Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, relates to fluid heat dissipation technical field, the heat dissipation device comprises a heat dissipation substrate, a diversion piece and a sealing plate, the heat dissipation substrate is provided with a first groove, the bottom of the first groove is provided with a second groove, the second groove comprises a first end, a second end and a circulation section located between the first end and the second end, the first end is used for fluid inflow, and the second end is used for fluid outflow; the flow guide piece comprises a plurality of flow guide sections, all the flow guide sections are sequentially laid along the circulation section, and a first gap exists between every two adjacent flow guide sections; the sealing plate is matched with the first groove, the sealing plate is provided with a first connector communicating with the first end and a second connector communicating with the second end, and through the flow guide section and the first gap, the heat dissipation area can be increased, the flow direction of fluid can be guided, the overall heat dissipation uniformity is facilitated, the blocking risk is reduced, and the heat dissipation performance is improved; and meanwhile, the production cost and complexity are reduced, so that the requirements of modern industry for efficient and reliable heat dissipation solutions are met.

Description

Technical Field

[0001] The utility model relates to the technical field of fluid heat dissipation, in particular to a heat dissipation device. Background Art

[0002] Fluid cooling technology has been widely used in modern industrial and electronic equipment, especially in high-power density equipment, where the demand for efficient heat dissipation is increasing. Compared with traditional air-cooled systems, fluid cooling utilizes the high specific heat capacity and excellent thermal conductivity of liquids, and has significant advantages in heat transfer and heat dissipation. Common applications include data center servers, high-performance computers, and electric vehicle battery thermal management, which quickly remove heat through water circulation to ensure stable operation and extend life. In addition, fluid cooling is also widely used in chemical reactors and biomedical equipment (such as MRI, CT scanners) to accurately manage thermal performance and ensure that the equipment operates stably under the same environment, thereby maintaining its optimal working state.

[0003] Fluid cooling is a heat dissipation method that uses liquids with good thermal conductivity such as water and oil as cooling media. It is widely used in industries, computers, and automobiles. Common types of water cooling include pre-buried copper pipe water cooling systems, cooling towers, water cooling radiators, closed-loop water cooling systems, and open-loop water cooling systems. The pre-buried copper pipe system is pre-buried with copper pipes when the equipment is manufactured, which can effectively conduct heat and is suitable for large-scale industrial equipment and computer room air conditioners. The cooling tower reduces the water temperature through the principle of evaporative cooling and is suitable for large-scale cooling needs. The water cooling radiator combines water flow and fans to enhance the heat dissipation effect and is commonly found in computer water cooling systems. The closed-loop system flows in a closed loop to reduce water evaporation and is suitable for equipment that requires continuous cooling, while the open-loop system directly uses natural water sources and is suitable for occasions with large cooling needs. Choosing a suitable water cooling system usually depends on factors such as specific application requirements, environmental conditions, and economic efficiency.

[0004] The sealing process is crucial in the water cooling system, and sealing rings (such as flanges and clamps) are usually used to prevent liquid leakage. Flanges are suitable for high-pressure environments, and clamps are convenient for disassembly and assembly in medium and low pressure scenarios. Commonly used materials include corrosion-resistant and high-temperature resistant rubber and fluororubber. In addition to the above-mentioned examples of using sealing rings for sealing, welding technologies such as brazing, fusion welding and laser welding also play a key role. Brazing is suitable for the connection of complex shapes and thin-walled materials, fusion welding is suitable for the strength requirements of high-pressure components, and laser welding provides high precision and extremely small heat-affected zones, which is particularly suitable for the manufacture of complex components. These processes ensure efficient heat dissipation, sealing and long-term reliability of the water cooling system.

[0005] The application of welding process in fluid cooling system has many advantages, but also some disadvantages that cannot be ignored. The welding process may cause changes in the material properties of the heat-affected zone, affecting the strength and corrosion resistance of the welded part. The welding process usually requires high temperature operation, which may cause damage to certain heat-sensitive materials. The quality control of welded joints is relatively complicated. Improper welding may cause tiny cracks or defects, which in turn affect the sealing and reliability of the system. The implementation of welding process requires professional technology and equipment, which increases production costs and time. Post-welding inspection and testing may add additional processes and increase the complexity of overall manufacturing.

[0006] Therefore, how to improve heat dissipation performance while reducing production costs and complexity to meet the needs of modern industry for efficient and reliable heat dissipation solutions is a technical problem that technical personnel in this field currently need to solve. Utility Model Content

[0007] The purpose of the utility model is to provide a heat dissipation device that can improve heat dissipation performance while reducing production costs and complexity to meet the needs of modern industry for efficient and reliable heat dissipation solutions.

[0008] In order to achieve the above object, the utility model provides a heat dissipation device, comprising:

[0009] The heat dissipation substrate is provided with a first groove, a second groove is provided at the bottom of the first groove, the second groove comprises a first end, a second end, and a flow section located between the first end and the second end, the first end is used for fluid inflow, and the second end is used for fluid outflow;

[0010] The flow guide comprises a plurality of flow guide sections, and all the flow guide sections are laid in sequence along the flow section, and a first gap exists between adjacent flow guide sections;

[0011] A sealing plate adapted to the first groove, and the sealing plate is provided with a first joint connected to the first end and a second joint connected to the second end;

[0012] The first end and / or the second end comprises a tapered surface, the tapered surface is a circumferential surface of the first end and / or the second end, and the end with a smaller diameter of the tapered surface is located at the bottom of the second groove;

[0013] The flow guide is a bent structure, and the flow guide comprises at least one bend for changing the flow direction of the fluid, and the bend angle of the bend is greater than or equal to 90°;

[0014] All flow guide sections include a plurality of flow channels, and all flow channels in the same flow guide section are arranged at equal intervals;

[0015] The cross section of the flow channel perpendicular to the flow direction of the fluid is U-shaped or semicircular.

[0016] Preferably, the top of the sealing plate is flush with the top of the heat dissipation substrate, so that the top edge of the sealing plate and the top edge of the first groove form a welding track.

[0017] Preferably, the top of the sealing plate and the top of the heat dissipation substrate are fixed by friction welding.

[0018] Preferably, the top of the guide member is flush with the bottom of the first groove, and the top of the guide member can fit the bottom of the sealing plate.

[0019] Preferably, the first joint and the second joint are both annular structures protruding from the top of the sealing plate.

[0020] Preferably, the heat dissipation substrate and the sealing plate are made of aluminum alloy.

[0021] Compared with the above background technology, the heat dissipation device provided by the present invention has the following technical effects:

[0022] A first groove and a second groove located at the bottom of the first groove are provided on the heat dissipation substrate in the form of a groove, the second groove is used for sequentially laying the guide section, the first groove is used to seal the second groove by setting a sealing plate after the guide section is laid, the first joint is connected to the first end, and the second joint is connected to the second end, so that the fluid flows along the guide section to exchange heat, and the guide section and the first gap can increase the heat dissipation area, guide the flow direction of the fluid, help the uniformity of the overall heat dissipation, reduce the risk of blockage, improve the heat dissipation performance, and reduce the production cost and complexity at the same time, so as to meet the needs of modern industry for efficient and reliable heat dissipation solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0024] FIG1 is a schematic structural diagram of a heat dissipation substrate provided by an embodiment of the utility model;

[0025] FIG. 2 is a schematic structural diagram of the heat dissipation substrate and the sealing plate provided by an embodiment of the utility model when they are connected.

[0026] in:

[0027] 100 - heat dissipation substrate, 110 - first groove, 120 - first end, 121 - tapered surface, 130 - second end;

[0028] 210-flow guide section, 220-first gap;

[0029] 300-sealing plate, 310-first joint, 320-second joint;

[0030] 400-welded rails;

[0031] 500-welded joint. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0034] In the description of the present invention, it should be understood that the terms "top", "bottom", "left" and "right" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the position or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation of the present invention.

[0035] The purpose of the utility model is to provide a heat dissipation device that can improve heat dissipation performance while reducing production costs and complexity to meet the needs of modern industry for efficient and reliable heat dissipation solutions.

[0036] Please refer to FIG. 1 and FIG. 2 . To achieve the above-mentioned purpose, the utility model provides a heat dissipation device, including a heat dissipation substrate 100 , a flow guide and a sealing plate 300 .

[0037] The heat dissipation substrate 100 is provided with a first groove 110, and a second groove is provided at the bottom of the first groove 110. The second groove includes a first end 120, a second end 130, and a flow section located between the first end 120 and the second end 130. The first end 120 is used for fluid inflow, and the second end 130 is used for fluid outflow.

[0038] Among them, taking the heat dissipation substrate 100 with a cube structure as an example, the first groove 110 can be a square groove, and the second groove can be a pipe-shaped groove opened at the bottom of the first groove 110. The two ends of the pipe-shaped groove can be located below the diagonal of the first groove 110 to increase the length of the flow section between the two ends as much as possible, thereby increasing the area of ​​heat exchange by increasing the path through which the fluid flows.

[0039] The guide member includes a plurality of guide sections 210, and all the guide sections 210 are laid in sequence along the flow section. There is a first gap 220 between adjacent guide sections 210. All the guide sections 210 include a plurality of flow channels, and all the flow channels in the same guide section 210 are arranged at equal intervals. The cross-section of the flow channel perpendicular to the flow direction of the fluid is U-shaped or semicircular. The arrangement of the U-shaped or semicircular guide sections 210 can evenly distribute the flow rate and flow velocity of the fluid, reduce the risk of blockage, and increase the internal exchange area to improve the uniformity of overall heat dissipation.

[0040] The setting of the first gap 220 allows the fluid flowing through the previous guide section 210 to flow freely into the next guide section 210. For example, when the guide sections 210 include flow channels A and B, the flow paths of the fluid in adjacent guide sections 210 have four options: A first then A, A first then B, B first then B, and B first then A. When the first gap 220 is not set, there are only A first then A and B first then B. If any of the flow channels A and B are blocked, the fluid can only move along one flow path, which significantly reduces the heat dissipation effect of the heat dissipation device.

[0041] The sealing plate 300 is adapted to the first groove 110 , and the sealing plate 300 is provided with a first joint 310 connected to the first end 120 and a second joint 320 connected to the second end 130 .

[0042] It is understandable that the depth of the first groove 110 and the second groove can be controlled according to actual needs so that the distance between the bottom of the second groove and the bottom of the heat dissipation substrate 100 reaches a preset value. For example, when the distance between the bottom of the second groove and the heat dissipation substrate 100 is small, the heat exchange effect between the fluid and the outside world can be improved.

[0043] A first groove 110 and a second groove located at the bottom of the first groove 110 are provided in the form of a groove on the heat dissipation substrate 100. The second groove is used for sequentially laying the guide section 210. The first groove 110 is used to seal the second groove by setting a sealing plate 300 after the guide section 210 is laid. The first joint 310 is connected to the first end 120, and the second joint 320 is connected to the second end 130, so that the fluid flows along the guide section 210 to exchange heat. Through the guide section 210 and the first gap 220, the heat dissipation area can be increased, the flow direction of the fluid can be guided, the uniformity of the overall heat dissipation can be improved, the risk of blockage can be reduced, the heat dissipation performance can be improved, and the production cost and complexity can be reduced at the same time to meet the needs of modern industry for efficient and reliable heat dissipation solutions.

[0044] It should be noted that the heat dissipation substrate 100 and the sealing plate 300 can be made of aluminum alloy, the first groove 110 and the second groove are cut from the heat dissipation substrate 100, the top of the sealing plate 300 is flush with the top of the heat dissipation substrate 100, so that the top edge of the sealing plate 300 and the top edge of the first groove 110 form a welding track 400, and the top of the sealing plate 300 and the top of the heat dissipation substrate 100 are fixed by friction welding.

[0045] The above-mentioned friction welding can effectively weld some metal materials that are difficult to weld. The distance of the welding head can be adjusted according to the thermal curve of the material to ensure the welding quality and the strength of the joint, ensure the high strength and excellent sealing of the joint, and adopt high-frequency vibration method to achieve high-strength connection without melting the metal, ensure the sealing and corrosion resistance of the joint. It is suitable for fluid cooling systems under high temperature and high pressure environments, and generally no welding defects will occur, ensuring the reliability of the connection.

[0046] In addition, friction welding has a high welding speed, is suitable for mass production, and can improve production efficiency. Unlike traditional welding, friction welding does not melt metal, can avoid the problem of plastic deformation, and maintain the original properties of the material. At the same time, friction welding uses a welding method in which the welding joint 500 moves along the welding track 400, and does not directly contact the guide member, thereby avoiding process damage to the guide member.

[0047] In this embodiment, the first end 120 and / or the second end 130 includes a conical surface 121, which is a circumferential surface of the first end 120 and / or the second end 130, and the end with a smaller diameter of the conical surface 121 is located at the bottom of the second groove, which can effectively reduce the water hammer effect generated when the fluid is opened and closed, and significantly extend the service life of the internal flow channel. The conical surface 121 can also be replaced by a curved surface, etc., as long as the above purpose can be achieved.

[0048] Among them, the conical surface 121 is provided with an opening connected to the flow section, for example, a first opening is provided on the right side of the first end 120 and a second opening is provided on the left side of the second end 130. The first opening and the second opening are connected to the two ends of the flow section to realize unidirectional flow of the fluid in the second groove.

[0049] The guide piece is a bent structure, and the design of the guide piece is a customized structure. It can adjust the layout of the flow channel according to the position of the heating element to achieve an integrated design of the guide section 210, while optimizing the heat dissipation performance and reducing the volume. The guide piece as a whole can provide a flexible thermal management solution according to specific applications (such as heat dissipation of electronic components, chemical reactors or biomedical equipment) to ensure efficient heat dissipation under different working conditions.

[0050] Usually, the guide piece as a whole should include at least one bend for changing the flow direction of the fluid. The bending angle of the bend should be greater than or equal to 90° to reduce or even avoid the impact of the fluid on the guide piece when turning, thereby increasing the service life of the guide piece. At the same time, the flow channel at the bend should adopt an arc-shaped structure to increase the smoothness of the fluid turning.

[0051] In addition, the top of the guide member is flush with the bottom of the first groove 110, and the top of the guide member can fit onto the bottom of the sealing plate 300 to separate the flow channels of the same guide section 210, thereby increasing the heat dissipation area and increasing the usage scenarios of the heat dissipation device.

[0052] The first connector 310 and the second connector 320 are both annular structures protruding from the top of the sealing plate 300 to be connected to an external fluid supply device.

[0053] The heat dissipation device provided in this application can be applied to a variety of scenarios. Taking the solar simulator as an example, the LED light panels are arranged in a matrix on the base plate. Since the LEDs generate heat when working, in order to ensure that the output power of the LED light panels always remains at a relatively constant value, they must be evenly dissipated.

[0054] The traditional air cooling method has the problems of uneven heat dissipation and high noise, resulting in higher temperature in the central area and lower temperature in the peripheral area, which seriously affects the irradiance of the instrument. To solve the above problems, the heat dissipation substrate 100 is installed on the bottom plate, and the first end 120 and the second end 130 with a conical surface 121 are used for fluid inflow and outflow. This design can effectively reduce the water hammer effect when the fluid flows in, thereby extending the service life of the heat dissipation substrate 100.

[0055] By utilizing the characteristics of the fluid and increasing the flow rate of the fluid, the temperature of the entire heat dissipation substrate 100 can be effectively controlled to ensure the stability of the irradiance of the LED. After the guide piece of the heat dissipation substrate 100 is set, the welding joint 500 moves along the welding track 400 through high-speed motion (vibration / rotation) to complete the welding of the sealing plate 300 and the heat dissipation substrate 100. After the entire plate is cooled, the workpiece is completed.

[0056] In summary, the heat dissipation device provided in the present application can effectively improve the fluid flow performance by increasing the surface area and optimizing the flow path, ensure rapid heat dissipation in high power density equipment, reduce the performance degradation and failure risk of the equipment due to overheating, and significantly improve the heat dissipation performance; the application of friction welding technology can ensure that the joint has high strength and excellent sealing, overcome the heat-affected zone and joint defects that may occur in traditional welding technology, thereby improving the overall reliability of the system, and the metal will not melt during the welding process, avoiding plastic deformation of the material, thereby maintaining the original performance; friction welding has a fast speed and is suitable for the production of large-scale products, reducing the production cycle, improving overall production efficiency, and reducing manufacturing costs; the second groove and the guide member can be customized and can be optimized according to the position of the heating element, reducing the complexity of the flow channel design, thereby improving the overall performance and adaptability of the system, and meeting the needs of modern industry for efficient and reliable heat dissipation solutions.

[0057] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0058] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0059] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the utility model.

Claims

1. A heat dissipation device, characterized in that: include: A heat dissipation substrate (100) is provided with a first groove (110), a second groove is provided at the bottom of the first groove (110), the second groove comprises a first end (120), a second end (130), and a flow section located between the first end (120) and the second end (130), the first end (120) is used for fluid inflow, and the second end (130) is used for fluid outflow; A flow guide, comprising a plurality of flow guide sections (210), wherein all of the flow guide sections (210) are laid in sequence along the flow section, and a first gap (220) exists between adjacent flow guide sections (210); A sealing plate (300) adapted to fit in the first groove (110), and the sealing plate (300) is provided with a first joint (310) connected to the first end (120) and a second joint (320) connected to the second end (130); The first end (120) and / or the second end (130) comprises a conical surface (121), the conical surface (121) being a circumferential surface of the first end (120) and / or the second end (130), and an end of the conical surface (121) with a smaller diameter is located at the bottom of the second groove; The guide member is a bent structure, and the guide member comprises at least one bend for changing the flow direction of the fluid, and the bend angle of the bend is greater than or equal to 90°; All of the flow guide sections (210) include a plurality of flow channels, and all of the flow channels in the same flow guide section (210) are arranged at equal intervals; The cross section of the flow channel perpendicular to the flow direction of the fluid is U-shaped or semicircular.

2. The heat dissipation device according to claim 1, characterized in that: The top of the sealing plate (300) is flush with the top of the heat dissipation substrate (100), so that the top edge of the sealing plate (300) and the top edge of the first groove (110) form a welding track (400).

3. The heat dissipation device according to claim 2, characterized in that: The top of the sealing plate (300) and the top of the heat dissipation substrate (100) are fixed by friction welding.

4. The heat dissipation device according to claim 1, characterized in that: The top of the flow guide is flush with the bottom of the first groove (110), and the top of the flow guide can fit the bottom of the sealing plate (300).

5. The heat dissipation device according to claim 1, characterized in that: The first joint (310) and the second joint (320) are both annular structures protruding from the top of the sealing plate (300).

6. The heat dissipation device according to claim 1, characterized in that: The heat dissipation substrate (100) and the sealing plate (300) are made of aluminum alloy.

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