Automatic adhesive removing machine for patch alloy resistor

Abstract

The utility model discloses an automatic degumming machine for a patch alloy resistor, which comprises a first mounting seat and a second mounting seat, the first mounting seat and the second mounting seat are vertically arranged in a mirroring manner, the first mounting seat is fixedly connected with the second mounting seat, the right side of the first mounting seat is fixedly connected with a feeding seat, and the right side of the feeding seat is fixedly connected with a discharging seat. The top of the feeding seat is connected with a material pushing plate, alloy resistors are connected to the material pushing plate in a clamped mode at equal intervals, transverse feeding and discharging are more stable, glue removing can be conducted on the alloy resistors in a targeted mode through an annular sponge pad, glue removing operation can be conducted through the annular sponge pad fully, a glue removing agent can be effectively used for soaking the annular sponge pad, and the glue removing efficiency is improved. According to the adhesive removing device for the alloy resistor, the using amount of the adhesive removing agent can be better saved, the situation that the adhesive removing agent is wasted is avoided, the adhesive removing effect of the alloy resistor can be further improved through the warm environment, and the adhesive removing agent sprayed on the annular sponge pad can be evenly contacted and absorbed through the material homogenizing plate.

Description

Technical Field

[0001] The utility model relates to the technical field of resistor debonding equipment, in particular to an automatic debonding machine for chip alloy resistors. Background Art

[0002] The chip alloy resistor is a chip sampling resistor with a small resistance value. It is connected in series in the circuit to convert current into voltage signals for measurement. Its main material is copper, and other materials become constantan, manganese copper, etc. There are many other auxiliary materials, but the main performance is determined by the alloy material itself. After the chip alloy capacitor is patched, excess glue will adhere to the surface of the resistor. In order to ensure the beauty of the resistor and subsequent normal installation and use, the glue on the surface needs to be removed.

[0003] In the prior art, the surface of the chip alloy resistor is manually debonded one by one, which requires a lot of labor and has a low degree of automation. In addition, fingerprints will be left on the surface of the resistor during the manual debonding process, resulting in a decrease in the neatness of the resistor surface. Application No. 202123133525.7 discloses an automatic debonding machine for chip alloy resistors, including two conveyor belts that can move in opposite directions or in opposite directions, and the two conveyor belts can convey synchronously. A plurality of storage grooves are equidistantly provided on the surface of each of the conveyor belts. A plurality of resistors are conveyed on the upper surface of the conveyor belt, and the two ends of each resistor are respectively placed in the storage grooves of the two conveyor belts. A liftable debonding component is provided above and below the resistor. The above-mentioned device needs to soak the sponge pad before debonding the resistor. The sponge needs to be manually soaked, resulting in a waste of debonding agent. In addition, the material conveyed by the conveyor belt is prone to fall after rotating to the bottom. The plate-shaped sponge pad cannot contact the resistor in a targeted manner, which will cause some sponges to be unable to effectively contact the resistor, resulting in the inability to fully utilize the debonding agent in the sponge.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] In view of the problems in the related technology, the utility model proposes an automatic glue removing machine for chip alloy resistors to overcome the above technical problems existing in the existing related technology.

[0006] To this end, the specific technical solutions adopted by the utility model are as follows:

[0007] A chip alloy resistor automatic glue removal machine comprises a first mounting seat and a second mounting seat, wherein the first mounting seat and the second mounting seat are arranged in a mirror image up and down, and the first mounting seat and the second mounting seat are fixedly connected, a feeding seat is fixedly connected to the right side of the first mounting seat, a pushing plate is connected to the top of the feeding seat, alloy resistors are equidistantly connected to the pushing plate, and servo motors are fixedly connected to the upper front side of the first mounting seat and the lower front side of the second mounting seat respectively.

[0008] Preferably, a rectangular groove is dug in the middle of the top side of the feeding seat, and a rodless cylinder is fixedly connected between the inner walls of the rectangular groove. The feeding seat includes a side baffle and a supporting plate, and the middle left side of the side baffle is fixedly connected to the supporting plate.

[0009] Preferably, placement openings are symmetrically and equidistantly provided on the top of the carrier plate, and the placement openings are movably engaged with the outer side of the alloy resistor, and the movable end of the rodless cylinder is fixedly connected to the middle part of the bottom side of the side baffle.

[0010] Preferably, connection openings are equidistantly provided on the right side of the top of the first mounting seat and the right side of the bottom of the second mounting seat, and the output shaft of the servo motor extends into the inner cavity of the first mounting seat and the second mounting seat and is fixedly connected with a rotating shaft.

[0011] Preferably, rotating wheels are fixed equidistantly on the outer wall of the rotating shaft, the positions of the rotating wheels correspond to the positions of the connecting openings and extend out of the top openings of the connecting openings, and an annular sponge pad is fixedly mounted on the outer wall of the rotating wheels.

[0012] Preferably, the bottom side of the inner wall of the first mounting seat and the top side of the inner wall of the second mounting seat are respectively fixedly connected with mounting boxes, the bottom sides of the rotating wheels extend into the interior of the mounting boxes, the first mounting seat and the left side of the inner wall of the second mounting seat are fixedly connected with a liquid storage tank, and one side of the liquid storage tank is fixedly connected with a feed pump.

[0013] Preferably, the input end of the feed pump is fixedly connected to the bottom side of the liquid storage tank through a pipeline, the output end of the feed pump is fixedly connected to a T-shaped pipe, the right end of the T-shaped pipe is equidistantly connected to an atomizing nozzle on the right side of the outer wall, and the atomizing nozzle is respectively fixedly connected to the left side of the inner wall of the installation box.

[0014] Preferably, a material equalizing plate is fixedly connected to the right side of the inner wall of the bottom opening of the upper installation box and the right side of the inner wall of the top opening of the lower installation box respectively, a heating box is fixedly connected at the corner of the inner wall of the installation box, an electric heating tube is fixedly connected inside the heating box, and an air outlet is provided through the middle of the outer wall.

[0015] The beneficial effects of the utility model are as follows: compared with conveyor belt transportation, lateral feeding and discharging are more stable, the annular sponge pad can be used to specifically remove the glue of the alloy resistor, the annular sponge pad can be fully utilized for the degumming operation, the degumming agent can be effectively used to soak the annular sponge pad, and compared with the pouring method, the amount of degumming agent can be better saved, and the waste of degumming agent can be avoided, so that the inside of the installation box can maintain a certain stability, and the warm environment can further improve the degumming effect of the alloy resistor, the annular sponge pad will contact with the material balancing plate during the rotation, so that the material balancing plate will evenly contact and absorb the degumming agent sprayed on the annular sponge pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of an automatic glue removal machine for chip alloy resistors according to an embodiment of the utility model;

[0018] Figure 2 It is a schematic diagram of the top structure of a feeding seat of an automatic glue removal machine for chip alloy resistors according to an embodiment of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of a first mounting base of an automatic glue removal machine for chip alloy resistors according to an embodiment of the utility model;

[0020] Figure 4 The utility model is a schematic diagram of the internal structure of an installation box of an automatic glue removal machine for chip alloy resistors according to an embodiment of the utility model.

[0021] In the figure:

[0022] 1. First mounting seat; 2. Second mounting seat; 3. Feeding seat; 4. Pushing plate; 5. Alloy resistor; 6. Servo motor; 7. Rectangular groove; 8. Rodless cylinder; 9. Side baffle; 10. Loading plate; 11. Placement port; 12. Connection port; 13. Rotating shaft; 14. Rotating wheel; 15. Annular sponge pad; 16. Mounting box; 17. Liquid storage tank; 18. Extraction pump; 19. T-type pipe; 20. Atomizing nozzle; 21. Material equalizing plate; 22. Heating box; 23. Electric heating tube; 24. Air outlet. DETAILED DESCRIPTION

[0023] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0024] According to an embodiment of the utility model, an automatic glue removal machine for chip alloy resistors is provided.

[0025] Embodiment 1

[0026] like Figure 1-4 As shown, according to an embodiment of the utility model, an automatic glue removal machine for chip alloy resistors includes a first mounting seat 1 and a second mounting seat 2. The first mounting seat 1 and the second mounting seat 2 are mirror-imaged up and down, and the first mounting seat 1 and the second mounting seat 2 are fixedly connected. A feeding seat 3 is fixedly connected to the right side of the first mounting seat 1, and a push plate 4 is connected to the top of the feeding seat 3. An alloy resistor 5 is equidistantly connected to the push plate 4. A servo motor 6 is fixedly connected to the upper front side of the first mounting seat 1 and the lower front side of the second mounting seat 2 respectively. A rectangular groove 7 is dug in the middle of the top side of the feeding seat 3, and a rodless cylinder 8 is fixedly connected between the inner walls of the rectangular groove 7. The feeding seat 3 includes a plurality of Including side baffle plate 9 and carrying plate 10, the middle left side of side baffle plate 9 is fixedly connected to the carrying plate 10, the top of the carrying plate 10 is symmetrically and equidistantly provided with placement openings 11, the placement openings 11 are movably engaged with the outer side of the alloy resistor 5, the movable end of the rodless cylinder 8 is fixedly connected to the middle bottom side of the side baffle plate 9, the alloy resistor 5 can be respectively set in the placement openings 11 on the carrying plate 10 for engagement, and then the rodless cylinder 8 is started, and the movable end of the rodless cylinder 8 drives the side baffle plate 9 to move to the left, so that the carrying plate 10 enters between the first mounting seat 1 and the second mounting seat 2 for degumming treatment. Compared with conveyor belt transportation, lateral feeding and discharging are more stable.

[0027] Embodiment 2

[0028] like Figure 1-4As shown, according to an embodiment of the utility model, an automatic glue removal machine for chip alloy resistors includes a first mounting seat 1 and a second mounting seat 2. The first mounting seat 1 and the second mounting seat 2 are mirror-imaged up and down, and the first mounting seat 1 and the second mounting seat 2 are fixedly connected. A feeding seat 3 is fixedly connected to the right side of the first mounting seat 1, and a push plate 4 is connected to the top of the feeding seat 3. An alloy resistor 5 is equidistantly connected to the push plate 4. A servo motor 6 is fixedly connected to the upper front side of the first mounting seat 1 and the lower front side of the second mounting seat 2, respectively. A connecting opening 12 is equidistantly penetrated by the right side of the top of the first mounting seat 1 and the right side of the bottom of the second mounting seat 2, and the output shaft of the servo motor 6 Both extend into the inner cavity of the first mounting seat 1 and the second mounting seat 2, and are fixedly connected with a rotating shaft 13. A rotating wheel 14 is equidistantly fixed on the outer wall of the rotating shaft 13. The position of the rotating wheel 14 corresponds to the position of the connecting port 12, and extends out of the top of the connecting port 12. An annular sponge pad 15 is sleeved and fixed on the outer wall of the rotating wheel 14. The bottom side of the inner wall of the first mounting seat 1 and the top side of the inner wall of the second mounting seat 2 are respectively fixedly connected with a mounting box 16. The bottom side of the rotating wheel 14 extends into the inside of the mounting box 16. The left side of the inner wall of the first mounting seat 1 and the second mounting seat 2 is fixedly connected with a liquid storage tank 17. A material pump 18 is fixedly connected to one side of the liquid storage tank 17. The input end of the material pump 18 passes through The pipeline is fixedly connected to the bottom side of the liquid storage tank 17, the output end of the pump 18 is fixedly connected to a T-shaped pipeline 19, the right end of the T-shaped pipeline 19 is equidistantly connected to the right side of the outer wall with an atomizing nozzle 20, and the atomizing nozzle 20 is respectively fixedly connected to the left side of the inner wall of the mounting box 16. After the carrier plate 10 enters between the first mounting seat 1 and the second mounting seat 2, the servo motor 6 on the front side of the first mounting seat 1 and the second mounting seat 2 is started at the same time, and the output shaft of the servo motor 6 drives the rotating shaft 13 to rotate, so that the rotating wheel 14 on the outer wall of the rotating shaft 13 rotates, so that the annular sponge pad 15 on the outer wall of the rotating wheel 14 is pressed against the upper surface of the alloy resistor placed on the carrier plate 10. , wipe off the glue adhering to the lower surface, use the annular sponge pad 15 to specifically remove the glue of the alloy resistor, and make full use of the annular sponge pad 15 for the removal of glue. Start the extraction pump 18, the extraction pump 18 can extract the glue remover in the liquid storage tank 17, and then transport it to the atomizing nozzle 20 through the T-shaped pipe 19, so that the atomizing nozzle 20 can spray into the installation box 16, and the water mist produced by sandblasting can continuously spray the glue remover on the annular sponge pad 15, and can effectively use the glue remover to soak the annular sponge pad 15. Compared with the pouring method, it can better save the amount of glue remover and avoid the waste of glue remover.

[0029] Embodiment 3

[0030] like Figure 1-4As shown, according to an embodiment of the utility model, an automatic glue removal machine for chip alloy resistors includes a first mounting seat 1 and a second mounting seat 2. The first mounting seat 1 and the second mounting seat 2 are mirror-imaged up and down, and the first mounting seat 1 and the second mounting seat 2 are fixedly connected. A feeding seat 3 is fixedly connected to the right side of the first mounting seat 1, and a pushing plate 4 is connected to the top of the feeding seat 3. An alloy resistor 5 is equidistantly connected to the pushing plate 4. A servo motor 6 is fixedly connected to the upper front side of the first mounting seat 1 and the lower front side of the second mounting seat 2, respectively. A material balancing plate 21 is fixedly connected to the right side of the inner wall of the bottom opening of the upper mounting box 16 and the right side of the inner wall of the top opening of the lower mounting box 16, respectively. The inner wall corners of the mounting box 16 are fixedly A heating box 22 is fixedly connected, an electric heating tube 23 is fixedly connected inside the heating box 22, and an air outlet 24 is penetrated in the middle of the outer wall. The electric heating tube 23 is electrically connected to an external temperature controller through a wire, and the electric heating tube 23 can increase the heat inside the heating box 22 to keep the inside of the mounting box 16 stable to a certain extent. The warm environment can further improve the degumming effect of the alloy resistor 5. The annular sponge pad 15 rotates in the mounting boxes 16 inside the first mounting seat 1 and the second mounting seat 2 respectively. The annular sponge pad 15 will contact with the equalizing plate 21 during the rotation, so that the equalizing plate 21 will evenly contact and absorb the degumming agent sprayed on the annular sponge pad 15.

[0031] In summary, with the aid of the above-mentioned technical scheme of the utility model, when the device is in use, the alloy resistors 5 can be respectively arranged in the placement openings 11 on the carrier plate 10 for engagement, and then the rodless cylinder 8 is started, and the movable end of the rodless cylinder 8 drives the side baffle 9 to move to the left, so that the carrier plate 10 enters between the first mounting seat 1 and the second mounting seat 2 for degumming. After the carrier plate 10 enters between the first mounting seat 1 and the second mounting seat 2, the servo motor 6 on the front side of the first mounting seat 1 and the second mounting seat 2 is started at the same time, and the output shaft of the servo motor 6 drives the rotating shaft 13 to rotate, so that the rotating wheel 14 on the outer wall of the rotating shaft 13 rotates, so that the annular sponge pad 15 on the outer wall of the rotating wheel 14 is pressed against the upper surface of the alloy resistor placed on the carrier plate 10, The glue adhered to the lower surface is wiped off and the extraction pump 18 is started. The extraction pump 18 can extract the degumming agent in the liquid storage tank 17, and then transport it to the atomizing nozzle 20 through the T-pipe 19, so that the atomizing nozzle 20 can spray into the installation box 16. The water mist produced by sandblasting can continuously spray the degumming agent on the annular sponge pad 15. The electric heating tube 23 is electrically connected to the external thermostat through a wire. The heat inside the heating box 22 can be increased by the electric heating tube 23, so that the inside of the installation box 16 can maintain a certain stability. The warm environment can further improve the degumming effect of the alloy resistor 5. The annular sponge pad 15 will contact with the equalizing plate 21 during the rotation, so that the equalizing plate 21 can evenly contact and absorb the degumming agent sprayed on the annular sponge pad 15.

[0032] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic glue removal machine for chip alloy resistors, comprising a first mounting seat (1) and a second mounting seat (2), characterized in that: The first mounting seat (1) and the second mounting seat (2) are arranged in a mirror image up and down, and the first mounting seat (1) and the second mounting seat (2) are fixedly connected, a feeding seat (3) is fixedly connected to the right side of the first mounting seat (1), a push plate (4) is connected to the top of the feeding seat (3), and an alloy resistor (5) is equidistantly connected to the push plate (4), and a servo motor (6) is fixedly connected to the upper front side of the first mounting seat (1) and the lower front side of the second mounting seat (2) respectively.

2. The automatic chip alloy resistor glue removal machine according to claim 1, characterized in that: A rectangular groove (7) is excavated in the middle of the top side of the feeding seat (3), and a rodless cylinder (8) is fixedly connected between the inner walls of the rectangular groove (7). The feeding seat (3) comprises a side baffle (9) and a bearing plate (10), and the middle of the left side of the side baffle (9) is fixedly connected to the bearing plate (10).

3. The automatic chip alloy resistor degumming machine according to claim 2, characterized in that: The top of the carrier plate (10) is symmetrically and equidistantly provided with placement openings (11), which are movably engaged with the outer side of the alloy resistor (5), and the movable end of the rodless cylinder (8) is fixedly connected to the middle part of the bottom side of the side baffle (9).

4. The automatic glue removal machine for chip alloy resistors according to claim 3, characterized in that: Connecting openings (12) are equidistantly provided on the right side of the top of the first mounting seat (1) and the right side of the bottom of the second mounting seat (2), respectively. The output shafts of the servo motors (6) extend into the inner cavities of the first mounting seat (1) and the second mounting seat (2) and are fixedly connected to the rotating shafts (13).

5. The automatic glue removal machine for chip alloy resistors according to claim 4, characterized in that: Rotating wheels (14) are fixed at equal intervals on the outer wall of the rotating shaft (13); the position of the rotating wheels (14) corresponds to the position of the connecting opening (12) and extends out of the top opening of the connecting opening (12); and an annular sponge pad (15) is sleeved and fixed on the outer wall of the rotating wheel (14).

6. The automatic chip alloy resistor glue removal machine according to claim 5, characterized in that: The bottom side of the inner wall of the first mounting seat (1) and the top side of the inner wall of the second mounting seat (2) are respectively fixedly connected with a mounting box (16), the bottom side of the rotating wheel (14) extends into the interior of the mounting box (16), and the left side of the inner wall of the first mounting seat (1) and the second mounting seat (2) are fixedly connected with a liquid storage tank (17), and one side of the liquid storage tank (17) is fixedly connected with a material extraction pump (18).

7. The automatic chip alloy resistor glue removal machine according to claim 6, characterized in that: The input end of the material extraction pump (18) is fixedly connected to the bottom side of the liquid storage tank (17) through a pipeline, and the output end of the material extraction pump (18) is fixedly connected to a T-shaped pipeline (19). The right end of the T-shaped pipeline (19) is equidistantly connected to the right side of the outer wall with an atomizing nozzle (20), and the atomizing nozzle (20) is fixedly connected to the left side of the inner wall of the installation box (16).

8. The automatic chip alloy resistor glue removal machine according to claim 7, characterized in that: A material equalizing plate (21) is fixedly connected to the right side of the inner wall of the bottom opening of the upper installation box (16) and the right side of the inner wall of the top opening of the lower installation box (16), respectively; a heating box (22) is fixedly connected to the corner of the inner wall of the installation box (16); an electric heating tube (23) is fixedly connected to the inside of the heating box (22), and an air outlet (24) is provided through the middle of the outer wall.

Images