Water-fluorine heat exchanger for semiconductor production and heat exchange method

Abstract

The invention discloses a water-fluorine heat exchanger for semiconductor production and a heat exchange method, and relates to the technical field of semiconductor processing heat exchange. The water-fluorine heat exchanger comprises a machine body, a water tank is arranged at the upper end of the machine body, and the water tank, a cooling liquid extraction pipe and a cooling liquid guide pipe form a cooling liquid conveying loop; the cooling liquid guiding and conveying pipe, the heat exchange pipe, the cooling liquid guiding-out pipe and the cooling liquid inlet pipe form a cooling circulation loop, the normal-temperature water input pipe, the water cavity and the normal-temperature water output pipe form a normal-temperature water loop, a PLC used for controlling the PID electric proportional valve is fixedly installed on the inner wall of the side control cavity, and a COM port of the touch screen is connected with a communication port of the PLC. Normal-temperature water is used for carrying out heat exchange on fluorinated liquid, then the fluorinated liquid flows through production equipment to be efficiently cooled, a PLC is used for executing a temperature signal needed by normal operation, the opening angle of a PID electric proportional valve is controlled, the inlet flow of the normal-temperature water is controlled, heat exchange between the water and the fluorinated liquid is accurately achieved, and the production efficiency is improved. And the operation temperature of the production equipment is kept in an optimal state.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing heat exchange, and in particular to a water-fluorine heat exchanger and a heat exchange method for semiconductor production. Background Art

[0002] Semiconductor production has extremely high requirements for temperature, humidity and cleanliness, and needs to be carried out in a clean, dust-free and static-free environment. Semiconductor materials are extremely sensitive to temperature during processing, and even slight temperature changes may affect product quality. For example, in some semiconductor production process steps, such as lasers, reactors, etching, and photolithography, a large amount of heat is generated during operation, which requires precise temperature control. For this reason, heat exchangers are needed to adjust the temperature and humidity of the production environment during the production process to provide a stable and reliable environment for semiconductor production.

[0003] In the current semiconductor production process, heat exchange equipment is used to maintain a stable production environment and ensure the normal operation of equipment. Cooling towers are common heat exchange equipment in semiconductor factories. They remove heat through water circulation. After absorbing heat, the water in the cooling tower releases the heat into the atmosphere through evaporation and heat dissipation, thereby achieving a cooling effect. This type of equipment is usually used in the cooling system of large semiconductor production lines.

[0004] However, in the actual semiconductor production process, the heat exchange efficiency of the cooling tower is often reduced due to ventilation blockage, filler blockage, and imbalance of circulating water. At the same time, the heat generated in the semiconductor production process may be very concentrated and large in amount, and the cooling tower may not be able to quickly process this heat in a short period of time, resulting in reduced production efficiency or overheating of the equipment, and thus unable to meet the precise and high heat dissipation requirements in the semiconductor production process. Summary of the invention

[0005] The object of the present invention is to provide a water-fluorine heat exchanger and a heat exchange method for semiconductor production to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a water-fluorine heat exchanger for semiconductor production, comprising:

[0007] A machine body, wherein a water tank is provided at the upper end of the machine body, and the water tank is filled with fluorinated liquid;

[0008] The body is provided with a pipeline installation cavity, a magnetic pump and a plate heat exchanger are installed on the bottom wall of the pipeline installation cavity, the liquid inlet of the magnetic pump is connected to a coolant extraction pipe, and the coolant extraction pipe is connected to the bottom wall of the water tank; a water cavity is provided in the plate heat exchanger, and the two opposite side walls of the plate heat exchanger are respectively connected to a coolant guide pipe and a coolant outlet pipe, a heat exchange pipe is built in the water cavity, and the two ends of the heat exchange pipe are respectively connected to the coolant guide pipe and the coolant outlet pipe, and the other end of the coolant guide pipe is connected to the liquid outlet of the magnetic pump; the bottom wall of the water tank is also connected to a coolant inlet pipe, and the end of the coolant inlet pipe is used to connect to the liquid outlet port of the production equipment;

[0009] The water tank, the coolant extraction pipe and the coolant guide pipe constitute a coolant delivery loop, and the coolant guide pipe, the heat exchange pipe, the coolant outlet pipe and the coolant inlet pipe constitute a cooling circulation loop;

[0010] The two opposite side walls of the plate heat exchanger are also connected to a normal temperature water input pipe and a normal temperature water output pipe respectively, and the normal temperature water input pipe, the water cavity and the normal temperature water output pipe constitute a normal temperature water circuit;

[0011] A PID electric proportional valve is installed on the normal temperature water input pipe, and a side control cavity is also provided in the body. A PLC for controlling the PID electric proportional valve is fixedly installed on the inner wall of the side control cavity. A cabinet door is hingedly connected to the opening of the side control cavity, and a touch screen is embedded in the cabinet door. The COM port of the touch screen is connected to the communication port of the PLC.

[0012] In a further embodiment, an inspection port is provided at the upper end of the water tank, a cover 1 is detachably installed at the opening of the inspection port, and an upper cover covering the water tank is installed at the upper end of the machine body;

[0013] A liquid-adding elbow is connected to one side wall of the water tank, and a second sealing cap is threadedly connected to the pipe opening of the liquid-adding elbow;

[0014] A connecting pipe is inserted into both upper and lower ends of one side of the water tank, and a liquid level meter is connected between the ends of the two connecting pipes located outside the water tank.

[0015] In a further embodiment, the upper end surface of the water tank is respectively provided with a positive pressure valve and a negative pressure valve extending into the water tank;

[0016] A liquid level float switch fixedly connected to the top wall of the water tank is also installed in the water tank, and a signal output port of the liquid level float switch is connected to a signal input port of the PLC.

[0017] In a further embodiment, a temperature sensor 1 and a pressure sensor 1 are also installed on the coolant outlet pipe.

[0018] In a further embodiment, a flow meter 1 and a temperature sensor 3 are installed on the coolant inlet pipe.

[0019] In a further embodiment, a second pressure sensor and a second temperature sensor are installed on the normal temperature water input pipe;

[0020] A Y-type filter 1 is installed on the normal temperature water input pipe, and a Y-type filter 2 is installed on the coolant inlet pipe. Both the Y-type filter 1 and the Y-type filter 2 are plugged with cylindrical filter screens, and the end openings of the Y-type filter 1 and the Y-type filter 2 are threadedly connected with end caps.

[0021] In a further embodiment, an expansion module, a circuit breaker, an AC contactor, a transformer, a terminal block 1, a switching power supply and a frequency converter are also installed on the inner wall of the side control cavity;

[0022] The circuit breaker terminal is connected to the AC contactor terminal, the signal output port of the AC contactor is connected to the signal input port of the frequency converter, and the output port of the frequency converter is connected to the power port of the magnetic pump;

[0023] The connection terminal of the switching power supply is connected to the connection point of terminal row one, which is expanded into a plurality of 24V DC connection points, the output port of the transformer is connected to terminal row two, which is expanded into a plurality of 220V unidirectional electrical connection points, and the expansion module includes an input analog module and an output analog module;

[0024] The signal input ports of temperature sensor 1, temperature sensor 2, temperature sensor 3, flow meter 1, flow meter 2, pressure sensor 1 and pressure sensor 2 are all connected to the input analog module terminals, and the signal output ports of the frequency converter and the signal output ports of the PID electric proportional valve are all connected to the output analog module terminals.

[0025] In a further embodiment, a cooling fan is also installed on the inner wall of the side control cavity.

[0026] In a further embodiment, the radial side wall of the coolant outlet pipe is also connected to a branch pipe, a manual valve is also installed on the side wall of the branch pipe, the end of the branch pipe is connected to a return pipe, and the end of the return pipe is connected to the bottom wall of the water tank.

[0027] Also disclosed is a heat exchange method for a water-fluorine heat exchanger used in semiconductor production, comprising the following steps:

[0028] A1. The fluorinated liquid first circulates into the plate heat exchanger to exchange heat with normal temperature water. After the heat exchange, the fluorinated liquid enters the production equipment for heat exchange. After the heat exchange with the equipment, the fluorinated liquid flows back to the water tank, which is a circulating cooling loop.

[0029] A2. At the same time, PLC is used to execute the temperature signal required for the normal operation of a production equipment, and the opening angle of the PID electric proportional valve is controlled to control the inflow of normal temperature water, and accurately realize the heat exchange between water and fluorinated liquid in the plate heat exchanger until the operating temperature of the production equipment reaches the preset temperature.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] Before the fluorinated liquid in the present invention enters the production equipment for heat exchange, it is first circulated to the plate heat exchanger for heat exchange with normal temperature water. After the heat exchange, the fluorinated liquid flows out and enters the production equipment for heat exchange. After the heat exchange with the equipment, the fluorinated liquid flows back to the water tank, which is a circulating cooling loop. At the same time, the PLC is used to execute a temperature signal required for the normal operation of the production equipment, and the opening angle of the PID electric proportional valve is controlled to control the inlet flow of normal temperature water, and the heat exchange between water and the fluorinated liquid is accurately realized in the plate heat exchanger until the operating temperature of the production equipment reaches the preset temperature, which helps to reduce the thermal stress changes of semiconductor materials during the processing, thereby improving the yield and reliability of semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0033] Figure 2 It is a schematic structural diagram of another viewing angle of the main body of the present invention;

[0034] Figure 3 This is a structural schematic diagram of the main body of the present invention with the cabinet door opened;

[0035] Figure 4 A half-section view of the water tank structure of the present invention;

[0036] Figure 5 It is a schematic structural diagram of the connection between the coolant extraction pipe, the coolant delivery pipe, the coolant inlet pipe, the coolant outlet pipe, the normal temperature water input pipe, the normal temperature water output pipe and the plate heat exchanger of the present invention;

[0037] Figure 6 It is a structural schematic diagram of another perspective of the connection of the coolant extraction pipe, the coolant delivery pipe, the coolant inlet pipe, the coolant outlet pipe, the normal temperature water input pipe, the normal temperature water output pipe and the plate heat exchanger of the present invention;

[0038] Figure 7 This is a schematic diagram of the assembly structure of the normal temperature water input pipe of the present invention;

[0039] Figure 8 This is a schematic diagram of the assembly structure of the coolant outlet pipe and the return pipe of the present invention;

[0040] Fig. 9It is a schematic diagram of the structure of the coolant inlet pipe of the present invention;

[0041] Fig.10 It is a cross-sectional view of the plate heat exchanger structure of the present invention.

[0042] In the figure: 1. Machine body; 2. Upper cover; 3. Liquid level gauge; 4. Liquid filling elbow; 5. Touch screen; 6. Cabinet door; 7. Coolant outlet pipe; 71. Manual valve; 8. Coolant inlet pipe; 9. Normal temperature water inlet pipe; 10. Normal temperature water outlet pipe; 11. PLC; 12. Input analog module; 13. Output analog module; 14. Transformer; 15. Switching power supply; 16. AC contactor; 17. Circuit breaker; 18. Terminal block 1; 19. Cooling fan; 20. Inverter; 21. Water tank; 22. Negative pressure valve; 23. Positive pressure valve; 24. Cover 1; 2 5. Connecting pipe; 26. Liquid level float switch; 27. Magnetic pump; 28. Coolant guide pipe; 29. ​​Coolant extraction pipe; 30. Plate heat exchanger; 31. Flow meter 1; 32. Branch pipe; 33. Temperature sensor 1; 34. Pressure sensor 1; 35. Reflux pipe; 36. Pressure sensor 2; 37. Y-type filter 2; 38. Temperature sensor 2; 39. PID electric proportional valve; 40. Flow meter 2; 41. Y-type filter 1; 42. End cover; 43. Cartridge filter; 44. Temperature sensor 3; 45. Reversing pipe; 46. Heat exchange pipe. DETAILED DESCRIPTION

[0043] The following will be described clearly and completely in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Embodiment 1: This embodiment provides a water-fluorine heat exchanger for semiconductor production, such as Figure 1 , Figure 2 and Figure 4 As shown, it includes a body 1, and a water tank 21 is provided at the upper end of the body 1. Specifically, one side wall of the water tank 21 is connected to a liquid adding elbow 4, and the pipe mouth of the liquid adding elbow 4 is threadedly connected to a second cover. The second cover is rotated to remove, and the fluorinated liquid is poured into the water tank 21 from the opening of the liquid adding elbow 4. Then, the second cover is screwed onto the opening of the liquid adding elbow 4 to seal the water tank 21. The fluorinated liquid is used as a refrigerant.

[0045] like Figure 3 , Figure 5 , Figure 6 and Fig.10As shown, the machine body 1 is provided with a pipeline installation cavity, and a magnetic pump 27 and a plate heat exchanger 30 are installed on the bottom wall of the pipeline installation cavity. The liquid inlet of the magnetic pump 27 is connected to a coolant extraction pipe 29, and the coolant extraction pipe 29 is connected to the bottom wall of the water tank 21; a water cavity is provided in the plate heat exchanger 30, and the two opposite side walls of the plate heat exchanger 30 are respectively connected to the coolant guide pipe 28 and the coolant outlet pipe 7, and a heat exchange pipe 46 is built in the water cavity, and the two ends of the heat exchange pipe 46 are respectively connected to the coolant guide pipe 28 and the coolant outlet pipe 7, and the other end of the coolant guide pipe 28 is connected to the liquid outlet of the magnetic pump 27; the bottom wall of the water tank 21 is also connected to a coolant inlet pipe 8, and the end of the coolant inlet pipe 8 is used to connect to the liquid outlet port of the production equipment.

[0046] The water tank 21, the coolant extraction pipe 29 and the coolant guide pipe 28 constitute a coolant delivery circuit, and the coolant guide pipe 28, the heat exchange pipe 46, the coolant outlet pipe 7 and the coolant inlet pipe 8 constitute a cooling circulation loop; the two opposite side walls of the plate heat exchanger 30 are also respectively connected with a normal temperature water input pipe 9 and a normal temperature water output pipe 10, and the normal temperature water input pipe 9, the water cavity and the normal temperature water output pipe 10 constitute a normal temperature water circuit.

[0047] The cooling process of semiconductor production equipment is as follows: the magnetic pump 27 provides negative pressure for the coolant extraction pipe 29, extracts the fluorinated liquid in the water tank 21 and introduces it into the plate heat exchanger 30 from the coolant guide pipe 28. The fluorinated liquid entering the plate heat exchanger 30 flows through the heat exchange pipe 46 and performs a heat exchange with the normal temperature water in the water cavity. At this time, the temperature of the fluorinated liquid is lower than the temperature of the fluorinated liquid in the water tank 21. Subsequently, the fluorinated liquid after the one heat exchange enters the production equipment from the coolant outlet pipe 7 for a secondary heat exchange. The fluorinated liquid in the secondary heat exchange will take away the heat of the production equipment, the temperature of the production equipment drops, and flows through the coolant inlet pipe 8 and flows back to the water tank 21 again. The above is a cooling process of secondary heat exchange of normal temperature water and fluorinated liquid.

[0048] In order to accurately control the temperature, Figure 7 As shown, a PID electric proportional valve 39 is installed on the normal temperature water input pipe 9. The PID electric proportional valve 39 is a valve whose regulated quantity is in a certain proportion to the control signal. It combines an electric actuator and a valve body. Specifically, the electric actuator has a built-in servo controller, which converts the current signal (or voltage signal) into the angular stroke signal of the motor. The motor drives the gear and the worm to drive the worm gear to reduce the output, thereby driving the valve stem to make a 0-90° partial rotation movement to realize the angular stroke control and adjustment function. In the control process, the size of the valve opening angle determines the control opening and cross-sectional area, thereby realizing the control of the fluid flow.

[0049] At the same time, if Figure 3As shown, a side control chamber is also provided in the machine body 1, and a PLC 11 for controlling the PID electric proportional valve 39 is fixedly installed on the inner wall of the side control chamber. A cabinet door 6 is also hinged at the opening of the side control chamber, and a touch screen 5 is also embedded in the cabinet door 6. The COM port of the touch screen 5 is connected to the communication port of the PLC 11.

[0050] like Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, a temperature sensor 33 and a pressure sensor 34 are also installed on the coolant outlet pipe 7. A flow meter 31 and a temperature sensor 3 44 are installed on the coolant inlet pipe 8. A pressure sensor 2 36 and a temperature sensor 2 38 are installed on the normal temperature water inlet pipe 9.

[0051] like Figure 3 As shown, the inner wall of the side control chamber is also installed with a circuit breaker 17, an AC contactor 16, a transformer 14, a terminal block 18, a switching power supply 15 and a frequency converter 20. The circuit breaker 17 is connected to the mains, the wiring terminal of the circuit breaker 17 is connected to the wiring terminal of the AC contactor 16, the signal output port of the AC contactor 16 is connected to the signal input port of the frequency converter 20, and the output end of the frequency converter 20 is connected to the power port of the magnetic pump 27 to control the power on and off of the magnetic pump 27. The AC contactor 16 is used to control the power on and off of the magnetic pump 27. When the coil is energized, the contact is closed, and the magnetic pump 27 is energized and operated; when the coil is de-energized, the contact is disconnected, and the magnetic pump 27 is de-energized and stopped. The control signal of the frequency converter 20 is controlled by the analog output of the PLC 11, and finally controls the flow rate of the fluorinated liquid extracted from the water tank 21 by the magnetic pump 27 into the plate heat exchanger 30.

[0052] The output port of the transformer 20 is connected to the terminal row 2, which is expanded into multiple 220V one-way electrical connection points. All 220V one-way electricity is provided by the expanded terminal row 2. The connection terminal of the switching power supply 15 is connected to the connection point of the terminal row 18, which is expanded into multiple 24V DC connection points. The 24V DC connection points are further connected to multiple expansion modules, which include an input simulation module 12 and an output simulation module 13. The input simulation module 12 and the output simulation module 13 are fixed on the inner wall of the side control cavity; the signal input ports of the temperature sensor 1 33, the temperature sensor 2 38, the temperature sensor 3 44, the flow meter 1 31, the flow meter 2 40, the pressure sensor 1 34 and the pressure sensor 2 36 are all connected to the connection terminal of the input simulation module 12, and the signal output port of the frequency converter 2 and the signal output port of the PID electric proportional valve 39 are all connected to the connection terminal of the output simulation module 13.

[0053] The 380V three-phase electricity is converted into 220V one-way electricity through the transformer 14 to supply power to the PLC 11 and the switch power supply 15. The input analog module 12 and the output analog module 13 are used as expansion modules, and as a bridge for digital-analog signal conversion of the temperature sensor 1 33, the temperature sensor 2 38, the temperature sensor 3 44, the flow meter 1 31, the flow meter 2 40, the pressure sensor 1 34 and the pressure sensor 2 36. Among them, only the temperature sensor 1 33 provides operation data for the PLC 11, and the other sensors are only used to monitor the status signals in the relevant pipelines.

[0054] PLC 11 serves as a central controller and is responsible for receiving and processing signals from temperature sensor 1 33 , temperature sensor 2 38 , temperature sensor 3 44 , flow meter 1 31 , flow meter 2 40 , pressure sensor 1 34 and pressure sensor 2 36 .

[0055] In order to strictly control the operating temperature of semiconductor production equipment to be stable at a specific value, the details are as follows: First, preset an operating temperature value on the touch screen 5, and configure the same operating temperature value in the setting interface of the touch screen 5 and the PLC 11. The fluorinated liquid enters the pipeline of the production equipment through the coolant outlet pipe 7, and the temperature sensor 33 is used to monitor the temperature of the fluorinated liquid entering the production equipment in real time, and the pressure sensor 34 is used to monitor the pressure signal of the fluorinated liquid flowing into the production equipment. At the same time, the fluorinated liquid passes through the coolant inlet pipe 8 and returns to the return pipeline, and the temperature sensor 344 is used to monitor the temperature of the fluorinated liquid flowing out of the production equipment in real time, and the flow meter 31 is used to monitor the flow rate of the fluorinated liquid flowing out of the production equipment. The fluorinated liquid enters the production equipment through the coolant outlet pipe 7, and flows back from the coolant inlet pipe 8 to the water tank 21 to form a cooling circuit. In this circuit, the temperature and flow of the fluorinated liquid entering the production equipment, as well as the temperature and pressure signals of the fluorinated liquid flowing out of the production equipment are monitored.

[0056] In the normal temperature water inlet pipeline, the normal temperature water enters the water cavity of the plate heat exchanger 30 from the normal temperature water inlet pipe 9, and is discharged from the normal temperature water outlet pipe 10 after heat exchange with the heat exchange pipe 46. In this process, the temperature sensor 2 38 is used to monitor the temperature of the normal temperature water entering the plate heat exchanger 30, the pressure sensor 2 36 is used to monitor the pressure signal of the normal temperature water entering the plate heat exchanger 30, and the flow meter 2 40 is used to monitor the flow of the normal temperature water entering the plate heat exchanger 30. It is converted into an electrical signal and input into the PLC 11. Combined with the temperature of the fluorinated liquid input into the production equipment monitored in real time by the temperature sensor 1 33, the PID control algorithm is executed. The PID electric proportional valve 39 adjusts the opening angle of the valve according to the received control signal, thereby controlling the flow of the normal temperature water entering the plate heat exchanger 30, and heat exchange with the fluorinated liquid. The fluorinated liquid after a heat exchange is circulated through the production equipment for cooling treatment until the operating temperature of the production equipment is continuously stabilized at a preset temperature value.

[0057] In summary, a preset operating temperature signal is executed through PLC 11, and the opening angle of the PID electric proportional valve 39 is controlled, thereby achieving precise and stable regulation of semiconductor production equipment.

[0058] In this embodiment, further, Figure 4 As shown, connecting pipes 25 are inserted at both ends of one side of the water tank 21, and a liquid level gauge 3 is connected between the ends of the two connecting pipes 25 located outside the water tank 21. The fluorinated liquid filled into the water tank 21 will enter the liquid level gauge 3 through the two connecting pipes 25 respectively, so that the staff can observe the liquid level of the fluorinated liquid in the water tank 21 outside the machine body 1 to ensure that when the liquid level of the fluorinated liquid is low, it can be discovered and added in time.

[0059] A positive pressure valve 23 and a negative pressure valve 22 extending into the water tank 21 are respectively installed on the upper end surface of the water tank 21; Figure 4 As shown, the positive pressure valve 23 can discharge high-pressure air from the water tank 21 because the air pressure in the water tank 21 is higher than the external pressure due to the high temperature. The negative pressure valve 22 introduces external air into the water tank 21 to prevent the pressure in the water tank 21 from being lower than the external pressure. The positive pressure valve 23 and the negative pressure valve 22 are used together to balance the pressure in the water tank 21.

[0060] At the same time, a liquid level float switch 26 fixedly connected to the top wall of the water tank 21 is also installed in the water tank 21. Figure 4As shown, the signal output port of the liquid level float switch 26 is connected to the signal input port of the PLC 11. The rise or fall of the fluorinated liquid level will drive the float to move up and down, so that the liquid level float switch 26 generates an action of absorbing or disconnecting, thereby outputting a switch signal to the PLC 11, providing the PLC 11 with a signal of the liquid level. The signal output port of the PLC 11 is also connected to an alarm. The liquid level float switch 26 presets a low liquid level or ultra-low liquid level alarm signal. The low liquid level only alarms and reminds, and does not stop the machine. When the liquid level is ultra-low, the circuit breaker 17 disconnects the circuit and stops the machine.

[0061] An inspection port is provided at the upper end of the water tank 21, and a cover 24 is detachably installed at the opening of the inspection port. An upper cover 2 covering the water tank 21 is installed at the upper end of the machine body 1. By opening the upper cover 2, the situation inside the water tank 21 can be inspected through the inspection port, so that the staff can find out whether there are impurities and clean the inner wall.

[0062] In order to prevent the normal temperature water from entering the plate heat exchanger 30 with impurities, a Y-type filter 41 is installed on the normal temperature water input pipe 9. In order to prevent the fluorinated liquid from heat exchanged from the production equipment from being mixed with impurities, a Y-type filter 37 is installed on the coolant inlet pipe 8. Specifically, a cylindrical filter 43 is inserted in the Y-type filter 41 and the Y-type filter 41, and the end openings of the Y-type filter 41 and the Y-type filter 41 are threadedly connected with an end cover 42, as shown in FIG. Figure 7 and Fig. 9 As shown, the end of the cylinder filter 43 away from the end cover 42 is open for liquid to enter, and impurities will be retained in the cylinder filter 43, while the liquid continues to flow through the mesh holes on the side wall of the cylinder filter 43 to filter impurities. Open the end cover 42 regularly, remove the cylinder filter 43 from the Y-type filter, clean the impurities in the cylinder filter 43, then install the cylinder filter 43 into the Y-type filter, and then install the end cover 42.

[0063] A cooling fan 19 is also installed on the inner wall of the side control chamber. Figure 3 As shown, the connection terminal of the cooling fan 19 is connected to the 220V one-way electrical connection point, and the cooling fan 19 blows air to dissipate the heat generated during the operation of all components in the entire side control cavity.

[0064] In addition, further, Figure 7As shown, the radial side wall of the coolant outlet pipe 7 is also connected to a branch pipe 32, and a manual valve 71 is also installed on the side wall of the branch pipe 32. The end of the branch pipe 32 is connected to a return pipe 35, and the end of the return pipe 35 is connected to the bottom wall of the water tank 21. The fluorinated liquid passes through the pipeline of the coolant outlet pipe 7, and the manual valve 71 on the side wall of the external branch pipe 32 is manually rotated to divert the fluorinated liquid in the coolant outlet pipe 7 through the branch pipe 32 to the return pipe 35, so that part of the fluorinated liquid can be guided back to the water tank 21, reducing the pressure of the fluorinated liquid entering the production equipment, and meeting the pressure requirements of the fluorinated liquid entering different production equipment.

[0065] Also, if Fig.10 As shown, a reversing tube 45 is provided at the position in the water cavity connected to the normal temperature water input pipe 9, and the opening of the reversing tube 45 deviates from the position where the normal temperature water output pipe 10 is connected to the water cavity. In this way, the normal temperature water can be directed into the water cavity instead of directly to the position where the normal temperature water output pipe 10 is connected to the water cavity, thereby expanding the flow surface of the normal temperature water in the water cavity, extending the time when the normal temperature water flows through the water cavity, and improving the heat exchange efficiency.

[0066] Embodiment 2: This embodiment also discloses a heat exchange method of a water-fluorine heat exchanger for semiconductor production, comprising the following steps:

[0067] A1. The fluorinated liquid first circulates to the plate heat exchanger 30 to perform a heat exchange with normal temperature water. After the heat exchange, the fluorinated liquid enters the production equipment for heat exchange. After the heat exchange with the equipment, the fluorinated liquid flows back to the water tank 21, which is a circulating cooling loop.

[0068] A2. At the same time, PLC 11 is used to execute a temperature signal required for the normal operation of a production equipment, and the opening angle of the PID electric proportional valve 39 is controlled to control the inflow flow of normal temperature water, and accurately realize the heat exchange between water and fluorinated liquid in the plate heat exchanger 30 until the production equipment runs stably and reaches the preset temperature.

[0069] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water-fluorine heat exchanger for semiconductor production, characterized in that: include: A machine body (1), wherein a water tank (21) is provided at the upper end of the machine body (1), and the water tank (21) is filled with fluorinated liquid; The machine body (1) is provided with a pipeline installation cavity, and a magnetic pump (27) and a plate heat exchanger (30) are installed on the bottom wall of the pipeline installation cavity. The liquid inlet of the magnetic pump (27) is connected to a coolant extraction pipe (29), and the coolant extraction pipe (29) is connected to the bottom wall of the water tank (21); the plate heat exchanger (30) is provided with a water cavity, and the two opposite side walls of the plate heat exchanger (30) are respectively connected to a coolant guide pipe (28) and a coolant outlet pipe (7), and a heat exchange pipe (46) is installed in the water cavity, and the two ends of the heat exchange pipe (46) are respectively connected to the coolant guide pipe (28) and the coolant outlet pipe (7), and the other end of the coolant guide pipe (28) is connected to the liquid outlet of the magnetic pump (27); the bottom wall of the water tank (21) is also connected to a coolant inlet pipe (8), and the end of the coolant inlet pipe (8) is used to connect to the liquid outlet port of the production equipment; The water tank (21), the coolant extraction pipe (29) and the coolant guide pipe (28) form a coolant delivery circuit, and the coolant guide pipe (28), the heat exchange pipe (46), the coolant outlet pipe (7) and the coolant inlet pipe (8) form a cooling circulation circuit; Two opposite side walls of the plate heat exchanger (30) are also respectively connected with a normal temperature water input pipe (9) and a normal temperature water output pipe (10), wherein the normal temperature water input pipe (9), the water cavity and the normal temperature water output pipe (10) form a normal temperature water circuit; A PID electric proportional valve (39) is installed on the normal temperature water input pipe (9), and a side control chamber is also provided in the machine body (1). A PLC (11) for controlling the PID electric proportional valve (39) is fixedly installed on the inner wall of the side control chamber. A cabinet door (6) is hingedly connected to the opening of the side control chamber, and a touch screen (5) is also embedded in the cabinet door (6). The COM port of the touch screen (5) is connected to the communication port of the PLC (11).

2. The water-fluorine heat exchanger for semiconductor production according to claim 1, characterized in that: An inspection port is provided at the upper end of the water tank (21), a cover (24) is detachably mounted on the opening of the inspection port, and an upper cover (2) is mounted at the upper end of the machine body (1) and covers the water tank (21); One side wall of the water tank (21) is connected to a liquid-adding elbow (4), and the pipe opening of the liquid-adding elbow (4) is threadedly connected to a second sealing cap; A connecting pipe (25) is inserted into both upper and lower ends of one side of the water tank (21), and a liquid level meter (3) is connected between the ends of the two connecting pipes (25) located outside the water tank (21).

3. The water-fluorine heat exchanger for semiconductor production according to claim 2, characterized in that: The upper end surface of the water tank (21) is respectively provided with a positive pressure valve (23) and a negative pressure valve (22) extending into the water tank (21); A liquid level float switch (26) fixedly connected to the top wall of the water tank (21) is also installed in the water tank (21), and a signal output port of the liquid level float switch (26) is connected to a signal input port of the PLC (11).

4. The water-fluorine heat exchanger for semiconductor production according to claim 1, characterized in that: The coolant outlet pipe (7) is also provided with a temperature sensor (33) and a pressure sensor (34).

5. The water-fluorine heat exchanger for semiconductor production according to claim 4, characterized in that: The cooling liquid inlet pipe (8) is equipped with a flow meter 1 (31) and a temperature sensor 3 (44).

6. The water-fluorine heat exchanger for semiconductor production according to claim 5, characterized in that: The normal temperature water input pipe (9) is provided with a second pressure sensor (36) and a second temperature sensor (38); A Y-type filter 1 (41) is installed on the normal temperature water input pipe (9), and a Y-type filter 2 (37) is installed on the cooling liquid inlet pipe (8). A cylindrical filter screen (43) is inserted into the Y-type filter 1 (41) and the Y-type filter 1 (41), and the end openings of the Y-type filter 1 (41) and the Y-type filter 1 (41) are both threadedly connected with an end cover (42).

7. The water-fluorine heat exchanger for semiconductor production according to claim 6, characterized in that: An expansion module, a circuit breaker (17), an AC contactor (16), a transformer (14), a terminal block 1 (18), a switching power supply (15) and a frequency converter (20) are also installed on the inner wall of the side control chamber; The wiring terminal of the circuit breaker (17) is connected to the wiring terminal of the AC contactor (16), the signal output port of the AC contactor (16) is connected to the signal input port of the frequency converter (20), and the output end of the frequency converter (20) is connected to the power supply port of the magnetic pump (27); The connection terminal of the switching power supply (15) is connected to the connection point of the terminal row 1 (18), which is expanded into a plurality of 24V DC connection points, the output port of the transformer (20) is connected to the terminal row 2, which is expanded into a plurality of 220V unidirectional electrical connection points, and the expansion module includes an input simulation module (12) and an output simulation module (12); The signal input ports of the temperature sensor 1 (33), the temperature sensor 2 (38), the temperature sensor 3 (44), the flow meter 1 (31), the flow meter 2 (40), the pressure sensor 1 (34) and the pressure sensor 2 (36) are all connected to the wiring terminal of the input simulation module (12), and the signal output port of the frequency converter (20) and the signal output port of the PID electric proportional valve (39) are all connected to the wiring terminal of the output simulation module (13).

8. The water-fluorine heat exchanger for semiconductor production according to claim 6, characterized in that: A heat dissipation fan (19) is also installed on the inner wall of the side control cavity.

9. The water-fluorine heat exchanger for semiconductor production according to claim 4, characterized in that: The radial side wall of the coolant outlet pipe (7) is also connected to a branch pipe (32), and a manual valve (71) is also installed on the side wall of the branch pipe (32). The end of the branch pipe (32) is connected to a return pipe (35), and the end of the return pipe (35) is connected to the bottom wall of the water tank (21).

10. A heat exchange method for a water-fluorine heat exchanger for semiconductor production, according to any one of claims 1 to 9, characterized in that: The following steps are involved: A1, the fluorinated liquid is first circulated into the plate heat exchanger (30) to perform a heat exchange with normal temperature water. After the heat exchange, the fluorinated liquid enters the production equipment for heat exchange. After the heat exchange with the equipment, the fluorinated liquid flows back into the water tank (21), which is a circulating cooling loop; A2. At the same time, the PLC (11) is used to execute a temperature signal required for the normal operation of the production equipment, and the opening angle of the PID electric proportional valve (39) is controlled to control the inflow flow of normal temperature water, and accurately realize the heat exchange between water and fluorinated liquid in the plate heat exchanger (30) until the operating temperature of the production equipment reaches the preset temperature.

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