Modularized communication module and terminal equipment

Abstract

The utility model discloses a modularized communication module and a terminal device, relating to the technical field of communication, the modularized communication module comprises a first communication module, a second communication module and a third communication module which are overlapped and welded upwards in sequence, the first communication module is in communication connection with the second communication module, and the third communication module is in communication connection with the third communication module. Receiving a baseband signal to be decoded and transmitting a synthesized baseband signal through a second communication module; the second communication module establishes communication connection with the third communication module, receives the synthesized baseband signal and transmits a baseband signal to be decoded through the second communication module, the first communication module is used for executing a communication information processing flow in a communication process, and the second communication module is used for executing a communication information switching flow in the communication process. And the third communication module is used for executing a communication information receiving and transmitting process in a communication process. The problems of large size and high design change cost of a conventional communication module are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of communications, and in particular to a modular communication module and terminal equipment. Background Art

[0002] Communication modules are mainly used to realize data transmission and communication between terminal devices, and are usually installed inside terminal devices. At present, the communication modules on the market adopt a single-sided layout and are mounted on the PCB (Printed Circuit Board) of the terminal device to realize communication and data exchange between the terminal device and other terminal devices.

[0003] However, the single-sided layout not only requires a large space to be reserved on the PCB to install the communication module, but also because all the devices required for the communication module are set on a single side, when the communication module changes the frequency band and the devices related to the frequency band need to be modified, all the devices on the single side need to be modified accordingly to avoid the mismatch between the modified devices on the same single side and the original devices, causing operation errors of the communication module, and there is a problem of high design modification costs. Utility Model Content

[0004] The main purpose of the utility model is to provide a modular communication module and terminal equipment, aiming to meet the requirements of small size of the communication module and reducing the cost of design modification.

[0005] To achieve the above-mentioned purpose, the utility model provides a modular communication module, wherein the modular communication module comprises a first communication module, a second communication module and a third communication module which are sequentially stacked and welded upward;

[0006] The first communication module establishes a communication connection with the second communication module, the first communication module receives a baseband signal to be decoded transmitted via the second communication module, and transmits a synthesized baseband signal via the second communication module;

[0007] The second communication module establishes a communication connection with the third communication module, the third communication module receives the synthesized baseband signal transmitted via the second communication module, and transmits the baseband signal to be decoded via the second communication module;

[0008] The first communication module, the second communication module and the third communication module are divided according to the communication process of the communication information. The first communication module is used to execute the communication information processing process in the communication process, the second communication module is used to execute the communication information transfer process in the communication process, and the third communication module is used to execute the communication information sending and receiving process in the communication process.

[0009] In one embodiment, the first communication module has a first surface, and the first surface is provided with a mobile device and a transceiver chip.

[0010] In one embodiment, the second communication module has a first hollow area and a second hollow area, the size of the first hollow area is the same as the layout size of the mobile device on the first surface, and the size of the second hollow area is the same as the layout size of the transceiver chip on the first surface.

[0011] In one embodiment, the second communication module further has a shielding cavity, and when the second communication module is superimposed and welded on a side of the first surface close to the first communication module, the shielding cavity divides the first surface into a mobile device area and a transceiver chip area;

[0012] The shielding cavity is used to isolate the mobile device area and the transceiver chip area.

[0013] In one embodiment, the first communication module further comprises a first interface area disposed around the first surface, and the first interface area is provided with line output interfaces of the mobile device and the transceiver chip.

[0014] In one embodiment, the second communication module further comprises a second interface area arranged around the hollowed-out area, and a conversion interface corresponding to the output line interface is arranged on the second interface area.

[0015] In one embodiment, the third communication module has a second surface, and a radio frequency device is arranged on the second surface, wherein the radio frequency device includes a transmitting radio frequency front end and a receiving radio frequency front end.

[0016] In one embodiment, the third communication module further comprises an isolation board, and the isolation board is arranged between the transmitting RF front end and the receiving RF front end.

[0017] In one embodiment, the third communication module further has a third interface area arranged around the second surface, and an antenna interface is arranged on the third interface area.

[0018] The utility model also provides a terminal device, including a modular communication module, wherein the modular communication module includes a first communication module, a second communication module and a third communication module which are sequentially stacked and welded upward;

[0019] The first communication module, the second communication module and the third communication module are divided according to the communication process of the communication information, and the devices arranged on the same communication module are used to execute the same processing program.

[0020] In the technical solution of the utility model, the communication module is split into a first communication module, a second communication module and a third communication module, and the first communication module, the second communication module and the third communication module are arranged on the PCB of the terminal device to be stacked up in sequence, the first communication module establishes a communication connection with the second communication module, the first communication module receives the baseband signal to be decoded transmitted via the second communication module, and transmits the synthesized baseband signal through the second communication module; the second communication module establishes a communication connection with the third communication module, the third communication module receives the synthesized baseband signal transmitted via the second communication module, and transmits the baseband signal to be decoded through the second communication module, so relative to the size required for the conventional single-sided layout on the PCB, The size required for the split and superimposed components on the PCB in the utility model is significantly smaller; at the same time, the first communication module, the second communication module and the third communication module are divided according to the communication process of the communication information, the first communication module is used to execute the communication information processing process in the communication process, the second communication module is used to execute the communication information transfer process in the communication process, and the third communication module is used to execute the communication information receiving and sending process in the communication process. Therefore, when a device on a certain communication module needs to be modified accordingly, because the devices on other communication modules are not on the same module as the devices on the communication module and the corresponding operation processes are different, the devices on other communication modules do not need to be modified accordingly, which reduces the design cost to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the overall structure of the modular communication module provided by the utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure of the first communication module;

[0024] Figure 3 for Figure 1 A schematic diagram of the structure of the second communication module;

[0025] Figure 4 for Figure 1 Schematic diagram of the structure of the third communication module.

[0026] Description of Figure Numbers:

[0027] 10. First communication module; 101. First surface; 102. First interface area; 103. Outlet interface;

[0028] 20, second communication module; 201(1), first hollowed-out area; 201(2), second hollowed-out area; 202, shielding cavity; 203, second interface area;

[0029] 30. The third communication module; 301. The second surface; 302. The isolation board; 303. The third interface area.

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0034] The single-sided layout adopted by conventional communication modules not only requires a large space to be reserved on the PCB to install the communication module, but also because all the devices required for the communication module are set on a single side, when the communication module changes the frequency band and the devices related to the frequency band need to be modified, all devices on the single side need to make corresponding design changes to avoid the mismatch between the modified devices on the same single side and the original devices, causing operation errors of the communication module, and there is a problem of high design change costs.

[0035] In order to solve this technical problem, the utility model provides a modular communication module to solve the problems of large size and high cost of design modification of conventional communication modules.

[0036] See also Figure 1 The utility model proposes a modular communication module, the modular communication module comprising a first communication module 10, a second communication module 20 and a third communication module 30 which are sequentially stacked and welded upward; the first communication module 10 establishes a communication connection with the second communication module 20, the first communication module 10 receives a baseband signal to be decoded transmitted via the second communication module 20, and transmits a synthetic baseband signal through the second communication module 20; the second communication module 20 establishes a communication connection with the third communication module 30, the third communication module 30 receives the synthetic baseband signal transmitted via the second communication module 20, and transmits the baseband signal to be decoded through the second communication module 20;

[0037] The first communication module 10, the second communication module 20 and the third communication module 30 are divided according to the communication process of the communication information. The first communication module 10 is used to execute the communication information processing process in the communication process, the second communication module 20 is used to execute the communication information transfer process in the communication process, and the third communication module 30 is used to execute the communication information sending and receiving process in the communication process.

[0038] Because the communication modules included in the modular communication module are split according to the communication process of the communication information, a single communication module only needs to be equipped with the devices required by the processing program to which it belongs, so the size required for the communication module on the PCB is much smaller than the size required for the conventional communication module on the PCB where all devices need to be arranged. And because the first communication module 10, the second communication module 20 and the third communication module 30 obtained by splitting in this embodiment are sequentially stacked and welded on the PCB, the size required for the modular communication module in this embodiment on the PCB is the size of a single communication module, realizing the ultimate size design of the communication module.

[0039] Furthermore, because the corresponding operation processes executed between the first communication module 10, the second communication module 20 and the third communication module 30 are not the same, when the frequency band-related devices need to be modified accordingly due to frequency band changes, it is only necessary to make corresponding changes to the communication module equipped with the radio frequency device, without making changes to other communication modules, thereby reducing the cost of design changes.

[0040] More specifically, see Figure 2 The first communication module 10 has a first surface 101, on which mobile devices and transceiver chips (i.e. Figure 2 Transceiver in ).

[0041] according to Figure 2 As shown in the embodiment, the first surface 101 of the first communication module 10 is used to execute the communication information processing flow of the communication information, so the mobile device arranged on the first surface 101 includes a baseband chip (ie Figure 2 Baseband in), power management chip (i.e. Figure 2 PMIC in), memory chip (i.e. Figure 2 Memory in), etc.

[0042] Because the split first communication module 10 is not affected by the radio frequency device, terminal devices in different frequency bands on the same chip platform can use the same first communication module 10 when installing the first communication module 10, thereby avoiding the need to design different first communication modules 10 for executing the operation process of communication information in different frequency bands, which in turn increases the design cost.

[0043] It should be noted that according to Figure 2 It can be seen that the mobile device and the transceiver chip are not set in the same area. For example, the mobile devices are concentrated in area a of the first surface, and the transceiver chip is not set in area a, but is separately set in area b or other areas outside area a, so that the second communication module can isolate the mobile device and the transceiver device.

[0044] In addition, based on the position setting restrictions between the mobile device and the transceiver chip as described above, the setting positions of the mobile device and the transceiver chip can be changed according to actual application requirements.

[0045] The first communication module 10 further comprises a first interface region 102 disposed around the first surface 101, wherein the first interface region 102 is provided with a line interface 103 of the mobile device and the transceiver chip, and a power interface 104 is also disposed on the first interface region.

[0046] It should be noted that, because the line interface 103 is provided on the first communication module 10 , in order to facilitate the transmission of the processed synthetic baseband signal, the first communication module 10 is provided at the bottom layer of the combined communication module.

[0047] in addition, Figure 2 Reference numeral 105 indicates the position where the shielding cavity 202 on the second communication module 20 contacts the first surface 101 when the second communication module 20 is superimposed and welded on the first communication module 10 .

[0048] See also Figure 3 The second communication module 20 has a first hollow area 201 (1) and a second hollow area 201 (2). The size of the first hollow area 201 (1) is the same as the size of the mobile device arranged on the first surface 101. The first hollow area 201 (1) corresponds to the mobile device arranged on the first surface 101. The size of the second hollow area 201 (2) is the same as the size of the transceiver chip arranged on the first surface 101. The second hollow area 201 (2) corresponds to the transceiver chip arranged on the first surface 101.

[0049] The second communication module 20 also has a shielding cavity 202. When the second communication module 20 is superimposed and welded on one side of the first surface close to the first communication module 10, the shielding cavity 202 divides the first surface 101 into a mobile device area and a transceiver chip area; the shielding cavity 202 is used to isolate the mobile device area and the transceiver chip area.

[0050] After the first hollow area 201 (1) corresponds to the mobile device arranged on the first surface 101 and the second hollow area 201 (2) corresponds to the transceiver chip arranged on the first surface 101, a shielding cavity 202 is set between the first hollow area 201 (1) and the second hollow area 201 (2), and the shielding cavity 202 can be regarded as a longitudinal diaphragm. After the second communication module 20 is superimposed and welded on the first communication module 10, the hollowed-out area avoids the second communication module 20 from blocking the mobile device and the transceiver chip, thereby improving the heat dissipation capacity of the mobile device and the transceiver chip. At the same time, the shielding cavity 202 is connected to the first surface 101, and the first surface 101 is divided into a mobile device area and a transceiver chip area. The mobile device area is provided with a baseband chip, a power management chip and a storage chip, and the transceiver chip area is provided with a transceiver chip, which isolates the transceiver chip from the baseband chip, the power management chip and the storage chip, thereby reducing the interference of the transceiver chip to the baseband chip, the power management chip and the storage chip during the process of receiving and sending baseband signals.

[0051] The second communication module 20 also has a second interface area 203 arranged around the hollow area 201, and a conversion interface corresponding to the output interface 103 is arranged on the second interface area 203. The conversion interface includes a sending interface (i.e., a sending interface) for sending the converted synthetic baseband signal to the third communication module 30. Figure 3 204), and a receiving interface for receiving the radio frequency signal connected to the third communication module 30 (ie Figure 3 205). Among them, Figure 3 206 is a power interface.

[0052] After accessing the processed synthetic baseband signal transmitted by the first communication module 10, the sending interface converts the processed synthetic baseband signal into communication information receivable by the third communication module 30, and then sends the communication information to the third communication module 30; after accessing the radio frequency signal received by the third communication module 30, the receiving interface converts the radio frequency signal into a baseband signal to be decoded that can be processed by the first communication module 10, and then sends the baseband signal to be decoded to the first communication module 10.

[0053] See also Figure 4 The third communication module 30 has a second surface 301, on which a radio frequency device is arranged, wherein the radio frequency device includes a transmitting radio frequency front end (i.e. Figure 4 TX RFFE) and receive RF front end (i.e. Figure 4 RX RFFE in the RF module).

[0054] according to Figure 4 It can be seen from the embodiment shown that the second side 301 of the third communication module 30 is used to execute the process of receiving and sending communication information. Therefore, the devices arranged on the second side 301 mainly include a transmitting RF front end and a receiving RF front end. When the transmission in the frequency band area changes, only the transmitting RF front end and the receiving RF front end on the second side 301 need to be changed accordingly, without changing the devices on other communication modules, thereby effectively reducing the design change cost of the communication module.

[0055] The third communication module 30 also has an isolation board 302, which is arranged between the transmitting RF front end and the receiving RF front end, and is used to isolate the transmitting RF front end and the receiving RF front end to avoid mutual interference between the transmitting RF front end and the receiving RF front end.

[0056] The third communication module 30 also has a third interface area 303 arranged around the second surface 301, and an antenna interface is arranged on the third interface area 303. Specifically, the antenna interface includes a main antenna interface (i.e. Figure 4 304) and diversity antenna interface (i.e. Figure 4305), the main antenna interface is responsible for receiving and sending radio frequency signals, and the diversity antenna interface is used to perform diversity processing on the basis of the main antenna interface to improve the receiving and sending quality of radio frequency signals and reduce radio frequency signal interference.

[0057] When the third communication module 30 is installed on different terminal devices, if it is determined that the terminal devices are all in the same frequency band area, the same third communication module 30 can be directly used.

[0058] To further illustrate, since the first communication module 10, the second communication module 20 and the third communication module 30 do not affect each other, the terminal devices on the same chip platform and different frequency band areas only need to modify the third communication module 30, and the first communication module 10 and the second communication module 20 can be directly applied; the terminal devices on the same chip platform and the same frequency band area can directly reuse the same communication module, thereby realizing flexible reconstruction between different communication modules.

[0059] The utility model also proposes a terminal device, which includes the modular communication module as described above. The specific structure of the modular communication module refers to the above embodiment. Since the terminal device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0060] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A modular communication module, characterized in that: The modular communication module comprises a first communication module, a second communication module and a third communication module which are sequentially stacked and welded upward; The first communication module establishes a communication connection with the second communication module, the first communication module receives a baseband signal to be decoded transmitted via the second communication module, and transmits a synthesized baseband signal via the second communication module; The second communication module establishes a communication connection with the third communication module, the third communication module receives the synthesized baseband signal transmitted via the second communication module, and transmits the baseband signal to be decoded via the second communication module; The first communication module, the second communication module and the third communication module are divided according to the communication process of the communication information. The first communication module is used to execute the communication information processing process in the communication process, the second communication module is used to execute the communication information transfer process in the communication process, and the third communication module is used to execute the communication information sending and receiving process in the communication process.

2. The modular communication module according to claim 1, characterized in that: The first communication module has a first surface, on which a mobile device and a transceiver chip are arranged.

3. The modular communication module according to claim 2, characterized in that: The second communication module has a first hollow area and a second hollow area, the size of the first hollow area is the same as the layout size of the mobile device on the first surface, and the size of the second hollow area is the same as the layout size of the transceiver chip on the first surface.

4. The modular communication module according to claim 3, characterized in that: The second communication module further has a shielding cavity, and when the second communication module is superimposed and welded on a side of the first surface close to the first communication module, the shielding cavity divides the first surface into a mobile device area and a transceiver chip area; The shielding cavity is used to isolate the mobile device area and the transceiver chip area.

5. The modular communication module according to claim 4, characterized in that: The first communication module further comprises a first interface area arranged at the periphery of the first surface, and the first interface area is provided with line output interfaces of the mobile device and the transceiver chip.

6. The modular communication module according to claim 5, characterized in that: The second communication module further comprises a second interface area arranged around the hollowed-out area, and a conversion interface corresponding to the outlet interface is arranged on the second interface area.

7. The modular communication module according to claim 6, characterized in that: The third communication module has a second surface, and a radio frequency device is arranged on the second surface, wherein the radio frequency device includes a transmitting radio frequency front end and a receiving radio frequency front end.

8. The modular communication module according to claim 7, characterized in that: The third communication module further has an isolation board, and the isolation board is arranged between the transmitting RF front end and the receiving RF front end.

9. The modular communication module according to claim 8, characterized in that: The third communication module further has a third interface area arranged at the periphery of the second surface, and an antenna interface is arranged on the third interface area.

10. A terminal device, characterized in that: The terminal device comprises a modular communication module as described in any one of claims 1 to 9.

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