High-efficiency double-sided liquid cooling frequency converter

Abstract

The invention discloses a high-efficiency double-sided liquid cooling frequency converter, which comprises a shell, a liquid cooling plate is fixedly arranged in the shell, and a silicon carbide module is fixedly arranged on the first mounting surface; a PCBA board is arranged on the side, away from the liquid cooling plate, of the silicon carbide module. A film capacitor is fixedly arranged on the second mounting surface; a rectifier bridge and a contactor are fixedly arranged above the membrane capacitor; the liquid cooling channel comprises a plurality of vertical channels which are distributed in parallel, and the top ends or the bottom ends of the adjacent vertical channels are communicated through transverse channels, so that the liquid cooling channel is S-shaped. According to the frequency converter, the layout of the internal structure of the frequency converter is optimized, the electric appliance elements on the two sides are cooled by the liquid cooling plate at the same time, the cooling efficiency is improved, the equipment size is reduced, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of frequency converters, and in particular to a high-efficiency double-sided liquid-cooled frequency converter. Background Art

[0002] The variable-frequency drive (VFD) is an electric power control device that uses frequency conversion technology and microelectronics technology to control AC motors by changing the frequency of the motor's working power supply. Most of the existing inverter water cooling systems or air cooling systems are mainly used to dissipate heat for IGBT modules or silicon carbide modules, and other components such as rectifier bridges, contactors, capacitors, etc. are not dissipated. The liquid cooling plate is a flat structure, and usually only power modules and electrical components are placed on one side of the liquid cooling plate. In this way, if you want to dissipate heat for other components inside the inverter, the flow channel area needs to be expanded, the flow channel is more complex, and the size of the whole machine will also increase. The utilization rate of the liquid cooling plate heat dissipation system is low and the cost is higher. Summary of the invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a high-efficiency double-sided liquid-cooled inverter, which optimizes the layout of the internal structure of the inverter, enables the liquid cooling plate to cool the electrical components on both sides at the same time, improves the cooling efficiency, reduces the equipment size, and reduces the cost.

[0004] The present invention provides a high-efficiency double-sided liquid-cooled inverter, comprising a housing; a liquid cooling plate is fixedly arranged in the housing, and the liquid cooling plate has a first mounting surface and a second mounting surface opposite to each other; a liquid inlet is provided at one end of the bottom of the liquid cooling plate, and a liquid outlet is provided at the other end; a liquid cooling channel is provided in the liquid cooling plate, which is respectively connected to the liquid inlet and the liquid outlet;

[0005] A silicon carbide module is fixedly arranged on the first mounting surface; a PCBA board is arranged on a side of the silicon carbide module away from the liquid cooling plate, and the PCBA board is fixedly connected to the liquid cooling plate by screws;

[0006] A membrane capacitor is fixedly arranged on the second mounting surface above the liquid inlet and the liquid outlet; a rectifier bridge and a contactor are fixedly arranged on the second mounting surface above the membrane capacitor, and a pre-charging resistor is fixedly arranged on one side of the membrane capacitor; the rectifier bridge is located above the liquid inlet, and the contactor is located above the liquid outlet;

[0007] The liquid cooling channel includes a plurality of vertical channels distributed in parallel, and the top ends or bottom ends of adjacent vertical channels are connected through a transverse channel, so that the liquid cooling channel is S-shaped; the portion on the first mounting surface corresponding to the silicon carbide module is a silicon carbide heat dissipation zone, and the liquid cooling channel continuously and reciprocates through the silicon carbide heat dissipation zone; the portion on the second mounting surface corresponding to the membrane capacitor is a membrane capacitor heat dissipation zone, and the liquid cooling channel continuously and reciprocates through the membrane capacitor heat dissipation zone; the portion on the second mounting surface corresponding to the rectifier bridge is a rectifier bridge heat dissipation zone; the portion on the second mounting surface corresponding to the contactor is a contactor heat dissipation zone.

[0008] Furthermore, the shell includes a frame, a front cover plate arranged on the front side of the frame, and a rear cover plate arranged on the rear side of the frame; the front cover plate and the rear cover plate are fixedly connected to the frame by screws respectively; sealing strips are respectively arranged between the front cover plate and the frame and between the rear cover plate and the frame; a mounting plate is fixedly connected to the rear side of the top of the frame, and a mounting hole is opened on the mounting plate.

[0009] Furthermore, an input interface, an output interface and a communication interface are fixedly provided on one side of the shell, and the input interface, the output interface and the communication interface are electrically connected to the PCBA board respectively.

[0010] Furthermore, the liquid inlet is fixedly connected to a liquid inlet nozzle extending from the bottom of the shell; the liquid outlet is fixedly connected to a liquid outlet nozzle extending from the bottom of the shell.

[0011] Furthermore, the silicon carbide module, the membrane capacitor and the rectifier bridge are electrically connected to the PCBA board respectively; and the contactor is electrically connected to the membrane capacitor, the rectifier bridge and the pre-charging resistor respectively.

[0012] Furthermore, a receiving groove is provided on the first mounting surface, the liquid cooling channel is arranged in the receiving groove, a sealing cover plate is fixedly installed on the receiving groove by screws, and a circle of sealing ring is provided between the sealing cover plate and the receiving groove at the periphery of the liquid cooling channel.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The frequency converter of the present invention places the silicon carbide module and PCBA board on the first mounting surface of the liquid cooling plate, and places the membrane capacitor, rectifier bridge, contactor and pre-charge resistor on the second mounting surface of the liquid cooling plate; the liquid cooling plate adopts a single-layer flat plate structure, and through the arrangement of the liquid cooling channel, a silicon carbide heat dissipation area is formed on the first mounting surface, and a membrane capacitor heat dissipation area, a rectifier bridge heat dissipation area and a contactor heat dissipation area are formed on the second mounting surface. The coolant flows through the liquid cooling channel and dissipates the heat for the electrical components on both sides of the liquid cooling plate at the same time, which reduces the area of ​​the liquid cooling channel and the volume of the liquid cooling plate, thereby reducing the overall volume of the frequency converter, improving the utilization rate of the liquid cooling channel, maximizing the utilization effect of the liquid cooling plate, saving processing costs and material costs, and having extremely high promotion and use value.

[0015] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0017] Figure 1 It is a schematic diagram of the structure of a high-efficiency double-sided liquid-cooled inverter;

[0018] Figure 2 It is a schematic diagram of the component structure of the first mounting surface of the liquid cooling plate;

[0019] Figure 3 is a schematic diagram of the component structure of the second mounting surface of the liquid cooling plate;

[0020] Figure 4 It is a side view structural diagram of the internal components of the inverter;

[0021] Figure 5 Schematic diagram of the structure of the liquid cooling channel.

[0022] Numbers in the figure: 1. Shell; 2. Liquid cooling plate; 3. Silicon carbide module; 4. PCBA board; 5. Membrane capacitor; 6. Rectifier bridge; 7. Contactor; 8. Pre-charge resistor;

[0023] 11. Frame; 12. Front cover; 13. Rear cover; 14. Mounting plate; 15. Mounting hole; 16. Input interface; 17. Output interface; 18. Communication interface;

[0024] 21. First mounting surface; 22. Second mounting surface; 23. Liquid inlet; 24. Liquid outlet; 25. Liquid cooling channel; 26. Liquid inlet nozzle; 27. Liquid outlet nozzle; 28. Storage slot; 29. ​​Sealing cover plate;

[0025] 251. Vertical channel; 252. Horizontal channel. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] Please refer to Figure 1 to Figure 5 The embodiment of the present invention provides a high-efficiency double-sided liquid-cooled inverter, comprising a housing 1; a liquid cooling plate 2 is fixedly arranged in the housing 1, and the liquid cooling plate 2 has a first mounting surface 21 and a second mounting surface 22 opposite to each other; a liquid inlet 23 is provided at one end of the bottom of the liquid cooling plate 2, and a liquid outlet 24 is provided at the other end; a liquid cooling channel 25 is provided in the liquid cooling plate 2, which is respectively connected with the liquid inlet 23 and the liquid outlet 24;

[0029] A silicon carbide module 3 is fixedly arranged on the first mounting surface 21; a PCBA board 4 is arranged on a side of the silicon carbide module 3 away from the liquid cooling plate 2, and the PCBA board 4 is fixedly connected to the liquid cooling plate 2 by screws;

[0030] A membrane capacitor 5 is fixedly arranged on the second mounting surface 22 above the liquid inlet 23 and the liquid outlet 24; a rectifier bridge 6 and a contactor 7 are fixedly arranged on the second mounting surface 22 above the membrane capacitor 5, and a pre-charging resistor 8 is fixedly arranged on one side of the membrane capacitor 5; the rectifier bridge 6 is located above the liquid inlet 23, and the contactor 7 is located above the liquid outlet 24;

[0031] The liquid cooling channel 25 includes a plurality of parallel vertical channels 251, and the top ends or bottom ends of adjacent vertical channels 251 are connected through transverse channels 252, so that the liquid cooling channel 25 is S-shaped; the portion on the first mounting surface 21 corresponding to the silicon carbide module 3 is the silicon carbide heat dissipation zone, and the liquid cooling channel 25 continuously and reciprocates through the silicon carbide heat dissipation zone; the portion on the second mounting surface 22 corresponding to the membrane capacitor 5 is the membrane capacitor heat dissipation zone, and the liquid cooling channel 25 continuously and reciprocates through the membrane capacitor heat dissipation zone; the portion on the second mounting surface 22 corresponding to the rectifier bridge 6 is the rectifier bridge heat dissipation zone; the portion on the second mounting surface 22 corresponding to the contactor 7 is the contactor heat dissipation zone.

[0032] In this embodiment, the liquid cooling plate 2 adopts a single-layer flat plate structure, and the silicon carbide module 3 and the PCBA board 4 are arranged on the first mounting surface 21 of the liquid cooling plate 2 in an inner and outer distribution, and the membrane capacitor 5, the rectifier bridge 6, the contactor 7 and the pre-charging resistor 8 are arranged on the second mounting surface 22 of the liquid cooling plate 2;

[0033] The liquid cooling channel 25 is arranged to continuously reciprocate through the silicon carbide heat dissipation area to dissipate heat for the key heat-generating device silicon carbide module 3; at the same time, the liquid cooling channel 25 first passes through the membrane capacitor heat dissipation area, then passes through the rectifier bridge heat dissipation area, then returns to the membrane capacitor heat dissipation area, and then passes through the contactor heat dissipation area to dissipate heat for the membrane capacitor 5, the rectifier bridge 6 and the contactor 7.

[0034] The coolant flows through the liquid cooling channel 25 and dissipates heat to the electrical components on both sides of the liquid cooling plate 2, thereby reducing the area of ​​the liquid cooling channel and the volume of the liquid cooling plate 2, thereby reducing the overall volume of the inverter, improving the utilization rate of the liquid cooling channel 25, maximizing the utilization effect of the liquid cooling plate 2, saving processing costs and material costs, and having extremely high promotion and utilization value.

[0035] In a preferred embodiment, if Figure 1 As shown, the housing 1 includes a frame 11, a front cover 12 arranged on the front side of the frame 11, and a rear cover 13 arranged on the rear side of the frame 11; the front cover 12 and the rear cover 13 are fixedly connected to the frame 11 by screws respectively; sealing strips are respectively arranged between the front cover 12 and the frame 11 and between the rear cover 13 and the frame 11; a mounting plate 14 is fixedly connected to the rear side of the top of the frame 11, and a mounting hole 15 is opened on the mounting plate 14.

[0036] In this embodiment, the electrical components of the inverter are encapsulated by the frame 11, the front cover 12 and the rear cover 13, the front cover 12 and the rear cover 13 are sealed by a sealing strip, and the housing 1 is fixed and installed by screws passing through the mounting holes 15, which is convenient to install and firmly fixed.

[0037] In a preferred embodiment, if Figure 1 As shown, an input interface 16 , an output interface 17 and a communication interface 18 are fixedly provided on one side of the housing 1 , and the input interface 16 , the output interface 17 and the communication interface 18 are electrically connected to the PCBA board 4 respectively.

[0038] In a preferred embodiment, if Figure 1 and Figure 5 As shown, the liquid inlet 23 is fixedly connected to a liquid inlet nozzle 26 extending from the bottom of the housing 1; the liquid outlet 24 is fixedly connected to a liquid outlet nozzle 27 extending from the bottom of the housing 1. One end of the liquid cooling channel 25 is connected to the coolant input pipeline through the liquid inlet nozzle 26, and the other end is connected to the coolant circulation pipeline through the liquid outlet nozzle 27, realizing circulating cooling and good heat dissipation effect.

[0039] In a preferred embodiment, if Figure 2 and Figure 3 As shown, the silicon carbide module 3, the membrane capacitor 5 and the rectifier bridge 6 are electrically connected to the PCBA board 4 respectively; the contactor 7 is electrically connected to the membrane capacitor 5, the rectifier bridge 6 and the pre-charging resistor 8 respectively.

[0040] In a preferred embodiment, if Figure 5 As shown, a receiving groove 28 is provided on the first mounting surface 21, and the liquid cooling channel 25 is arranged in the receiving groove 28. A sealing cover plate 29 is fixedly installed on the receiving groove 28 by screws, and a circle of sealing ring is provided between the sealing cover plate 29 and the receiving groove 28 and located on the outer periphery of the liquid cooling channel 25.

[0041] In this embodiment, the liquid cooling channel 25 is directly machined in the receiving groove 28 of the liquid cooling plate 2, and the processing is convenient; the liquid cooling channel 25 is covered and sealed by the sealing cover plate 29 and the sealing ring, and the sealing effect is good.

[0042] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In the description of this specification, the description of the terms "one embodiment", "some embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high-efficiency double-sided liquid-cooled inverter, characterized in that: The invention comprises a shell (1); a liquid cooling plate (2) is fixedly arranged in the shell (1), and the liquid cooling plate (2) has a first mounting surface (21) and a second mounting surface (22) opposite to each other; a liquid inlet (23) is provided at one end of the bottom of the liquid cooling plate (2), and a liquid outlet (24) is provided at the other end; and a liquid cooling channel (25) is provided in the liquid cooling plate (2) and is respectively connected to the liquid inlet (23) and the liquid outlet (24); A silicon carbide module (3) is fixedly arranged on the first mounting surface (21); a PCBA board (4) is arranged on a side of the silicon carbide module (3) away from the liquid cooling plate (2), and the PCBA board (4) is fixedly connected to the liquid cooling plate (2) by means of screws; A membrane capacitor (5) is fixedly arranged on the second mounting surface (22) above the liquid inlet (23) and the liquid outlet (24); a rectifier bridge (6) and a contactor (7) are fixedly arranged on the second mounting surface (2) above the membrane capacitor (5), and a pre-charging resistor (8) is fixedly arranged on one side of the membrane capacitor (5); the rectifier bridge (6) is located above the liquid inlet (23), and the contactor (7) is located above the liquid outlet (24); The liquid cooling channel (25) comprises a plurality of vertical channels (251) distributed in parallel, and the top ends or bottom ends of adjacent vertical channels (251) are connected via a transverse channel (252), so that the liquid cooling channel (25) is S-shaped; the portion on the first mounting surface (21) corresponding to the silicon carbide module (3) is a silicon carbide heat dissipation zone, and the liquid cooling channel (25) continuously and reciprocally passes through the silicon carbide heat dissipation zone; the portion on the second mounting surface (22) corresponding to the membrane capacitor (5) is a membrane capacitor heat dissipation zone, and the liquid cooling channel (25) continuously and reciprocally passes through the membrane capacitor heat dissipation zone; the portion on the second mounting surface (22) corresponding to the rectifier bridge (6) is a rectifier bridge heat dissipation zone; and the portion on the second mounting surface (22) corresponding to the contactor (7) is a contactor heat dissipation zone.

2. The high-efficiency double-sided liquid-cooled inverter according to claim 1, characterized in that: The housing (1) comprises a frame (11), a front cover plate (12) arranged on the front side of the frame (11), and a rear cover plate (13) arranged on the rear side of the frame (11); the front cover plate (12) and the rear cover plate (13) are fixedly connected to the frame (11) by screws respectively; sealing strips are respectively arranged between the front cover plate (12) and the frame (11) and between the rear cover plate (13) and the frame (11); a mounting plate (14) is fixedly connected to the rear side of the top of the frame (11), and a mounting hole (15) is provided on the mounting plate (14).

3. The high-efficiency double-sided liquid-cooled inverter according to claim 1, characterized in that: An input interface (16), an output interface (17) and a communication interface (18) are fixedly provided on one side of the housing (1), and the input interface (16), the output interface (17) and the communication interface (18) are electrically connected to the PCBA board (4) respectively.

4. The high-efficiency double-sided liquid-cooled inverter according to claim 1, characterized in that: The liquid inlet (23) is fixedly connected to a liquid inlet nozzle (26) extending from the bottom of the shell (1); and the liquid outlet (24) is fixedly connected to a liquid outlet nozzle (27) extending from the bottom of the shell (1).

5. The high-efficiency double-sided liquid-cooled inverter according to claim 1, characterized in that: The silicon carbide module (3), the membrane capacitor (5) and the rectifier bridge (6) are respectively electrically connected to the PCBA board (4); and the contactor (7) is respectively electrically connected to the membrane capacitor (5), the rectifier bridge (6) and the pre-charging resistor (8).

6. The high-efficiency double-sided liquid-cooled inverter according to claim 1, characterized in that: A receiving groove (28) is provided on the first mounting surface (21), the liquid cooling channel (25) is arranged in the receiving groove (28), a sealing cover plate (29) is fixedly installed on the receiving groove (28) by screws, and a circle of sealing ring is provided between the sealing cover plate (29) and the receiving groove (28) and located on the outer periphery of the liquid cooling channel (25).

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