Molded part

Abstract

A molded member (1) is provided with an inner member module including a first molded part, a solder part, and a second molded part. The leads include a first lead and a second lead. The first molding portion includes a spacer portion including a first surface and a second surface. The first lead has a first exposed portion on the first surface, and the second lead has a second exposed portion on the second surface. The first lead and the second lead are disposed at positions that do not overlap in plan view from a direction in which the first surface faces or a direction in which the second surface faces. The soft solder part comprises a first soft solder part located on the first face and a second soft solder part located on the second face.

Description

Technical Field

[0001] The present disclosure relates to molded parts. Background Art

[0002] A wheel speed sensor for measuring the rotation speed of a wheel is mounted on a vehicle such as an automobile. As such a wheel speed sensor, a device described in Japanese Patent Publication No. 2017-096828 is known. The wheel speed sensor described in Japanese Patent Publication No. 2017-096828 includes a plurality of detection element parts and a bracket part for holding the plurality of detection element parts. The bracket part is formed by injection molding while holding the detection element parts in a predetermined configuration. In addition, the detection element part and the bracket part are covered by a resin molded part to form a molded body.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-096828 Summary of the invention

[0006] Problems to be solved by the invention

[0007] Here, in the molding component described in patent document 1, a plurality of terminals are extended from the detection element part as an insert when forming the resin molded part. In addition, each terminal is connected to the core wire by welding. In such a case, the adjacent terminals are close to each other, and the solder parts used for connecting the respective terminals with the corresponding core wires are also close to each other. When welding is performed under such a condition, it is necessary to perform the welding operation in a manner that prevents the adjacent solder parts from contacting each other, so the welding operation is difficult.

[0008] Therefore, an object of the present disclosure is to provide a molded component that facilitates soldering work and prevents adjacent solder portions from coming into contact with each other.

[0009] Means for solving problems

[0010] The molded component of the present disclosure comprises: an internal component module, including at least one internal component and a first molded portion, wherein the internal component has an electrical component body and a lead extending from the electrical component body, wherein the first molded portion covers a portion of the internal component; an electrical conductor connected to the lead and connected to other electrical components; a solder portion connecting the lead to the electrical conductor; and a second molded portion covering the internal component module, the electrical conductor and the solder portion, wherein the lead includes a first lead and a second lead, wherein the first molded portion includes a spacer portion, wherein the spacer portion includes a first surface and a The first lead has a first exposed portion, the first exposed portion is exposed from the first molded portion on the first surface, the second lead has a second exposed portion, the second exposed portion is exposed from the first molded portion on the second surface, the first lead and the second lead are arranged at non-overlapping positions when viewed from the direction toward which the first surface is facing or the direction toward which the second surface is facing, and the solder portion includes: a first solder portion, which is located on the first surface and connects the first exposed portion to the electrical conductor; and a second solder portion, which is located on the second surface and connects the second exposed portion to the electrical conductor.

[0011] Effects of the Invention

[0012] According to the present disclosure, soldering work is facilitated and contact between adjacent solder portions is prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] [ Figure 1 ] Figure 1 It is a three-dimensional diagram showing a molded part.

[0014] [ Figure 2 ] Figure 2 It is a perspective view showing the portion of the molded component excluding the second molded portion.

[0015] [ Figure 3 ] Figure 3 It is a plan view showing a portion of the molded component excluding the second molded portion.

[0016] [ Figure 4 ] Figure 4 It is a side view showing a portion of the molded component excluding the second molded portion.

[0017] [ Figure 5 ] Figure 5 Yes means Figure 3 Cross-sectional view of section VV.

[0018] [ Figure 6 ] Figure 6It is an explanatory diagram showing a cross-sectional view perpendicular to the extending direction of the lead in another embodiment.

[0019] [ Figure 7 ] Figure 7 It is an explanatory diagram showing a cross-sectional view perpendicular to the extending direction of the lead in another embodiment. DETAILED DESCRIPTION

[0020] [Description of Embodiments of the Present Disclosure]

[0021] First, embodiments of the present disclosure will be described below.

[0022] The molded part of the present disclosure is as follows.

[0023] (1) A molded component comprising: an internal component module including at least one internal component and a first molded portion covering a portion of the internal component, the internal component having an electrical component body and a lead extending from the electrical component body; an electrical conductor connected to the lead and connected to other electrical components; a solder portion connecting the lead to the electrical conductor; and a second molded portion covering the internal component module, the electrical conductor, and the solder portion, the lead including a first lead and a second lead, the first molded portion including a spacer portion including a first surface and a direction facing in a direction opposite to a direction facing the first surface the second surface of the device, the first lead having a first exposed portion, the first exposed portion being exposed from the first molded portion on the first surface, the second lead having a second exposed portion, the second exposed portion being exposed from the first molded portion on the second surface, the first lead and the second lead being arranged at non-overlapping positions when viewed from a direction toward which the first surface is facing or a direction toward which the second surface is facing, the solder portion comprising: a first solder portion, located on the first surface and connecting the first exposed portion to the electrical conductor; and a second solder portion, located on the second surface and connecting the second exposed portion to the electrical conductor.

[0024] According to such a molded component, a solder portion is provided, the solder portion including: a first solder portion located on the first surface and connecting the first exposed portion to the electrical conductor; and a second solder portion located on the second surface and connecting the second exposed portion to the electrical conductor, so that welding work is easy and contact between adjacent solder portions is prevented. Thus, a short circuit between the first lead and the second lead caused by contact between adjacent solder portions is prevented.

[0025] (2) In the molded component of (1), the lead extending from the electric component body in the first inner component may be the first lead, and the lead extending from the electric component body in the second inner component may be the second lead.

[0026] According to such a molded component, the lead of the first inner component has the first exposed portion on the first surface, and the lead of the second inner component has the second exposed portion on the second surface, thereby preventing a short circuit between the lead of the first inner component and the lead of the second inner component.

[0027] (3) In the molded component of (1) or (2), the first lead may include a plurality of first leads, the second lead may include a plurality of second leads, and the first molded portion may further include: a first partition wall that separates the first leads from each other; and a second partition wall that separates the second leads from each other.

[0028] According to such a molded component, the first molded portion includes the first partition wall that partitions the first leads and the second partition wall that partitions the second leads. Therefore, short circuits between the leads located on the same surface can be prevented.

[0029] (4) In the molded component of (2), the first inner component and the second inner component may be arranged in mirror symmetry with respect to an imaginary plane passing through a middle position of each electrical component body and along an extending direction of the lead.

[0030] According to such a molded component, the first internal component and the second internal component can be made to have the same posture inside the molded component. As a result, it is easy to make the electrical characteristics between the first internal component and the second internal component consistent. For example, when the first internal component and the second internal component are sensors, the first internal component and the second internal component can be made to have the same posture relative to the object to be detected. Therefore, when detecting the object to be detected, it can be expected that the first internal component and the second internal component output detection signals with the same output characteristics.

[0031] (5) In the molded component according to any one of (1) to (4), the first surface may be located at a position recessed relative to the second surface in a direction in which the second surface faces in a cross-sectional view perpendicular to the extending direction of the lead.

[0032] According to such a molded component, the bent shapes of the leads on the first surface and the leads on the second surface can be made the same shape.

[0033] (6) In the molded component according to any one of (1) to (5), in a cross-sectional view perpendicular to the extending direction of the lead, the first surface may be located at a position recessed from the second surface in the direction in which the second surface faces by an amount equal to the thickness of the lead.

[0034] According to such a molding component, the bending shapes of the leads on the first surface and the leads on the second surface can be made more similar. Since the heights of the leads in the thickness direction can be made consistent, it is not necessary to make any lead have a bending angle different from other leads. Therefore, it is possible to suppress the application of a load such as bending compared to other leads to any one lead.

[0035] (7) In the molded component of any one of (1) to (6), the spacer portion may have a first step portion located between the first surface and the back surface of the second surface, and a second step portion located between the second surface and the back surface of the first surface, wherein a corner of the first step portion is chamfered, and a corner of the second step portion is chamfered.

[0036] According to such a molded component, the welding work can be easily performed by utilizing the shape of the step portion.

[0037] [Details of Embodiments of the Present Disclosure]

[0038] Hereinafter, specific examples of the molded component of the present disclosure will be described with reference to the drawings. In addition, the present disclosure is not limited to these examples, but is indicated by the scope of claims, and is intended to include all changes within the meaning and scope equivalent to the scope of claims.

[0039] In addition, the drawings are schematically shown, and for the convenience of explanation, the structure is appropriately omitted or simplified in the drawings. In addition, the size and position of the structures shown in different drawings are not necessarily accurately recorded and can be appropriately changed. In addition, in drawings such as top views that are not sectional views, hatching is sometimes marked to facilitate understanding of the contents of the embodiments.

[0040] In the following description, the same components are denoted by the same reference numerals and the same names and functions are the same, so their detailed description may be omitted to avoid duplication.

[0041] [First embodiment]

[0042] Hereinafter, the molded component 1 according to the present embodiment will be described. Figure 1 It is a perspective view showing the molded component 1. Figure 2 It is a perspective view showing a portion of the molded component 1 excluding the second molded portion 50 . Figure 3It is a plan view showing a portion of the molded component 1 excluding the second molded portion 50 . Figure 4 1 is a side view showing the portion of the molded component 1 excluding the second molded portion 50. Figure 5 Yes means Figure 3 In each figure and the following description, the longitudinal direction of the molded component 1 is defined as L, and the width direction is defined as W.

[0043] <Structure of Molded Part 1>

[0044] The molded component 1 is used, for example, to measure the rotation speed of a tire of a vehicle. The molded component 1 detects, for example, a magnetic field fluctuation caused by the rotation of a detected object that rotates together with the rotation of the tire. The molded component 1 includes an internal component module 2. The internal component module 2 includes at least one (two in this case) internal component 10, 20 and a first molded portion 40 that covers a portion of the internal component 10, 20. The internal component 10, 20 includes a detection element body 11, 21 as an electronic component body and leads 12, 13, 22, 23 extending from the detection element body 11, 21. In addition, the molded component 1 further includes: a connection terminal 30 as an electrical conductor connected to the leads 12, 13, 22, 23 (four in this case, but the number is not particularly limited); a solder portion 60 that connects the leads 12, 13, 22, 23 to the connection terminal 30; and a second molded portion 50 that covers the internal component module 2, the connection terminal 30, and the solder portion 60. The connection terminal 30 as an electrical conductor is connected to other electrical components.

[0045] In the present embodiment, there are four lead wires 12 , 13 , 22 , and 23 (two lead wires for each detection element body 11 , 21 ). However, any device having one or more lead wires for each detection element body 11 , 21 is also included in the present invention.

[0046] <Structure of internal components 10, 20>

[0047] The internal component 10 includes a first internal component 10 and a second internal component 20 (the first internal component and the second internal component are collectively referred to as "internal components"). As described above, the first internal component 10 has a detection element body 11 as an electronic component body and leads 12, 13 (two leads in this case) extending from the detection element body 11. The two leads 12, 13 are arranged side by side with a gap. The second internal component 20 has the same structure as the first internal component 10. The second internal component 20 has a detection element body 21 as an electronic component body and leads 22, 23 (two leads in this case).

[0048] The first inner component 10 and the second inner component 20 are arranged in parallel in the width direction W of the molded component 1. The four leads 12, 13, 22, and 23 extend in the longitudinal direction L of the molded component 1 in a state of being arranged in parallel with each other.

[0049] The detection element bodies 11 and 21 detect, for example, magnetic field changes caused by the rotation of the detected object rotating together with the rotation of the tire. The detection element bodies 11 and 21 can also detect magnetic field changes around the detection element bodies 11 and 21 caused by the movement of a magnet such as a rotor installed in a magnetic encoder. The detection element bodies 11 and 21 output electrical signals corresponding to such magnetic field changes (wheel rotation speed). The detection element bodies 11 and 21 are arranged at different positions in the rotation direction of the detected object, for example, thereby generating electrical signals at different timings. The electrical signals output from the detection element bodies 11 and 21 are transmitted to the connection terminals 30 via the leads 12, 13, 22, and 23. The electrical signals sent to the connection terminals 30 are input to other electrical components (for example, a control unit or a control device, etc.).

[0050] The leads 12, 13, 22, 23 include first leads 12, 13 and second leads 22, 23 (the first leads and the second leads are collectively referred to as "leads"). In the present embodiment, the leads 12, 13 extending from the detection element body 11 of the first internal component 10 are the first leads 12, 13. In addition, the leads 22, 23 extending from the detection element body 21 of the second internal component 20 are the second leads 22, 23. The first leads 12, 13 and the second leads 22, 23 are formed in a rectangular thin plate shape, for example. The first leads 12, 13 extend from the detection element body 11 in a parallel state, and the second leads 22, 23 extend from the detection element body 21 in a parallel state. The detection element bodies 11, 21 are adjacent to each other with a gap. In addition, the detection element bodies 11, 21 are in the same posture in the first molded portion 40. Therefore, the first leads 12, 13 and the second leads 22, 23 are also parallel to each other as a whole.

[0051] The first lead wires 12 and 13 are a plurality of (two in this case) first lead wires 12 and 13 . The second lead wires 22 and 23 are a plurality of (two in this case) second lead wires 22 and 23 .

[0052] like Figures 3 to 5 As shown, the first leads 12 and 13 have first exposed portions 12a and 13a exposed from the first molded portion 40 on the first surface I (described later) of the first molded portion 40. The first exposed portions 12a and 13a are the front end portions of the first leads 12 and 13. In addition, a portion of the first exposed portions 12a and 13a is welded. In the welded portion, the first leads 12 and 13 are welded and connected to the connection terminal 30 through the solder portion 60.

[0053] The second leads 22 and 23 have second exposed portions 22a and 23a exposed from the first molded portion 40 on the second surface II (described later) of the first molded portion 40. The second exposed portions 22a and 23a are the front end portions of the second leads 22 and 23. Moreover, a portion of the second exposed portions 22a and 23a is a welded portion. In the welded portion, the second leads 22 and 23 are welded and connected to the connection terminal 30 through the solder portion 60.

[0054] like Figure 3 As shown, the first leads 12, 13 and the second leads 22, 23 are arranged at positions that do not overlap when viewed from above. Viewing from above refers to viewing from the direction in which the first surface I is facing or the direction in which the second surface II is facing. In this embodiment, the first surface I and the second surface II are parallel planes. Therefore, the direction in which the first surface I is facing is the same direction as the direction in which the second surface II is facing.

[0055] <Structure of the connection terminal 30>

[0056] The connection terminal 30 is connected to the first lead wires 12 and 13 and the second lead wires 22 and 23 , and is also connected to other electrical components.

[0057] The connection terminal 30 has four connection terminals 31, 32, 33, and 34 (the connection terminals 31, 32, 33, and 34 are collectively referred to as "connection terminals 30"). The material of the connection terminal 30 is, for example, a metal material such as copper, copper alloy, aluminum, aluminum alloy, and stainless steel. The connection terminal 30 is formed of, for example, a conductive material such as by stamping a metal plate. The connection terminal 30 has a degree of rigidity that allows the posture to be maintained in a certain shape.

[0058] Each connection terminal 31, 32, 33, 34 is connected to the lead wires 12, 13, 22, 23 respectively. Figure 1 and Figure 2 As shown, one end of each of the connection terminals 31 , 32 , 33 , 34 is exposed from the first molded portion 40 to form an exposed portion 31 a , 32 a , 33 a , 34 a .

[0059] Here, the connection terminals 31 and 32 of the connection terminal 30 are described. Figure 3 As shown, a part of the exposed portion 31a, 32a of the connection terminals 31, 32 is a soldered portion. The soldered portion is connected to the leads 12, 13 via the solder portion 60. The connection between the connection terminals 33, 34 and the leads 22, 23 is the same as the connection between the connection terminals 31, 32 and the leads 12, 13, so the description is omitted.

[0060] Each of the connection terminals 31, 32, 33, 34 has a connector exposed portion 31c, 32c, 33c, 34c exposed from the first molded portion 40 and the second molded portion 50. Specifically, the other end of each of the connection terminals 31, 32, 33, 34, which is different from the exposed portion 31a, 32a, 33a, 34a side, is exposed from the first molded portion 40 and the second molded portion 50, forming the connector exposed portion 31c, 32c, 33c, 34c. The connector exposed portion 31c, 32c, 33c, 34c is a connection portion connected to a connector connected to other electrical components. Through such a connector exposed portion 31c, 32c, 33c, 34c, the molded component 1 itself has a structure having a connector. As a result, the molded component 1 itself can be directly connected to a connector extending from other electrical components (for example, a control unit or a control device, etc.).

[0061] <Solder portion 60>

[0062] The solder portion 60 connects the first leads 12 and 13 , the second leads 22 and 23 , and the connection terminal 30 , which is an electrical conductor.

[0063] like Figure 3~Figure 5 As shown, the solder portion 60 includes a first solder portion 61a, 61b and a second solder portion 62a, 62b (the first solder portion 61a, 61b and the second solder portion 62a, 62b are collectively referred to as "solder portion 60", the first solder portion 61a and the first solder portion 61b are collectively referred to as "first solder portion 61", and the second solder portion 62a and the second solder portion 62b are collectively referred to as "second solder portion 62"). The first solder portion 61 (61a, 61b) is located on the first surface I. In addition, the first solder portion 61 (61a, 61b) connects the first exposed portion 12a, 13a to the connection terminal 30. In more detail, the first solder portion 61a connects the first exposed portion 12a to the connection terminal 31, and the first solder portion 61b connects the first exposed portion 13a to the connection terminal 32.

[0064] In addition, the second solder portion 62 (62a, 62b) is located on the second surface II. In addition, the second solder portion 62 (62a, 62b) connects the second exposed portions 22a, 23a to the connection terminal 30. More specifically, the second solder portion 62a connects the second exposed portion 22a to the connection terminal 33, and the second solder portion 62b connects the second exposed portion 23a to the connection terminal 34.

[0065] As described above, since the first solder portions 61a, 61b and the second solder portions 62a, 62b are arranged on different surfaces, welding work of the first solder portions 61a, 61b and welding work of the second solder portions 62a, 62b can be performed on their respective surfaces. Therefore, welding work is easy.

[0066] <First Molding Section 40>

[0067] The first molded portion 40 includes a head portion 41, a connection terminal holding portion 42, and a connecting portion 43 connecting the head portion 41 and the connection terminal holding portion 42. The first molded portion 40 is formed of, for example, resin. The first molded portion 40 is a portion molded with a resin material using the inner components 10 and 20 as inserts.

[0068] The head portion 41 covers the detection element main bodies 11 and 21. The head portion 41 is formed with a recessed portion 41a and an inner through hole 41b that penetrates from the surface of the first molded portion 40 to the inner member 20.

[0069] In addition, if Figure 5 As shown, the first internal component 10 and the second internal component 20 are arranged in mirror symmetry with respect to an imaginary plane C that passes through the middle position of each detection element body 11, 21 and along the extension direction of the first lead 12, 13 and the second lead 22, 23. In addition, the plane C is also a plane perpendicular to the first surface I and the second surface II. According to such a molded component 1, since the first internal component 10 and the second internal component 20 are in the same posture in the molded component 1, the posture of the first internal component 10 and the second internal component 20 relative to the object to be detected can be made as consistent as possible. Therefore, when detecting the object to be detected, the first internal component 10 and the second internal component 20 easily output detection signals with the same output characteristics. As a result, the processing of the detection signal becomes easy, and the detection accuracy of the object to be detected can be improved.

[0070] In the head 41 of the first molded part 40, a plurality of (three in this case) recessed parts 41a are formed on the first surface I side, and at least one (one in this case) recessed part 41a is formed on the second surface II side. The recessed part 41a is a portion into which the front end of a positioning pin for fixing the first molded part 40 is inserted when the second molded part 50 is molded. That is, the recessed part 41a is a portion into which the positioning pin of the mold device is inserted when the first molded part 40 is molded as an insert. The recessed part 41a is a depression that opens on the surface of the first molded part 40 but does not reach the surface of the inner components 10 and 20.

[0071] In addition, in the head 41 of the first molded portion 40, a plurality of (here, two) inner through holes 41b are formed on the first surface I side. The inner through holes 41b are traces of positioning pins used to fix a portion of the internal components 10 and 20 when the first molded portion 40 is molded. When the first molded portion 40 is removed from the mold, the inner through holes 41b are formed as traces of the positioning pins. The inner through holes 41b penetrate to the surfaces of the internal components 10 and 20, and a portion of the surfaces of the internal components 10 and 20 is exposed in the inner through holes 41b. In the present embodiment, the positioning pins, for example, press and fix portions of the leads 12, 13, 22, and 23 of the internal components 10 and 20. Moreover, the inner through holes 41b are formed so that a portion of the leads 12, 13, 22, and 23 is exposed. Therefore, the leads 12, 13, 22, 23 fixed by the positioning pins during the molding of the first molded part 40 are exposed to the outside of the first molded part 40 through the inner through hole 41b. Similarly, holes are formed on the second surface II side as traces of the holding member for holding the internal components 10 and 20, but are omitted from the illustration.

[0072] The connection terminal holding portion 42 holds a portion of the connection terminal 30. The connection terminal holding portion 42 holds a plurality of (four in this case) connection terminals 31, 32, 33, 34 at a fixed position. Therefore, the exposed portions 31a, 32a, 33a, 34a and the exposed portions 31c, 32c, 33c, 34c for the connector are held at a fixed position. Thus, the exposed portions 31c, 32c, 33c, 34c for the connector are held at a fixed position suitable for connection to a connector of another electrical component. For example, the exposed portions 31c, 32c, 33c, 34c for the connector are held in a posture parallel to each other and protruding in the same direction. In addition, the exposed portions 31a, 32a, 33a, 34a are held at a fixed position suitable for connection to the leads 12, 13, 22, 23 (for example, a position in contact with the leads 12, 13, 22, 23 from the side opposite to the connecting portion 43).

[0073] The connecting portion 43 is a spacer 43 including a first surface I and a second surface II facing in a direction opposite to the direction facing the first surface I. In addition, the spacer 43 (connecting portion 43) also plays a role of connecting the head 41 and the connection terminal holding portion 42 so that the connection terminal holding portion 42 is held in a fixed position relative to the head 41. The spacer 43 may be thinner than the head 41 and the connection terminal holding portion 42.

[0074] The partition 43 has a placement portion 44 for placing the first leads 12, 13 and the second leads 22, 23. A first placement surface 44a for placing the first leads 12, 13 is formed on the first surface I of the partition 43. A second placement surface 44b for placing the second leads 22, 23 is formed on the second surface II of the partition 43.

[0075] In this embodiment, the normal direction of the first mounting surface 44a and the second mounting surface 44b ( Figure 4 The arrow N) is in the same direction. The leads 12 and 13 are placed on the first placement surface 44a, and the leads 22 and 23 are placed on the second placement surface 44b. The leads 12 and 13 are arranged on the first placement surface 44a, and the leads 22 and 23 are arranged on the second placement surface 44b, so that the first solder portions 61a and 61b (see Figure 3 and Figure 5 ) and the second solder portions 62a, 62b on the second leads 22, 23 (see Figure 3 and Figure 5 Therefore, a short circuit between the first lead wires 12 and 13 and the second lead wires 22 and 23 can be prevented.

[0076] Furthermore, the first molded portion 40 further includes a first partition wall 45 that partitions the leads 12 and 13 , and a second partition wall 46 that partitions the second leads 22 and 23 .

[0077] More specifically, a first partition wall 45 is disposed between the leads 12 and 13 to partition the leads 12 and 13. The first partition wall 45 prevents the first solder portion 61a on the first lead 12 and the first solder portion 61b on the first lead 13 from contacting each other. In addition, the first leads 12 and 13 do not contact each other. Therefore, a short circuit between the first lead 12 and the first lead 13 is prevented.

[0078] Similarly, a second partition wall 46 is disposed between the second leads 22 and 23 to partition the second leads 22 and 23. The second partition wall 46 prevents the second solder portion 62a on the second lead 22 and the second solder portion 62b on the second lead 23 from contacting each other. In addition, the second leads 22 and 23 do not contact each other. Therefore, a short circuit between the second leads 22 and 23 can be prevented.

[0079] In addition, if Figure 5 As shown, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23, the first surface I is located at a position recessed in the direction toward which the second surface II is facing, compared to the second surface II. More specifically, the first surface I is recessed in the direction toward which the second surface II is facing, compared to the back surface of the second surface II. In the thickness direction of the spacer 43, the first surface I is located at a position away from the second surface II in the direction toward which the second surface II is facing. In the present embodiment, the first surface I is located at a position recessed in the direction toward which the second surface II is facing, compared to the second surface II, by the thickness t of the first leads 12, 13 (second leads 22, 23).

[0080] Similarly, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23, the second surface II is located at a position recessed in the direction toward which the first surface I faces, compared to the first surface I. More specifically, the second surface II is recessed in the direction toward which the first surface I faces, compared to the back surface of the first surface I. In the thickness direction of the spacer 43, the second surface II is located at a position away from the first surface I in the direction toward which the first surface I faces. In the present embodiment, the second surface II is located at a position recessed in the direction toward which the first surface I faces, compared to the first surface I, by the thickness t of the second leads 22, 23 (first leads 12, 13).

[0081] By arranging the first leads 12, 13 and the second leads 22, 23 in this way, the positions of the leads (the first leads 12, 13, the second leads 22, 23) in the thickness direction can be aligned. Thus, the first internal component 10 and the second internal component 20 of the same shape can be used. That is, the positions of the leads (the first leads 12, 13, the second leads 22, 23) in the thickness direction can be aligned in the normal direction of the first surface I (the normal direction of the second surface II). It is also unnecessary to take measures to make any of the leads 12, 13, 22, 23 have a bending angle different from that of the other leads. Therefore, it is possible to suppress the application of a load such as bending compared to the other leads to any one of the leads. In addition, it is not necessary to form the first leads 12, 13 and the second leads 22, 23 in different shapes, or it is not necessary to forcibly take measures such as shape changes.

[0082] In addition, if Figure 5 As shown, the spacer 43 has a first step portion 47 between the first surface I and the back surface II-2 of the second surface II. As described above, the first surface I is recessed by the thickness t relative to the second surface II. In the present embodiment, the first step portion 47 is formed perpendicular to the first surface I and the second surface II. In addition, the corner 47a of the first step portion 47 is chamfered.

[0083] In addition, the spacer 43 has a second step portion 48 between the second surface II and the back surface I-2 of the first surface I. As described above, the second surface II is recessed by the thickness t relative to the first surface I. Similar to the first step portion 47, the second step portion 48 is also formed perpendicularly to the first surface I and the second surface II. In addition, the corner 48a of the second step portion 48 is chamfered.

[0084] <Second Molding Section 50>

[0085] like Figure 1As shown, the second molded portion 50 covers the internal component module 2, the connection terminal 30, and the solder portion 60. The second molded portion 50 includes a head covering portion 51 covering the head 41 of the first molded portion 40, a cylindrical portion 52 surrounding a portion of the connection terminal 30, and a connecting portion 53 connecting the head covering portion 51 and the cylindrical portion 52. In addition, the second molded portion 50 includes an annular protrusion 54 protruding outward from the outer periphery of the connecting portion 53.

[0086] In the head covering portion 51 of the second molded portion 50, a plurality of (three in this case) outer through holes 51a are formed on the first surface I side of the first molded portion 40, and at least one (one in this case) outer through hole 51a is formed on the second surface II side of the first molded portion 40. The outer through hole 51a is a trace of a positioning pin used to fix a portion of the first molded portion 40 when the second molded portion 50 is molded. When the second molded portion 50 is taken out of the mold, the outer through hole 51a is formed as a trace of the positioning pin. The outer through hole 51a penetrates the surface of the first molded portion 40, and a portion of the first molded portion 40 is exposed in the outer through hole 51a. In this embodiment, the positioning pin engages with the recessed portion 41a of the first molded portion 40 to fix the first molded portion 40. Therefore, the recessed portion 41a fixed by the positioning pin when the second molded portion 50 is molded is exposed to the outside of the second molded portion 50 through the outer through hole 51a.

[0087] The cylindrical portion 52 surrounds the exposed portions 31c, 32c, 33c, 34c of the connector in the connection terminal 30. The cylindrical portion 52 and the exposed portions 31c, 32c, 33c, 34c of the connector are formed into a shape suitable for engaging with the connector on the other side connected to other electrical components. For example, the connector on the other side has a plurality of terminal portions on the other side that can be connected to the exposed portions 31c, 32c, 33c, 34c of the connector. The terminal portion on the other side is formed into a columnar terminal shape, for example. The connector on the other side has a housing portion that holds the plurality of terminal portions on the other side at a position corresponding to the position of the exposed portions 31c, 32c, 33c, 34c of the connector. The cylindrical portion 52 is formed into a cylindrical shape that can be inserted into the housing portion of the connector on the other side. Thus, the cylindrical portion 52 and the exposed portions 31c, 32c, 33c, 34c of the connector are directly connected to the connector on the other side connected to other electrical components.

[0088] The connecting portion 53 is located between the head covering portion 51 and the cylindrical portion 52. The connecting portion 53 covers the first exposed portions 12a, 13a, the second exposed portions 22a, 23a of the leads 12, 13, 22, 23, the exposed portions 31a, 32a, 33a, 34a of the connecting terminals 31, 32, 33, 34, and the solder portion 60. Thus, the first leads 12, 13, the second leads 22, 23, the connecting terminals 30, and the solder portion 60 are covered by the second molded portion 50 and are not exposed to the outside of the molded component 1.

[0089] An O-ring 70 is attached to the peripheral portion of the connecting portion 53 closer to the head covering portion 51 than the annular protrusion 54 (see Figure 1 The O-ring 70 is an annular member formed of an elastic member such as rubber. The O-ring 70 is in contact with another member having a shape corresponding to the O-ring 70, so that the O-ring 70 serves as a boundary to block the flow of liquid.

[0090] <Welding work>

[0091] Figure 5 It is an explanatory diagram showing the approach direction of the soldering iron during the soldering operation of the solder portion 60 .

[0092] like Figure 5 As shown, the first exposed portions 12a, 13a of the first leads 12, 13 fixed by the first molded portion 40 and the exposed portions 31a, 32a of the connection terminals 31, 32 (30) are connected by the first solder portions 61a, 61b. In addition, the second exposed portions 22a, 23a of the second leads 22, 23 fixed by the first molded portion 40 and the exposed portions 33a, 34a of the connection terminals 33, 34 (30) are connected by the second solder portions 62a, 62b. The first solder portions 61a, 61b (solder portions 60) and the second solder portions 62a, 62b (solder portions 60) use a metal material (solder) having a lower melting temperature than the leads 12, 13, 22, 23 and the connection terminals 30 to be joined. In the present embodiment, the solder is heated to about 250°C to 350°C by a soldering iron and melted. The molten solder spreads around the connection parts of the first exposed parts 12a, 13a, the second exposed parts 22a, 23a, and the exposed parts 31a, 32a, 33a, 34a. The molten solder is cooled by the external air in the spread state and solidifies again.

[0093] Reference Figure 5For example, when the first exposed portion 12a is connected to the exposed portion 31a, the solder as the material of the solder portion 60 (61a) is arranged close to the first exposed portion 12a and the exposed portion 31a. The soldering iron approaches the solder in the direction of the arrow D1. At this time, there is no component that prevents the soldering iron from approaching the solder. Therefore, the soldering operation of the soldering iron can be carried out smoothly. In addition, the first exposed portion 12a and the exposed portion 31a are separated from the adjacent first exposed portion 13a and the exposed portion 32a by the first partition wall 45. Therefore, even if the first solder portion 61a expands during melting, it can be suppressed from contacting the first exposed portion 13a, the exposed portion 32a and the first solder portion 61b. Thus, a short circuit between the first leads 12 and 13 is prevented.

[0094] When the first exposed portion 13a is connected to the exposed portion 32a, the solder as the material of the solder portion 60 (61b) is arranged close to the first exposed portion 13a and the exposed portion 32a. The soldering iron approaches the solder in the direction of the arrow D2. At this time, there is no component that prevents the soldering iron from approaching the solder. The first exposed portion 13a is adjacent to the second exposed portion 22a in the W direction. However, they are separated by the spacer 43. Therefore, the welding operation of the exposed portion 32a relative to the first exposed portion 13a and the welding operation of the exposed portion 33a relative to the second exposed portion 22a are smoothly performed without worrying about the mutual contact of the solder. In addition, the corner 47a of the first step portion 47 is a chamfered shape. Therefore, the soldering iron can enter in the direction of the arrow D2 without interfering with the corner 47a. As a result, it is easy to perform the welding operation using the soldering iron. In addition, the first exposed portion 13a is separated from the adjacent first exposed portion 12a by the first partition wall 45. Therefore, even if the first solder portion 61b soldering the first exposed portion 13a and the exposed portion 32a spreads due to the melting of the solder, it is possible to suppress contact with the first exposed portion 12a, the exposed portion 31a, and the first solder portion 61a. Thus, a short circuit between the first leads 12 and 13 is prevented, and a short circuit between the first lead 13 and the second lead 22 is prevented.

[0095] In addition, the connection between the second exposed portion 22a and the exposed portion 33a, and the connection between the second exposed portion 23a and the exposed portion 34a are also the same as the connection between the first exposed portion 12a and the exposed portion 31a, and the connection between the first exposed portion 13a and the exposed portion 32a. When the second exposed portion 22a is connected to the exposed portion 33a, the soldering iron approaches in the direction of the arrow D3. At this time, there is no component that prevents the soldering iron from approaching the solder. In addition, by the action of the spacer 43 and the second partition wall 46, there is no need to worry about the mutual contact of the solder and the soldering operation is smoothly performed. In addition, when the second exposed portion 23a is connected to the exposed portion 34a, the soldering iron approaches in the direction of the arrow D4. At this time, there is no component that prevents the soldering iron from approaching the solder. In addition, by the action of the second partition wall 46, there is no need to worry about the mutual contact of the solder and the soldering operation is smoothly performed.

[0096] <Effects of the above-described embodiments>

[0097] Next, an example of the effect produced by the above-described embodiment is shown. In addition, in the following description, the effect is described based on the specific structure illustrated in the above-described embodiment, but it can also be replaced with other specific structures illustrated in the specification of this application within the scope of producing the same effect.

[0098] In addition, the replacement may be performed across a plurality of embodiments. That is, the same effect may be produced by combining the respective structures shown as examples in different embodiments.

[0099] According to the molded component 1 constructed as above, it includes: an internal component module 2, including at least one internal component 10, 20 and a first molded part 40 covering a part of the internal components 10, 20, wherein the at least one internal component 10, 20 has a detection element body 11, 21 as an electrical component body and leads 12, 13, 22, 23 extending from the electrical component body (detection element body 11, 21); a connecting terminal 30 connected to the leads 12, 13, 22, 23 as an electrical conductor connected to other electrical components; a solder part 60 connecting the leads 12, 13, 22, 23 to the electrical conductor (connecting terminal 30); and a second molded part 50 covering the internal component module 2, the electrical conductor (connecting terminal 30) and the solder part 60, wherein the leads 12, 13, 22, 23 include first leads 12, 13 and second leads 22, 23, and the first leads 12, 13 and second leads 22, 23 are connected to the leads 12, 13, 22, 23. The molded portion 40 includes a spacer portion 43, which includes a first surface I and a second surface II facing a direction opposite to the direction facing the first surface I. The first leads 12 and 13 have first exposed portions 12a and 13a exposed from the first molded portion 40 on the first surface I, and the second leads 22 and 23 have second exposed portions 22a and 23a exposed from the first molded portion 40 on the second surface II. When viewed from above in the direction facing the first surface I or the direction facing the second surface II, the first leads 12 and 13 and the second leads 22 and 23 are arranged at non-overlapping positions. The solder portion 60 includes: a first solder portion 61, which is located on the first surface I and connects the first exposed portions 12a and 13a to the electrical conductor (connection terminal 30); and a second solder portion 62, which is located on the second surface II and connects the second exposed portions 22a and 23a to the electrical conductor (connection terminal 30).

[0100] With such a structure, the first solder portion 61 and the second solder portion 62 are arranged on different surfaces on the first surface I and the second surface II. Therefore, the soldering work is easy.

[0101] In addition, since the spacer 43 is provided to separate the first surface I from the second surface II, the contact between the first solder portion 61 and the second solder portion 62 is prevented. Therefore, it is possible to prevent a short circuit between the first lead 13 and the second lead 22 without providing a partition wall between the adjacent first lead 13 and the second lead 22. In particular, the first lead 13 and the second lead 22 are arranged at a position closer to the inside than the arrangement of the first lead 12 and the second lead 23 in the width direction W in the molded component 1. Therefore, it is difficult for the soldering iron to approach the first lead 13 and the second lead 22 from the outside. Therefore, in the welding operation of the first lead 13 and the second lead 22, such a configuration structure of the leads on different surfaces is particularly effective.

[0102] In addition, according to the above molded component 1, the internal components 10, 20 include a first internal component 10 and a second internal component 20, the leads 12, 13 extending from the electrical component body (detection element body 11) in the first internal component 10 are first leads 12, 13, and the leads 22, 23 extending from the electrical component body (detection element body 21) in the second internal component 20 are second leads 22, 23.

[0103] With such a structure, the first leads 12 and 13 extending from the electrical component body (detection element body 11) of the first internal component 10 and the second leads 22 and 23 extending from the electrical component body (detection element body 21) of the second internal component 20 are arranged on different surfaces (first surface I and second surface II). Therefore, it is possible to prevent a short circuit between the first leads 12 and 13 extending from the electrical component body (detection element body 11) of the first internal component 10 and the second leads 22 and 23 extending from the electrical component body (detection element body 21) of the second internal component 20.

[0104] In addition, according to the molded component 1 as described above, the first leads 12, 13 include multiple (here two) first leads 12, 13, the second leads 22, 23 include multiple (here two) second leads 22, 23, and the molded component 1 also has a first partition wall 45 that separates the first leads (first leads 12, 13) and a second partition wall 46 that separates the second leads (second leads 22, 23).

[0105] With such a structure, short circuits between the first leads 12 and 13 or between the second leads 22 and 23 arranged on the same surface (on the first surface I or the second surface II) are prevented. In addition, even if the first partition wall 45 is provided, welding work can be performed from the side of the first leads 12 and 13 different from the first partition wall 45 side (arrow D1 or arrow D2). Therefore, the first partition wall 45 does not become a component that blocks the welding work. Therefore, the first partition wall 45 suppresses the short circuit between the first leads 12 and 13 and suppresses the influence on the difficulty of the welding work.

[0106] In addition, according to the above-mentioned molded component 1, the first surface I is parallel to the second surface II, and the first internal component 10 and the second internal component 20 are arranged in mirror symmetry with respect to an imaginary plane C passing through the middle position of each electrical component body (detection element body 11, 21) and along the extension direction of the first lead 12, 13 and the second lead 22, 23.

[0107] With such a structure, the two internal components (the first internal component 10 and the second internal component 20) are arranged in mirror symmetry with respect to the imaginary plane C passing through the middle position of each electrical component body (detection element body 11, 21), so that the first internal component 10 and the second internal component 20 are in the same posture in the molded component 1. In other words, the postures of the first internal component 10 and the second internal component 20 relative to the object to be detected can be made consistent as much as possible. Therefore, when detecting the object to be detected, the first internal component 10 and the second internal component are easy to output detection signals with the same output characteristics. As a result, the processing of the detection signal becomes easy, and the detection accuracy of the object to be detected can be improved.

[0108] In addition, according to the molded component 1 as described above, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23 (see Figure 5 ), the first surface I is located at a position that is recessed relative to the second surface II in the direction toward which the second surface II is facing.

[0109] With such a structure, the first leads 12 and 13 can be arranged at a position recessed toward the second surface II on the first surface I, so that the bending angle of the first leads 12 and 13 extending from the electrical component body (detection element body 11) becomes gentle. As a result, there is no need to excessively adjust the lead-out angle of the first leads 12 and 13 from the electrical component body (detection element body 11).

[0110] In addition, preferably, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23 (see Figure 5 ), the first surface I is located at a position recessed by the thickness t of the first leads 12 and 13 in the direction toward which the second surface II is directed compared to the second surface II.

[0111] With such a structure, the first leads 12 and 13 can be arranged on the first surface I at a position that is recessed toward the second surface II by the thickness t of the first leads 12 and 13 in the direction toward which the second surface II faces, so that the positions of the first leads 12 and 13 and the second leads 22 and 23 in the thickness direction can be made consistent. The bending of the first leads 12 and 13 extending from the electrical component body (detection element body 11) can be reduced. In addition, for example, in the case of having the first internal component 10 and the second internal component 20, the shapes of the first internal component 10 and the second internal component 20 can be formed into the same shape.

[0112] Preferably, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23 (refer to Figure 5), the second surface II is located at a position that is recessed in the direction toward which the first surface I is facing compared to the first surface I. More preferably, in a cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23 (refer to Figure 5 ), the second surface II is located at a position recessed by the thickness t of the second leads 22 and 23 in the direction toward which the first surface I is directed compared to the first surface I.

[0113] The effect of such a structure is the same as the effect of the structure described above in which the first surface I is located at a position recessed from the second surface II in the direction in which the second surface II faces, and therefore the description thereof is omitted.

[0114] In addition, according to the molded component 1 described above, the spacer 43 has a first step portion 47 between the first surface I and the back surface II-2 of the second surface II, and a second step portion 48 between the second surface II and the back surface I-2 of the first surface I, and the corner portion 47a between the first surface I, the end of the first surface I, and the end of the back surface II-2 of the second surface II is a chamfered shape, and the corner portion 48a between the second surface II, the end of the second surface II, and the end of the back surface I-2 of the first surface I is a chamfered shape. In addition, the chamfered shape refers to a shape having a chamfered surface with corners removed. However, the chamfered surface may be a flat surface or a curved surface.

[0115] With this structure, the corner 47a of the first step portion 47 is chamfered, which facilitates welding to the first leads 12 and 13. The corner 48a of the second step portion 48 is chamfered, which facilitates welding to the second leads 22 and 23.

[0116] <Others>

[0117] Figure 6 It is an explanatory diagram showing a cross-sectional view perpendicular to the extending direction of the leads 212 , 213 , 222 , and 223 in another embodiment.

[0118] In the above-mentioned embodiment, the leads 12 and 13 extending from the detection element body 11 of the first inner member 10 are the first leads 12 and 13, and the leads 22 and 23 extending from the detection element body 21 of the second inner member 20 are the second leads 22 and 23. Figure 6 The embodiment of is a different structure therefrom.

[0119] exist Figure 6In the embodiment, lead 212 among the multiple (here two) leads 212 and 213 extending from the detection element body 211 is the first lead 212, and lead 213 is the second lead 213. Similarly, lead 222 among the multiple (here two) leads 222 and 223 extending from the detection element body 221 is the first lead 222, and lead 223 is the second lead 223. That is, leads 212 and 222 are arranged on the first surface I, and leads 213 and 223 are arranged on the second surface II. Even with such a configuration, since adjacent solder portions 260 are arranged on different surfaces, contact between solder portions 260 can be suppressed. In addition, the first leads 212 and 222 and the second leads 213 and 223 are collectively referred to as "leads" herein.

[0120] In addition, when the adjacent first leads 212, 222 and second leads 213, 223 are arranged alternately on the first surface I and the second surface II along the parallel direction of the leads, the leads 212, 213, 222, 223 are separated by the spacers 243. Therefore, partition walls between the leads 212, 213, 222, 223 are not required.

[0121] in addition, Figure 7 It is an explanatory diagram showing a cross-sectional view perpendicular to the extending direction of the leads 312 , 313 , 322 , and 323 in another embodiment.

[0122] In the above-mentioned embodiment, in the cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23, the first surface I is located at a position recessed in the direction toward which the second surface II is directed compared to the second surface II, and in the cross-sectional view perpendicular to the extending direction of the first leads 12, 13 and the second leads 22, 23, the second surface II is located at a position recessed in the direction toward which the first surface I is directed compared to the first surface I, but Figure 7 The embodiment of the present invention has a different structure from this.

[0123] exist Figure 7 In the embodiment, the first surface I is not recessed in the direction toward which the second surface II is facing. There is no step difference between the first surface I and the back surface II-2 of the second surface II, and they are in a flat state. In addition, the second surface II is not recessed in the direction toward which the first surface I is facing. There is no step difference between the second surface II and the back surface I-2 of the first surface I, and they are in a flat state. The first surface I is not recessed in the direction toward which the second surface II is facing, and the second surface II is not recessed in the direction toward which the first surface I is facing, so the positions of the first leads 312, 313 and the second leads 322, 323 in the thickness direction are staggered. However, in such a structure, it is also possible to suppress contact between adjacent solder portions 360. In addition, since no recess is formed, the structure of the first molded portion 40 can also be simplified.

[0124] In addition, in the above-mentioned embodiment, the structure is provided with two internal components 10 and 20, but the number of internal components may be one or more than three. As long as the structure as a whole has a plurality of leads, it is included in the present invention. In the case of one internal component, the one internal component may have a plurality of leads, which are separately arranged on the first surface I and the second surface II of the partition 43.

[0125] In addition, in the above-mentioned embodiment, one internal component 10 (20) has two leads 12, 13 (22, 23), but the present invention is not limited thereto. Whether one internal component has one lead or one internal component has three or more leads, the present invention includes both. However, when one internal component has one lead, as long as it is configured to have other internal components having one or more leads, the overall configuration may be a configuration having a plurality of leads.

[0126] In addition, in the above-mentioned embodiment, the first leads 12 and 13 and the second leads 22 and 23 are each provided with two first leads 12 and 13 and the first partition wall 45 and the second partition wall 46 are provided to partition the first leads 12 and 13, but the present invention is not limited thereto. Even if the first leads or the second leads are provided with three or more partition walls between the first leads or the second leads, the present invention also includes them.

[0127] In addition, in the above-mentioned embodiment, the corner 47a of the first step portion 47 is chamfered, and the corner 48a of the second step portion 48 is also chamfered, but the present invention is not limited thereto. The corner 47a of the first step portion 47 or the corner 48a of the second step portion 48 is R-shaped, which is also included in the present invention.

[0128] In addition, in the above-mentioned embodiment, the connection terminal 30 is used as an electric conductor connected to other electric components, but it is not limited to this. As the electric conductor, even if a general electric wire is used, it is also included in the present invention. In this case, the core wire exposed at the end of the electric wire can be welded to the lead wire as an electric conductor.

[0129] In the above embodiment, the first molded portion 40 includes the connection terminal holding portion 42 that holds a portion of the connection terminal 30 , but the present invention is not limited thereto. Any configuration in which the first molded portion 40 includes a partition portion including the first surface and the second surface is encompassed by the present invention.

[0130] In addition, in the above-mentioned embodiment, when the first molded portion 40 is molded, the first internal component 10 and the second internal component 20 are molded as inserts, but it is not limited to this. When the first molded portion 40 is molded, the first internal component 10 and the second internal component 20 may not be molded as inserts. Therefore, a structure in which the inner through hole 41b is not formed can be adopted. For example, the first molded portion having a recessed portion in which the first internal component 10 and the second internal component 20 can be embedded can be molded separately from the first internal component 10 and the second internal component 20, and the first internal component 10 and the second internal component 20 can be embedded in the recessed portion of the first molded portion 40. In this case, the first molded portion can also be a collection of multiple components assembled in a manner that can accommodate the first internal component 10 and the second internal component 20 inside.

[0131] <Regarding Modifications of the Embodiments Described Above>

[0132] In the above-described embodiments, the material, size, shape, relative configuration relationship or implementation conditions of each component are sometimes described, but these are only examples in all aspects and are not limited to the contents described in the specification of this application.

[0133] Therefore, numerous variations and equivalents not shown in the examples are conceivable within the scope of the technology disclosed in the present specification, including, for example, variations, additions, or omissions of at least one constituent element, and extraction of at least one constituent element in at least one embodiment and combination with constituent elements in other embodiments.

[0134] Description of Reference Numerals

[0135] 1 Molded parts

[0136] 2 Internal components module

[0137] 10 First internal part (internal part)

[0138] 11, 21, 211, 221 Detection element body

[0139] 12, 13, 212, 222, 312, 313 First lead (lead)

[0140] 12a, 13a First exposed portion

[0141] 20 Second internal part (internal part)

[0142] 22, 23, 213, 223, 322, 323 Second lead (lead)

[0143] 22a, 23a Second exposed portion

[0144] 30, 31, 32, 33, 34 connection terminals

[0145] 31a, 32a, 33a, 34a exposed parts

[0146] 31c, 32c, 33c, 34c Connector exposed part

[0147] 40 First Forming Department

[0148] 41 Head

[0149] 41a recess

[0150] 41b Inner through hole

[0151] 42 Connecting terminal holding portion

[0152] 43, 243 Connecting part (spacer)

[0153] 44 Loading section

[0154] 44a First mounting surface

[0155] 44b Second mounting surface

[0156] 45 First partition wall

[0157] 46 Second partition wall

[0158] 47 First step

[0159] 47a Corner

[0160] 48 Second step

[0161] 48a Corner

[0162] 50 Second Forming Department

[0163] 51 Head Covering

[0164] 51a External through hole

[0165] 52 cylindrical part

[0166] 53 Connection

[0167] 54 annular protrusion

[0168] 60, 260, 360 solder parts

[0169] 61, 61a, 61b: first solder portion (solder portion)

[0170] 62, 62a, 62b: second solder portion (solder portion)

[0171] 70 O-ring

[0172] C side

[0173] D1, D2, D3, D4 Arrows

[0174] I. First page

[0175] I-2 Back

[0176] II Side 2

[0177] II-2 Back

[0178] L Length direction

[0179] W Width direction

Claims

1. A molded component comprising: An internal component module includes at least one internal component and a first molded portion, wherein the internal component has an electrical component body and leads extending from the electrical component body, and the first molded portion covers a portion of the internal component; an electrical conductor connected to the lead wire and to other electrical components; a solder portion connecting the lead wire to the electrical conductor; and a second molded portion covering the internal component module, the electrical conductor, and the solder portion, The lead includes a first lead and a second lead, The first molded portion includes a spacer portion, the spacer portion includes a first surface and a second surface, the second surface faces a direction opposite to a direction faced by the first surface, The first lead has a first exposed portion, and the first exposed portion is exposed from the first molded portion on the first surface. The second lead has a second exposed portion, and the second exposed portion is exposed from the first molded portion on the second surface. The first lead and the second lead are arranged at non-overlapping positions when viewed from a direction toward which the first surface is facing or a direction toward which the second surface is facing. The solder portion comprises: a first solder portion located on the first surface and connecting the first exposed portion to the electrical conductor; and a second solder portion located on the second surface and connecting the second exposed portion to the electrical conductor.

2. The molded component according to claim 1, wherein: The internal components include a first internal component and a second internal component, The lead extending from the electrical component body in the first internal component is the first lead, The lead extending from the electrical component body in the second inner component is the second lead.

3. The molded component according to claim 2, wherein: The first lead includes a plurality of first leads, The second lead includes a plurality of second leads, The first molded portion includes a first partition wall and a second partition wall, the first partition wall partitioning the first leads from each other, and the second partition wall partitioning the second leads from each other.

4. The molded component according to claim 2 or 3, wherein: The first inner component and the second inner component are arranged in mirror symmetry with respect to an imaginary plane which passes through the middle positions of the respective electrical component bodies and is along the extending direction of the lead wires.

5. The molded component according to claim 4, wherein: In a cross-sectional view perpendicular to the extending direction of the lead, the first surface is located at a position recessed relative to the second surface in a direction toward which the second surface faces.

6. The molded component according to claim 5, wherein: In a cross-sectional view perpendicular to the extending direction of the lead, the first surface is located at a position recessed from the second surface in a direction in which the second surface faces by an amount equal to the thickness of the lead.

7. The molded component according to claim 5, wherein: The partition has a first step portion and a second step portion, the first step portion is located between the first surface and the back surface of the second surface, and the second step portion is located between the second surface and the back surface of the first surface. The corner of the first step portion is chamfered. The corner of the second step portion is chamfered.

Images