Quick-drying device for electroplating clamp

By designing a quick-drying device for electroplating clamps, the acidic sewage is absorbed by using the water-absorbing layer and suction assembly, and blow-drying it through the jet assembly, the problem of acidic sewage residues during the electroplating of the entire board is solved, and the good products of circuit board production are improved and drying effect of electroplating clips.

CN222294239UActive Publication Date: 2025-01-03CAMELOT HUBEI TECH LTD
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Patent Information

Application Number
CN202323661970.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-28
Publication Date
2025-01-03
Estimated Expiration
2033-12-28

AI Technical Summary

Technical Problem

During the electroplating process of the entire board of high-density interconnected circuit board, the corrosion of the electroplating sandwiched in a strong acid corrosion solution leads to rough surface and difficult to dry residual acidic sewage, resulting in copper-free holes after electroplating, affecting the yield rate of circuit board production.

Method used

A quick drying device for electroplating clamps is designed, including transportation components, support components, jet structures and water-absorbing structures. The acidic sewage is absorbed through the water-absorbing layer and suction components, and blow-dry it through the jet components to quickly remove the acidic sewage on the electroplating clamps. .

Benefits of technology

It effectively avoids acidic sewage on the electroplating clip corroding the circuit board, improves the yield rate of circuit board production, and improves the drying effect of the electroplating clip, ensuring rapid acid removal and drying of the electroplating clip.

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Abstract

The utility model provides an electroplating clamp quick-drying device which comprises a conveying assembly, a supporting assembly, an air injection structure and a water absorption structure, the supporting assembly is erected on the ground, and the water absorption structure comprises a suction assembly and a roller assembly which are installed on the supporting assembly; the roller assembly comprises a vacuum roller provided with a vacuum cavity and a liquid absorption hole, a rotating shaft sleeve and a water absorption layer, the rotating shaft sleeve sleeves the vacuum roller and is provided with a liquid passing hole, the vacuum cavity, the liquid absorption hole and the liquid passing hole are communicated in sequence, and the water absorption layer abuts against the conveying assembly and covers the rotating shaft sleeve; the air injection structure comprises an air injection assembly and an air injection box, the air injection assembly is installed on the supporting assembly and communicates with the air injection box, and air injection holes are formed in the air injection box. The water absorption layer absorbs acidic sewage, the acidic sewage is sucked away by the suction assembly, the electroplating clamp is rapidly dried, the circuit board is prevented from being corroded by the acidic sewage, the air injection assembly injects air, the water absorption layer and the electroplating clamp are blow-dried, and therefore the water absorption effect of the water absorption layer and the drying effect of the electroplating clamp are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electroplating clamp drying, in particular to an electroplating clamp quick drying device. Background Art

[0002] During the hole metallization process of high-density interconnection circuit boards, a thin layer of chemical copper is deposited on the hole wall by chemical deposition, and then the copper in the holes and surfaces is thickened to the required thickness by electroplating the entire circuit board. The circuit board is then clamped and moved by the electroplating clamps on the transport assembly.

[0003] During the whole-board electroplating production process, the electroplating clamp will be immersed in strong acid corrosive liquid, which will corrode the rubber layer, make the surface rough, and the residual acid wastewater on the electroplating clamp is difficult to be blown dry by strong wind. When the electroplating clamp is used to clamp the circuit board again, the residual acid wastewater at the bottom of the electroplating clamp will flow to the circuit board surface and the hole to corrode the chemical copper on the hole wall, resulting in the problem of no copper in the hole after electroplating, such as the technical solution disclosed in the comparative document CN201310336554.4. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a fast drying device for electroplating clamps for quickly removing acidic sewage from the electroplating clamps.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A quick-drying device for electroplating clamps comprises a transport component, a support component, an air jet structure and a water absorption structure. The transport component is used to control the movement of the electroplating clamps. The support component is erected on the ground and is provided with a first mounting hole and a second mounting hole.

[0007] The water absorption structure comprises a suction component and a roller component, wherein the suction component is mounted on the first mounting hole, the roller component comprises a vacuum roller, a rotating shaft sleeve and a water absorption layer, the vacuum roller is provided with a vacuum cavity and a liquid absorption hole, the vacuum cavity is respectively connected to the suction component and the liquid absorption hole, the rotating shaft sleeve is sleeved on the vacuum roller, the rotating shaft sleeve is provided with a liquid passing hole, the liquid passing hole is connected to the liquid absorption hole, the water absorption layer covers the surface of the rotating shaft sleeve, and the water absorption layer abuts against the transport component;

[0008] The jet structure includes a jet component and a jet box, the jet component is installed in the second installation hole, the jet box is provided with a jet cavity, the jet component is connected to the jet cavity, the jet box is arranged on the side of the water absorption layer away from the transport component, and the jet box is provided with a jet hole connected to the jet cavity.

[0009] In one embodiment, there are multiple suction holes, and the multiple suction holes are arranged at intervals along the circumference of the vacuum roller.

[0010] In one embodiment, there are multiple liquid passage holes, and the multiple liquid passage holes are arranged at intervals along the circumference of the rotating sleeve.

[0011] In one embodiment, there are a plurality of the air jet holes, and the plurality of the air jet holes are arranged at intervals on a side of the air jet box adjacent to the water absorption layer.

[0012] In one embodiment, the jet box is a semicircular ring structure, the jet box extends along the vacuum roller as the center, and the plurality of jet holes are arranged at intervals along the circumference of the jet box.

[0013] In one embodiment, the roller assembly further includes a vacuum column, which is disposed in the vacuum chamber and connected to the vacuum roller.

[0014] In one embodiment, the suction assembly includes a suction pipe and a suction pump, one end of the suction pipe is connected to the vacuum roller, and the suction pump is connected to the other end of the suction pipe, the suction pipe is installed in the first installation hole, and the suction pump is arranged above the support assembly.

[0015] In one embodiment, the jet assembly includes a jet pipe and a jet pump, one end of the jet pipe is connected to the jet box, the jet pump is connected to the other end of the jet pipe, the jet pipe is installed in the second mounting hole, and the jet pump is arranged on the side of the support assembly away from the jet box.

[0016] In one embodiment, the support assembly includes a support frame and a support plate, the support frame is erected on the ground, and the support plate is connected to the top of the support frame.

[0017] In one embodiment, the transport component includes a transport track, a drive motor and a fixing part, the transport track is connected to the output end of the drive motor, the fixing part is connected to the transport track, the transport track is used to transport the fixing part, the number of the fixing parts is multiple, and the multiple fixing parts are arranged at intervals on the transport track.

[0018] Compared with the prior art, the utility model has at least the following advantages:

[0019] 1. The above-mentioned electroplating clamp quick-drying device, through the electroplating clamp abutting against the water absorption layer, makes the acidic wastewater of the electroplating clamp be sucked into the water absorption layer, and then generates suction through the suction component, so that the acidic wastewater in the water absorption layer passes through the liquid hole, the liquid absorption hole and the vacuum chamber in sequence, and then the acidic wastewater is sucked away by the suction component, so that the acidic wastewater of the electroplating clamp is quickly removed, thereby preventing the circuit board on the electroplating clamp from being corroded by the acidic wastewater, thereby improving the yield rate of circuit board production;

[0020] 2. The jet is blown by the jet assembly to dry the water absorbing layer and the electroplating clip on the transport assembly, thereby improving the water absorption effect of the dried water absorbing layer and the drying effect of the electroplating clip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic structural diagram of a quick-drying device for electroplating clamps according to an embodiment;

[0023] Figure 2 for Figure 1 A schematic diagram of a partial structure of a quick-drying device for electroplating clamps shown;

[0024] Figure 3 for Figure 1 A partial cross-sectional view of the jet structure shown;

[0025] Figure 4 for Figure 1 A partial cross-sectional view of the water absorbing structure shown;

[0026] Figure 5 for Figure 1 An exploded view of the roller assembly is shown. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] In order to better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below in conjunction with specific embodiments:

[0031] like Figure 1 As shown, a quick-drying device 10 for electroplating clamps in one embodiment includes a transport component 100, a support component 200, an air jet structure 300 and a water absorption structure 400. The transport component 100 is used to control the movement of the electroplating clamps. The support component 200 is mounted on the ground. The support component 200 is provided with a first mounting hole 201 and a second mounting hole 202.

[0032] like Figures 1 to 5As shown, further, the water absorption structure 400 includes a suction component 410 and a roller component 420. The suction component 410 is installed in the first installation hole 201. The suction component 410 can generate suction, including a vacuum roller 421, a rotating sleeve 422 and a water absorption layer 423. The vacuum roller 421 is provided with a vacuum cavity 4201 and a liquid absorption hole 4202. The vacuum cavity 4201 is connected to the suction component 410 and the liquid absorption hole 4202 respectively. The rotating sleeve 422 is sleeved on the vacuum roller 421. The rotating sleeve 422 can rotate on the vacuum roller 421. The rotating sleeve 422 is provided with a liquid passing hole 4203. The liquid passing hole 4203 is connected to the liquid absorption hole 4202. The water absorption layer 423 covers the surface of the rotating sleeve 422, the water-absorbing layer 423 abuts against the transport component 100, and the water-absorbing layer 423 is made of materials such as water-absorbing sponge, and can absorb acidic sewage when contacting the electroplating clamp; the jet structure 300 includes a jet component 310 and a jet box 320, the jet component 310 is installed in the second installation hole 202, the jet box 320 is provided with a jet cavity 3201, the jet component 310 is connected to the jet cavity 3201, the jet box 320 is arranged on the side of the water-absorbing layer 423 away from the transport component 100, the jet box 320 is provided with a jet hole 3202 connected to the jet cavity 3201, and the jet hole 3202 can spray toward the water-absorbing layer 423.

[0033] In this embodiment, the plating clamp clamps the circuit board for soaking. Acidic wastewater remains on the plating clamp after soaking. The plating clamp is moved toward the vacuum roller 421 by the transport component 100. When the plating clamp abuts against the water absorption layer 423, the rotating sleeve 422 rotates along with the movement of the plating clamp. The water absorption layer 423 is made of a water-absorbing sponge or the like, and its texture is relatively soft, so that the plating clamp sinks into the water absorption layer 423. The acidic wastewater of the electroplating clamp is absorbed into the water absorbing layer 423, and the suction component 410 generates suction force, so that the vacuum chamber 4201, the liquid suction hole 4202 and the liquid passing hole 4203 connected in sequence form a negative pressure to generate suction force, so that the acidic wastewater in the water absorbing layer 423 passes through the liquid passing hole 4203, the liquid suction hole 4202 and the vacuum chamber 4201 in sequence, and is then sucked away by the suction component 410; the blood spraying component is inflated, so that the gas is sprayed out from the jet hole 3202 through the jet box 320 in sequence, and the jet hole 3202 sprays toward the water absorbing layer 423 and the transport component 100, so that the water absorbing layer 423 and the electroplating clamp on the transport component 100 are blown dry.

[0034] The above-mentioned electroplating clamp quick-drying device 10, through the electroplating clamp abutting against the water absorption layer 423, makes the acidic wastewater of the electroplating clamp be sucked into the water absorption layer 423, and then generates suction through the suction component 410, so that the acidic wastewater in the water absorption layer 423 passes through the liquid hole 4203, the liquid absorption hole 4202 and the vacuum chamber 4201 in turn, and the acidic wastewater is sucked away by the suction component 410, so that the acidic wastewater of the electroplating clamp is quickly removed, thereby preventing the circuit board on the electroplating clamp from being corroded by the acidic wastewater, thereby improving the yield rate of circuit board production; through the jet component 310, the water absorption layer 423 and the electroplating clamp on the transport component 100 are blown dry, thereby improving the water absorption effect of the dried water absorption layer 423, and improving the drying effect of the electroplating clamp.

[0035] like Figure 4 and Figure 5 As shown, in one embodiment, the number of the suction holes 4202 is multiple, and the multiple suction holes 4202 are arranged at intervals along the circumference of the vacuum roller 421. In this embodiment, the multiple suction holes 4202 are conducive to increasing the passage of the acidic sewage, so that the speed of the acidic sewage entering the vacuum chamber 4201 from the suction holes 4202 is accelerated, thereby accelerating the speed of the suction component 410 sucking the acidic sewage.

[0036] like Figure 4 and Figure 5 As shown, in one embodiment, the number of the liquid-passing holes 4203 is multiple, and the multiple liquid-passing holes 4203 are arranged at intervals along the circumference of the rotating shaft sleeve 422. In this embodiment, the multiple liquid-passing holes 4203 are evenly arranged around the circumference of the rotating shaft sleeve 422, so that the acidic sewage remaining at each position of the water-absorbing layer 423 can quickly enter the liquid-absorbing hole 4202 from different liquid-passing holes 4203, so that the acidic sewage in the water-absorbing layer 423 is quickly absorbed, thereby accelerating the speed at which the suction component 410 absorbs the acidic sewage.

[0037] like Figure 3 As shown, in one embodiment, the number of the air jet holes 3202 is multiple, and the number of the air jet holes 3202 is multiple, and the multiple air jet holes 3202 are spaced apart and arranged on one side of the air jet box 320 adjacent to the water absorption layer 423. In this embodiment, the multiple air jet holes 3202 increase the air output and the position of the air jet, so that more air is blown onto the water absorption layer 423 and the electroplating clip, thereby accelerating the drying speed of the water absorption layer 423 and the electroplating clip.

[0038] like Figure 2As shown, in one embodiment, the jet box 320 is a semicircular ring structure, the jet box 320 extends along the vacuum roller 421 as the center, and a plurality of jet holes 3202 are arranged at intervals along the circumference of the jet box 320. In this embodiment, the jet directions of the jet holes 3202 are evenly arranged along the circumference of the water absorbing layer 423, so that the air can be evenly blown to each part of the water absorbing layer 423, so that the water absorbing layer 423 is quickly dried.

[0039] like Figure 4 As shown, in one embodiment, the roller assembly 420 further includes a vacuum column 424, which is disposed in the vacuum chamber 4201 and connected to the vacuum roller 421. In this embodiment, the vacuum column 424 makes the space of the vacuum chamber 4201 smaller, and the airflow is more easily compressed, so that the acidic sewage is more easily sucked through the vacuum chamber 4201 and then enters the suction assembly 410 through the vacuum chamber 4201.

[0040] like Figure 1 As shown, in one embodiment, the suction assembly 410 includes a suction pipe 411 and a suction pump 412, one end of the suction pipe 411 is connected to the vacuum roller 421, the suction pump 412 is connected to the other end of the suction pipe 411, the suction pipe 411 is installed in the first installation hole 201, and the suction pump 412 is arranged above the support assembly 200. In this embodiment, the suction pipe 411 is fixed in the first installation hole 201, so that the suction pipe 411 fixes the vacuum roller 421 on the support assembly 200, and when the suction pump 412 is working, the suction pipe 411 generates suction, thereby sucking the acidic sewage in the vacuum roller 421.

[0041] like Figure 1 As shown, in one embodiment, the jet assembly 310 includes a jet pipe 311 and a jet pump 312, one end of the jet pipe 311 is connected to the jet box 320, the jet pump 312 is connected to the other end of the jet pipe 311, the jet pipe 311 is installed in the second installation hole 202, and the jet pump 312 is arranged on the side of the support assembly 200 away from the jet box 320. In this embodiment, the jet pipe 311 is fixed in the second installation hole 202, so that the jet pipe 311 fixes the jet box 320 on the support assembly 200, the jet pump 312 can spray air into the jet pipe 311, so that the air passes through the jet pipe 311 and the jet chamber 3201 in sequence, and finally sprays out from the jet hole 3202, and the jet pump 312 is a high-pressure air compressor, which can generate a large airflow, so that the water absorption layer 423 and the electroplating clip are quickly blown dry.

[0042] like Figure 1As shown, in one embodiment, the support assembly 200 includes a support frame 210 and a support plate 220, the support plate 220 is erected on the ground, and the support plate 220 is connected to the top of the support frame 210. In this embodiment, the support frame 210 and the support plate 220 are made of steel, and the support frame 210 and the support plate 220 can bear a large load. The jet pipe 311 and the suction pipe 411 are connected to the support plate 220 by welding, so that the vacuum roller 421 and the jet box 320 are suspended in a fixed position.

[0043] like Figure 1 As shown, in one embodiment, the transport assembly 100 includes a transport track 110, a driving motor 120 and a fixing member 130. The transport track 110 is connected to the output end of the driving motor 120. The fixing member 130 is connected to the transport track 110. The transport track 110 is used to transport the fixing member 130. There are multiple fixing members 130, and multiple fixing members 130 are arranged at intervals on the transport track 110. In this embodiment, the driving motor 120 drives the transport track 110 to move the fixing member 130, so that the electroplating clip installed on the fixing member 130 moves toward the water absorption structure 400. Multiple fixing members 130 can be installed with multiple electroplating clips, so that the multiple electroplating clips are sequentially passed through the jet structure 300 and the water absorption structure 400 to be quickly dried, thereby improving the efficiency of drying multiple electroplating clips.

[0044] Compared with the prior art, the utility model has at least the following advantages:

[0045] 1. The electroplating clamp quick drying device 10 mentioned above, through the electroplating clamp abutting against the water absorption layer 423, the acidic wastewater of the electroplating clamp is sucked into the water absorption layer 423, and then the suction component 410 generates suction force, so that the acidic wastewater in the water absorption layer 423 passes through the liquid hole 4203, the liquid absorption hole 4202 and the vacuum chamber 4201 in sequence, and then the acidic wastewater is sucked away by the suction component 410, so that the acidic wastewater of the electroplating clamp is quickly removed, thereby preventing the circuit board on the electroplating clamp from being corroded by the acidic wastewater, thereby improving the yield rate of circuit board production;

[0046] 2. The jet assembly 310 is used to blow air to dry the water absorption layer 423 and the electroplating clip on the transport assembly 100, thereby improving the water absorption effect of the dried water absorption layer 423 and improving the drying effect of the electroplating clip.

[0047] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A quick-drying device for electroplating clamps, comprising a transport component, a support component, an air jet structure and a water absorption structure, wherein the transport component is used to control the movement of the electroplating clamp, the support component is erected on the ground, and the support component is provided with a first mounting hole and a second mounting hole, characterized in that: The water absorption structure comprises a suction component and a roller component, wherein the suction component is mounted on the first mounting hole, the roller component comprises a vacuum roller, a rotating shaft sleeve and a water absorption layer, the vacuum roller is provided with a vacuum cavity and a liquid absorption hole, the vacuum cavity is respectively connected to the suction component and the liquid absorption hole, the rotating shaft sleeve is sleeved on the vacuum roller, the rotating shaft sleeve is provided with a liquid passing hole, the liquid passing hole is connected to the liquid absorption hole, the water absorption layer covers the surface of the rotating shaft sleeve, and the water absorption layer abuts against the transport component; The jet structure includes a jet component and a jet box, the jet component is installed in the second installation hole, the jet box is provided with a jet cavity, the jet component is connected to the jet cavity, the jet box is arranged on the side of the water absorption layer away from the transport component, and the jet box is provided with a jet hole connected to the jet cavity.

2. The electroplating clamp quick drying device according to claim 1, characterized in that: There are a plurality of the liquid suction holes, and the plurality of the liquid suction holes are arranged at intervals along the circumference of the vacuum roller.

3. The electroplating clamp quick drying device according to claim 1, characterized in that: There are a plurality of the liquid passage holes, and the plurality of the liquid passage holes are arranged at intervals along the circumferential direction of the rotating sleeve.

4. The electroplating clamp quick drying device according to claim 1, characterized in that: There are a plurality of the air jet holes, and the plurality of the air jet holes are arranged at intervals on a side of the air jet box adjacent to the water absorption layer.

5. The electroplating clamp quick drying device according to claim 4, characterized in that: The jet box is a semicircular ring structure, the jet box extends along the vacuum roller as the center, and a plurality of jet holes are arranged at intervals along the circumference of the jet box.

6. The electroplating clamp quick drying device according to claim 1, characterized in that: The roller assembly further comprises a vacuum column, which is disposed in the vacuum chamber and connected to the vacuum roller.

7. The electroplating clamp quick drying device according to claim 1, characterized in that: The suction assembly includes a suction pipe and a suction pump, one end of the suction pipe is connected to the vacuum roller, the suction pump is connected to the other end of the suction pipe, the suction pipe is installed in the first installation hole, and the suction pump is arranged above the support assembly.

8. The electroplating clamp quick drying device according to claim 1, characterized in that: The jet assembly includes a jet pipe and a jet pump, one end of the jet pipe is connected to the jet box, the jet pump is connected to the other end of the jet pipe, the jet pipe is installed in the second installation hole, and the jet pump is arranged on the side of the support assembly away from the jet box.

9. The electroplating clamp quick drying device according to claim 1, characterized in that: The support assembly comprises a support frame and a support plate. The support frame is erected on the ground, and the support plate is connected to the top of the support frame.

10. The electroplating clamp quick drying device according to claim 1, characterized in that: The transport component includes a transport track, a drive motor and a fixing part. The transport track is connected to the output end of the drive motor. The fixing part is connected to the transport track. The transport track is used to transport the fixing part. There are multiple fixing parts, and the multiple fixing parts are arranged at intervals on the transport track.