2results about How to "Reduce process parameters" patented technology

The present application relates to the technical field of electronic packaging interconnection, and discloses a multi-scale copper sintering paste, a preparation method and application thereof.A multi-scale copper sintering paste is composed of 85wt.% of multi-scale copper particles and 15wt.% of raw materials of an organic system.The multi-scale is a mixture of nano-scale, sub-micron scale and micron scale; and the organic system includes a solvent, a diluent, a dispersant and a binder.The multi-scale copper sintering paste of the present application realizes low-temperature dense sintering interconnection by using multi-scale copper particles for dense packing, and can obtain an interconnection head with high strength (≥90MPa), high thermal conductivity (≥300W / m·K) and high electrical conductivity (≥1×10 7 S / m), which meets the process and performance requirements of third-generation semiconductor chips and electronic packaging interconnection.

This invention relates to a method and equipment for dynamic control of molten droplets in laser cladding forming. The method includes: acquiring the size, position, and morphological characteristics of the area to be repaired or formed through a detection and positioning mechanism; coordinating the wire feeding rate and laser output power based on the acquired feature data by a control system to form a molten droplet matching the size of the corresponding area at an appropriate working position; and delivering the molten droplet to the area to be repaired or formed through gravity dripping or gas-assisted dripping according to the morphological characteristics of the corresponding area, completing the filling and forming of the repair area or the complete forming of the formed area through single-pass cladding or multi-layer superimposed cladding. This invention uses laser to directly act on the wire, melting it and forming a molten droplet. Simultaneously, it dynamically adjusts the size of the molten droplet according to the specifications of the object being repaired, ensuring that after the molten droplet enters the area to be filled, a uniform and dense cladding layer is formed on the surface to be repaired, achieving precise repair of surfaces with special features.