Tin dragging piece, furnace passing jig and wave soldering equipment

Abstract

The utility model provides a tin dragging piece, a furnace jig and wave soldering equipment, the tin dragging piece is applied to the furnace jig, the furnace jig is provided with a tin receiving surface, and the tin dragging piece comprises a tin dragging piece body which comprises a tin dragging surface; and the coating is arranged on the tin dragging surface, and the friction coefficient of the coating is lower than that of the tin dragging surface. According to the tin dragging piece, the coating is arranged on the tin dragging face of the tin dragging piece, the friction coefficient of the coating is lower than that of the tin dragging face, the smoothness of the tin dragging face can be improved, therefore, the tin dragging piece can better reduce the tin dragging phenomenon, and then the product percent of pass and the production efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to a tin-drag piece, a furnace fixture and wave soldering equipment. Background Art

[0002] In the manufacturing process of electronic products, the furnace jig is one of the commonly used equipment, which is used to fix and transfer the electronic components to be processed. However, the existing furnace jig often has the phenomenon of tin dragging during the processing, which leads to a decrease in the product qualification rate and affects the production efficiency. Utility Model Content

[0003] The embodiments of the utility model provide a tin-drag component, a furnace fixture and a wave soldering device, which can improve the technical problem of tin-drag phenomenon existing in the existing electronic components during soldering.

[0004] In a first aspect, an embodiment of the utility model provides a tin-drag piece, which is applied to a furnace jig, wherein the furnace jig has a tin-receiving surface, and the tin-drag piece comprises:

[0005] The tinning part body includes a tinning surface;

[0006] The coating is arranged on the tinning surface, and the friction coefficient of the coating is lower than the friction coefficient of the tinning surface.

[0007] In an embodiment of the utility model, by providing a coating on the tinning surface of the tinning part, and the friction coefficient of the coating is lower than the friction coefficient of the tinning surface, the smoothness of the tinning surface can be improved, so that the tinning part can better reduce the occurrence of tinning, thereby improving the product qualification rate and production efficiency.

[0008] In one embodiment, the soldering piece body further includes a contact surface opposite to the soldering surface, the contact surface is configured to contact the electronic component, and an anti-slip structure is provided on the contact surface.

[0009] In the embodiment of the utility model, by providing an anti-slip structure on the contact surface of the soldering piece, the soldering piece and the electronic component can be better fitted to prevent relative movement between the two, thereby better reducing the occurrence of soldering phenomenon.

[0010] In one embodiment, the coating is a tinplate layer; and / or

[0011] The anti-skid structure is an anti-skid texture, and the anti-skid texture is integrally arranged with the tin dragging piece body.

[0012] In the embodiment of the utility model, by providing a tinplate layer on the tinning surface of the tinning piece, the smoothness of the tinning surface can be effectively improved, and at the same time, by utilizing the good wetting properties of tinplate and solder, the ability of the tinning piece to remove solder can be enhanced, so that when the tinning piece is located around the solder joints of the electronic components, the excess solder around the solder joints can be removed efficiently and reliably, reducing the risk of short circuits between solder joints due to solder adhesion. By providing the anti-slip texture with the tinning piece body, the tinning piece can be effectively fitted with the electronic component, the structure of the tinning piece can be simplified, and the processing procedures of the tinning piece can be reduced.

[0013] In one embodiment, the soldering member body is in the shape of a sheet, and the edge of the soldering member body is configured to be sandwiched between the furnace fixture and the electronic component.

[0014] In the embodiment of the utility model, by setting the tinning piece body to be sheet-shaped and clamping it between the furnace fixture and the electronic component, the installation and fixation of the tinning piece can be facilitated, and the soldering of the electronic component can be facilitated.

[0015] In a second aspect, an embodiment of the present utility model provides a furnace fixture, comprising:

[0016] A carrier, used for carrying electronic components, the carrier having a tin-receiving surface, and the carrier is provided with a through slot penetrating the tin-receiving surface for exposing solder joints of the electronic components carried thereon;

[0017] The above-mentioned tin-drawing component is arranged on the carrier, and the tin-drawing surface and the tin-receiving surface face the same direction and are exposed through the through groove. Along the moving direction of the furnace fixture, the tin-drawing surface is arranged behind the soldering point.

[0018] In an embodiment of the utility model, by opening a through groove on the carrier, the solder joints of the electronic components and the tinning surface of the tinning piece can be exposed, and along the moving direction of the furnace fixture, the tinning surface is located behind the solder joints, so that when the electronic components are soldered, the tinning surface of the tinning piece can efficiently and reliably remove excess solder around the solder joints, reducing the risk of short circuits between solder joints due to solder adhesion.

[0019] In one embodiment, the minimum distance between the tinning surface and the solder joint along the moving direction of the furnace jig is 1 mm-1.5 mm;

[0020] The carrier is provided with a plurality of through slots and a plurality of tin-drawing members, and the plurality of through slots and the plurality of tin-drawing members correspond to each other one by one.

[0021] In the embodiment of the utility model, by controlling the minimum distance between the tinning surface and the solder joint along the moving direction of the furnace jig, the distance and contact time between the solder and the tinning surface after the solder joint is soldered can be controlled, so that the tinning surface can better reduce the tinning phenomenon. By providing multiple through slots and multiple tinning pieces, tinning pieces can be respectively provided around multiple solder joints of electronic components, thereby improving the effect of reducing the tinning phenomenon.

[0022] In one embodiment, the carrier includes a supporting layer and a bearing layer which are stacked, and a side of the supporting layer facing away from the bearing layer is the tin-receiving surface. The through groove includes a first through groove and a second through groove. The first through groove is arranged in the bearing layer for accommodating the electronic component, the tinning piece is arranged between the electronic component and the supporting layer, and the second through groove is arranged in the supporting layer for exposing the tinning surface and the solder joint.

[0023] In an embodiment of the utility model, the first through groove can be used to accommodate electronic components to prevent them from displacement. The second through groove can expose the tinning surface and the solder joint, so that the solder joint can be soldered, and the tinning surface can remove excess solder around the solder joint. The electronic components and the tinning piece can be supported by the support layer, so that they are fixed above the support layer. By arranging the tinning piece between the electronic components and the support layer, the tinning piece can be fixed, and the relative position between the tinning piece and the electronic components can be fixed.

[0024] In one embodiment, an area of ​​the second through-groove is smaller than an area of ​​the first through-groove, and the electronic component is in contact with a surface of the support layer exposed from the first through-groove.

[0025] In the embodiment of the utility model, by making the area of ​​the second through groove smaller than the area of ​​the first through groove, the electronic component can be brought into contact with the support layer, thereby supporting the electronic component and facilitating the installation and fixation of the electronic component.

[0026] In one embodiment, the edge of the soldering member is sandwiched between the electronic component and the supporting layer.

[0027] In the embodiment of the utility model, the edge of the soldering piece is clamped between the electronic component and the support layer, so that the installation and fixation of the soldering piece can be facilitated.

[0028] In a third aspect, an embodiment of the utility model provides a wave soldering device, and the wave soldering device includes the above-mentioned furnace fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 It is a side view of a tin-drag piece provided by an embodiment of the utility model;

[0031] Figure 2 It is a top view of the carrier provided by the embodiment of the utility model (without the tinning parts and electronic components);

[0032] Figure 3 The embodiment of the utility model provides a carrier along Figure 2 Cross-sectional view of BB (without soldering parts and electronic components)

[0033] Figure 4 It is a bottom view of the furnace fixture provided by an embodiment of the utility model (including electronic components);

[0034] Figure 5 The embodiment of the utility model provides a furnace fixture along the Figure 4 Cross-sectional view of the CC (including electronic components).

[0035] Description of the drawings: tinning component-1; tinning component body-11; tinning surface-111; contact surface-112; anti-slip structure-1121; coating-12; carrier-2; bearing layer-21; first through groove-211; supporting layer-22; tin-receiving surface-221; second through groove-222; electronic component-3; solder joint-31. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the utility model, and are not used to limit the utility model. In the utility model, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0037] See also Figure 1In a first aspect, an embodiment of the utility model provides a tin-drag piece 1, which is applied to a furnace jig, wherein the furnace jig has a tin-receiving surface 221, and the tin-drag piece 1 comprises:

[0038] The tinning part body 11 includes a tinning surface 111;

[0039] The coating 12 is disposed on the tinning surface 111 , and the friction coefficient of the coating 12 is lower than the friction coefficient of the tinning surface 111 .

[0040] It can be understood that the friction coefficient of the coating 12 is lower than the friction coefficient of the tin-drag surface-111. The material of the coating 12 can be the same as the material of the tin-drag part 1, or it can be different, as long as the friction coefficient of the coating 12 is lower than the friction coefficient of the tin-drag surface-111. If the material of the coating 12 is different from that of the tin-drag part 1, the friction coefficient of the coating 12 material is lower than the friction coefficient of the tin-drag surface-111. The coating 12 is arranged on the tin-drag surface-111, and the entire surface of the tin-drag surface-111 can be set for the coating 12, or a part of the surface of the tin-drag surface-111 can be set for the coating 12, as long as the tin-drag part 1 can better reduce the occurrence of the tin-drag phenomenon. The thickness and shape of the coating 12 can be set as needed. The shape and size of the tin-drag part body 11 can be set as needed, as long as the occurrence of the tin-drag phenomenon can be reduced. The shape, size and thickness of the tin-drag surface-111 can be set as needed. The practical tinning piece 1 can reduce the tinning ratio of the electronic component 3 to less than 10%, increase the straight-through rate after the furnace by 70%, and reduce the number of tinning personnel after the furnace by 1.

[0041] In one embodiment, the coating 12 covers the tinning surface 111 .

[0042] It can be understood that the coating 12 covers the tinning surface 111 , that is, the coating 12 covers the entire surface of the tinning surface 111 , which can facilitate the processing of the coating 12 .

[0043] In one embodiment, the soldering piece body 11 further includes a contact surface 112 opposite to the soldering surface 111 , the contact surface 112 is configured to contact the electronic component 3 , and an anti-slip structure 1121 is disposed on the contact surface 112 .

[0044] It can be understood that the anti-slip structure 1121 can be a set anti-slip material, or a shape with an anti-slip effect, which can be selected according to needs.

[0045] In one embodiment, the coating 12 is a tinplate layer; and / or

[0046] The anti-skid structure 1121 is an anti-skid texture, and the anti-skid texture is integrally arranged with the tin dragging piece body 11 .

[0047] It is understandable that the shape and size of the anti-skid texture can be set as required. The anti-skid texture is integrated with the tin dragging piece body 11 , that is, the anti-skid texture is the structure of the tin dragging piece body 11 .

[0048] In one embodiment, the soldering member body 11 is in a sheet shape, and the edge of the soldering member body 11 is configured to be sandwiched between the furnace fixture and the electronic component 3 .

[0049] It is understood that the edge of the tin-drag body 11 can be thinner than the middle of the tin-drag body 11, so that it is convenient to be clamped between the furnace jig and the electronic component 3. Other connection devices such as adhesives can also be set between the edge of the tin-drag body 11 and the furnace jig and the electronic component 3.

[0050] See also Figures 2 to 5 In a second aspect, an embodiment of the present utility model provides a furnace fixture, comprising:

[0051] The carrier 2 is used to carry the electronic component 3. The carrier 2 has a tin-receiving surface 221. A through groove penetrating the tin-receiving surface 221 is provided on the carrier 2 to expose the solder joint 31 of the electronic component 3 carried thereon;

[0052] The above-mentioned tin-drag component 1 is arranged on the carrier 2, and the tin-drag surface 111 and the tin-receiving surface 221 face the same direction and are exposed through the through groove. Along the moving direction A of the furnace fixture, the tin-drag surface 111 is arranged behind the solder joint 31.

[0053] It is understood that the shape and size of the carrier 2 can be set as required. The tin-receiving surface 221 is the side of the carrier 2 that contacts with the solder.

[0054] In one embodiment, the minimum distance between the tinning surface 111 and the solder joint 31 along the moving direction A of the furnace jig is 1 mm-1.5 mm;

[0055] The carrier 2 is provided with a plurality of through slots and a plurality of tin-drawing members 1 , and the plurality of through slots and the plurality of tin-drawing members 1 correspond to each other one by one.

[0056] It can be understood that the minimum distance between the tinning surface 111 and the solder joint 31 along the moving direction A of the furnace jig is the distance between the solder joint 31 and the edge of the tinning surface 111 along the moving direction A of the furnace jig. The plurality of through grooves can be provided with different solder joints 31, and different solder joints 31 can correspond to different tinning parts 1, thereby improving the anti-tinning effect of each solder joint 31.

[0057] In one embodiment, the carrier 2 includes a supporting layer 22 and a bearing layer 21 which are stacked, and a side of the supporting layer 22 facing away from the bearing layer 21 is the tin-receiving surface 221. The through groove includes a first through groove 211 and a second through groove 222. The first through groove 211 is arranged in the bearing layer 21 to accommodate the electronic component 3. The tin-drawing piece 1 is arranged between the electronic component 3 and the supporting layer 22. The second through groove 222 is arranged in the supporting layer 22 to expose the tin-drawing surface-111 and the solder joint 31.

[0058] It can be understood that the stacked support layer 22 and the bearing layer 21 can be directly fixedly connected, or they can be fixedly connected by other connecting parts, such as setting a frame at the edge of the support layer 22 and the bearing layer 21 to fix the two. The thickness of the support layer 22 and the bearing layer 21 can be set as needed, as long as they can provide a good supporting effect and fixing effect on the tin-drag piece 1 and the electronic component 3. The shape of the first through groove 211 can match the peripheral shape of the electronic component 3, thereby limiting the position of the electronic component 3 and preventing it from moving. The shape and size of the second through groove 222 can be set according to the shape and size of the tin-drag surface-111 and the solder joint 31.

[0059] In one embodiment, an area of ​​the second through-groove 222 is smaller than an area of ​​the first through-groove 211 , and the electronic component 3 is in contact with a surface of the support layer 22 exposed from the first through-groove 211 .

[0060] In one embodiment, the edge of the soldering member 1 is sandwiched between the electronic component 3 and the supporting layer 22 .

[0061] It is understood that the edge of the tin-drawing piece 1 can be thinner than the middle of the body 11 of the tin-drawing piece 1, so that it is easy to be clamped between the furnace jig and the electronic component 3. Other connection devices such as adhesives can also be set between the edge of the tin-drawing piece 1 and the furnace jig and the electronic component 3.

[0062] In a third aspect, an embodiment of the utility model provides a wave soldering device, and the wave soldering device includes the above-mentioned furnace fixture.

[0063] The above is a detailed introduction to the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A tin-drag part, applied to a furnace fixture, the furnace fixture having a tin-receiving surface, characterized in that: The tin dragging part comprises: The tinning part body includes a tinning surface; The coating is arranged on the tinning surface, and the friction coefficient of the coating is lower than the friction coefficient of the tinning surface.

2. The tin-drag fitting according to claim 1, characterized in that: The tin-drawing member body further comprises a contact surface opposite to the tin-drawing surface, the contact surface is configured to contact with an electronic component, and an anti-slip structure is arranged on the contact surface.

3. The tin-drag fitting according to claim 2, characterized in that: The coating is a tinplate layer; and / or The anti-skid structure is an anti-skid texture, and the anti-skid texture is integrally arranged with the tin dragging piece body.

4. The tin-drag fitting according to claim 1, characterized in that: The tin-drawing piece body is in sheet shape, and the edge of the tin-drawing piece body is configured to be sandwiched between the furnace fixture and the electronic component.

5. A furnace fixture, characterized in that: include: A carrier, used for carrying electronic components, the carrier having a tin-receiving surface, and the carrier is provided with a through slot penetrating the tin-receiving surface for exposing solder joints of the electronic components carried thereon; The tin-drag component according to any one of claims 1 to 4 is arranged on the carrier, and the tin-drag surface and the tin-receiving surface face the same direction and are exposed through the through groove, and along the moving direction of the furnace jig, the tin-drag surface is arranged behind the solder joint.

6. The furnace jig according to claim 5, characterized in that: The minimum distance between the tinning surface and the solder joint along the moving direction of the furnace fixture is 1mm-1.5mm; The carrier is provided with a plurality of through slots and a plurality of tin-drawing members, and the plurality of through slots and the plurality of tin-drawing members correspond to each other one by one.

7. The furnace jig according to claim 5, characterized in that: The carrier includes a supporting layer and a bearing layer which are stacked together, and the side of the supporting layer facing away from the bearing layer is the tin-receiving surface. The through groove includes a first through groove and a second through groove. The first through groove is arranged in the bearing layer for accommodating the electronic component, and the tinning piece is arranged between the electronic component and the supporting layer. The second through groove is arranged in the supporting layer for exposing the tinning surface and the solder joint.

8. The furnace jig according to claim 7, characterized in that: The area of ​​the second through-groove is smaller than that of the first through-groove, and the electronic component is in contact with a surface of the support layer exposed from the first through-groove.

9. The furnace jig according to claim 7, characterized in that: The edge of the soldering member is sandwiched between the electronic component and the supporting layer.

10. A wave soldering equipment, characterized in that: The wave soldering equipment comprises the furnace fixture as claimed in any one of claims 5 to 9.

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