0017] Figure 4 This is a partial side view of the present invention;

[0018] Figure 5 This is a partial cross-sectional view of the present invention;

[0019] Figure 6 These are external views of the first and second circuit boards of the present invention;

[0020] Figure 7 This is a schematic diagram of the appearance of the present invention in use;

[0021] Figure 8 This is a schematic diagram of the configuration of the present invention;

[0022] Figure 9 This is a side view diagram illustrating the use of the present invention;

[0023] Figure 10 This is another side view schematic diagram of the use of the present invention;

[0024] Figure 11 This is a schematic diagram of existing technology. Detailed Implementation

[0025] The following description, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means employed by the present invention to achieve its intended purpose.

[0026] Please see Figure 1 and Figure 6 As shown, the multi-heat source heat dissipation module of the present invention is disposed between a first circuit board 40 and a second circuit board 50 spaced apart. The first circuit board 40 and the second circuit board 50 are electrically connected. The first circuit board 40 is provided with a plurality of first main chips 41 and a plurality of first secondary chips 42. The second circuit board 50 is provided with a plurality of second main chips 51 and a plurality of second secondary chips 52. The side of the first circuit board 40 where each first main chip 41 and each first secondary chip 42 is disposed adjacent to the side of the second circuit board 50 where each second main chip 51 and each second secondary chip 52 is disposed. The power of the first main chip 41 is higher than the power of the first secondary chip 42, and the power of the second main chip 51 is higher than the power of the second secondary chip 52. The multi-heat source heat dissipation module includes a heat pipe 10, a plurality of heat sinks 20 and a heat sink fin group 30.

[0027] Please see Figure 2 , Figure 3 and Figure 6As shown, the heat pipe 10 is a bent flat tube with a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two opposite sides. The bent shape of the heat pipe 10 corresponds to the arrangement of each first main chip 41 and each second main chip 51, but is not limited thereto. The shape of the heat pipe 10 can be changed according to the user's needs.

[0028] Please see Figures 3 to 6 As shown, each heat sink 20 is fixed on the heat pipe 10. In this embodiment, each heat sink 20 is a single piece, which can be made by bending processing technology. It has a first connecting section 21, a second connecting section 22 and a turning section 23. The turning section 23 is located between the first connecting section 21 and the second connecting section 22. The first connecting section 21 and the second connecting section 22 are arranged at intervals and located at different planar positions. Each heat sink 20 is fixed on the bottom surface 12 of the heat pipe 10 through the second connecting section 22. The first connecting section 21 of each heat sink 20 is adjacent to one side of the top surface 11 of the heat pipe 10 and is flush with the top surface 11 of the heat pipe 10, so that when the heat pipe 10 and each heat sink 20 come into contact with the corresponding chips of the same height, they can fit together completely. However, this is not a limitation. The shape, material and fixing method of each heat sink 20 can be changed according to the user's needs.

[0029] The heat dissipation fin assembly 30 is a block structure composed of multiple heat dissipation fins 31. Each heat dissipation fin 31 is arranged at intervals and forms multiple air vents 32. The heat dissipation fin assembly 30 is located on the top surface 11 of one end of the heat pipe 10, but it is not limited thereto. The form of the heat dissipation fin assembly 30 can be changed according to the user's needs, or the heat dissipation fin assembly 30 may not be provided.

[0030] When assembling this invention, please refer to [the relevant documentation]. Figures 7 to 10 As shown, this example is applied to a signal booster, but is not limited thereto. The signal booster has a housing (not shown in the figure), which forms an internal space. A first circuit board 40 and a second circuit board 50 are arranged vertically and vertically within the housing. The first circuit board 40 is the main board, and the second circuit board 50 is the WiFi board. This invention is located between the first circuit board 40 and the second circuit board 50. Heat pipes 10 are attached to each of the first main chips 41 and each of the second main chips 51. Heat sinks 20 are attached to each of the first chip 42 and each of the second chip 52. A fan 60 is fixed inside the housing and its air outlet is aligned with each of the air vents 32 of the heat sink fin assembly 30. However, this is not a limitation. The position of the fan 60 can be changed according to user needs. For example, it can be directly installed on the first circuit board 40 or the second circuit board 50, or the fan 60 can be omitted.

[0031] By utilizing the heat pipe 10 to contact the first main chip 41 and the second main chip 51 with higher power or lower temperature limit, high heat can be directly and quickly conducted to the heat sink fin assembly 30 for heat dissipation. The heat sink 20 contacts the first chip 42 and the second chip 52 with lower power or higher temperature limit, indirectly conducting low heat to the heat pipe 10 and then to the heat sink fin assembly 30 for heat dissipation. Compared with the prior art, in addition to the advantage of reducing the overall size and weight of the product, configuring different heat dissipation methods for chips with different power can also improve heat dissipation efficiency. Furthermore, the multi-heat source heat dissipation module of the present invention can achieve a complete contact state for chips set at different heights, thereby reducing thermal resistance and improving heat conduction efficiency.

[0032] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention discloses the above preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content as equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A multi-heat source heat dissipation module, characterized in that: It is arranged between a first circuit board and a second circuit board which are arranged at intervals, the first circuit board and the second circuit board are electrically connected, the first circuit board is provided with a plurality of first main chips and a plurality of first chips, the second circuit board is provided with a plurality of second main chips and a plurality of second chips, the side of the first circuit board provided with each of the first main chips and each of the first chips is arranged adjacent to the side of the second circuit board provided with each of the second main chips and each of the second chips, the power of each of the first main chips is higher than the power of each of the first chips, the power of each of the second main chips is higher than the power of each of the second chips, and the multi-heat source heat dissipation module comprises: a heat pipe, attached to each of the first main chips and each of the second main chips; A plurality of heat sinks, each of which is fixed to the heat pipe, and each of which is close to each of the first chips and each of the second chips; A heat dissipation fin group is arranged at one end of the heat pipe.

2. The multi-heat source heat dissipation module according to claim 1, characterized in that: The heat pipe is a flat tube having a top surface and a bottom surface. Each of the heat sinks has a first connecting section, a second connecting section and a turning section. The turning section is located between the first connecting section and the second connecting section. Each of the heat sinks is fixed to the heat pipe via the second connecting section.

3. The multi-heat source heat dissipation module according to claim 1 or 2, characterized in that: The bent shape of the heat pipe corresponds to a shape formed by connecting the positions of the first main chips and the second main chips.

4. The multi-heat source heat dissipation module according to claim 3, characterized in that: The heat dissipation fin group includes a plurality of heat dissipation fins, each of which is arranged at intervals and forms a plurality of air guide ports.

5. The multi-heat source heat dissipation module according to claim 4, characterized in that: The first circuit board and the second circuit board are arranged in a shell. A fan is arranged in the shell. The air outlet of the fan is aligned with each air guide outlet of the heat dissipation fin group.

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