9 results about "Dense packing" patented technology

The application discloses a preparation method of a single-crystal metal lithium negative electrode. The single-crystal metal lithium negative electrode with a dense packing surface Li(110) is obtained by annealing a polycrystal metal lithium foil horizontally placed after being heated in vacuum or inert atmosphere, and is directly used for battery assembly. The application remarkably improves the electrode reaction process kinetics of the metal lithium negative electrode by reducing the self-diffusion barrier of the surface of the metal lithium negative electrode, widens the safety boundary of the metal lithium negative electrode, and enables the metal lithium negative electrode to have no dendrite growth in a practical current density range. The prepared single-crystal metal lithium negative electrode can be directly used for battery assembly, and remarkably improves the cycle stability and safety of a high-specific-energy metal lithium battery, and promotes the development of practical high-safety metal lithium batteries.

The application relates to the technical field of building materials, and discloses a phosphogypsum aggregate vegetation concrete and a preparation method thereof. Raw phosphogypsum, solid waste admixture and an alkaline activator are mixed and proportioned to prepare cold-bonded artificial aggregates with single particle size and high sphericity, so as to prepare the phosphogypsum aggregate vegetation concrete. The application utilizes the acidity and soluble phosphorus elements of the phosphogypsum to perform alkali reduction treatment on the vegetation concrete and provide nutrients for plant growth; meanwhile, the hydration product can adsorb and solidify the soluble phosphorus, fluorine and heavy metal elements in the phosphogypsum, hinders the large-scale migration of the elements to the natural environment, eliminates the environmental risks caused by the direct utilization of the raw phosphogypsum, and provides high-quality raw materials for high-performance pervious concrete. In addition, according to the spherical dense packing and slurry wrapping theory, the mix proportion of the phosphogypsum aggregate vegetation concrete is optimized and designed, so that the connected porosity, the water permeability coefficient and the compressive strength of the pervious vegetation concrete can be adjusted and customized.

The application discloses a preparation method of alumina ceramic by dry pressing, and belongs to the technical field of ceramic preparation. The method comprises the following steps: S1, powder pretreatment and granulation: high-purity alpha-alumina powder is granulated to obtain spherical granulated powder; S2, mold pretreatment and powder filling: the spherical granulated powder is sieved and then filled into a mold cavity and vibrated to a dense packing state; S3, multi-stage gradient pressing: pressure is applied to the mold, and the pressing process is divided into three stages: a pre-pressing stage, in which the pressure is slowly increased to 20-50 MPa at a rate of 5-15 MPa / s, and the pressure is kept for 10-30 seconds; a main pressing stage, in which the pressure is rapidly increased to 80-90% of the final forming pressure at a rate of 10-30 MPa / s; and a fine pressing stage, in which the pressure is slowly increased to the final forming pressure at a rate of 2-8 MPa / s, and the pressure is kept; S4, controllable-speed demolding: after pressure relief, the green body is smoothly separated from the mold cavity; and S5, green body post-treatment and sintering: after drying, the green body is placed in a high-temperature sintering furnace for glue removal and sintering to obtain alumina ceramic.

The invention discloses slag-based low-carbon ecological concrete with shells replacing coarse and fine aggregates, which is characterized in that waste shells are graded by 100% to replace natural gravel coarse and fine aggregates, and are matched with a slag-cement-gypsum ternary low-carbon gel system; the core ratio of concrete per cubic meter of 1 m < 3 > is defined as follows: 275-295 kg of slag, 42-58 kg of cement, 62-78 kg of gypsum, 2080-2160 kg of waste shells and 1.1-1.9 kg of a polycarboxylate superplasticizer, the water-cement ratio is 0.45-0.50, and the mortar-sand ratio is 1: 2. During preparation, a process of dense accumulation of coarse aggregate and pouring of gelled slurry is adopted, the highest compressive strength of the cured concrete within 28d reaches 45.7 MPa, the lowest chloride ion permeation resistance electric flux is 746.38 C, and the alkalinity is controlled between 9.42 and 11.68. Compared with the prior art, 2080-2160 kg of waste shells and 97.125 kg of fixed carbon can be consumed by 1 m < 3 > of concrete, carbon emission is reduced by 35% or above, the total cost is about 270 yuan, the technical breakthrough of waste recycling, low-carbon emission reduction and multi-performance cooperation is achieved, and the concrete is suitable for ecological engineering such as artificial fish reefs and marine ranches.

This invention discloses an automatic optimization method and system for continuous gradation of coarse aggregate with dense packing, belonging to the field of building materials technology. The method includes: S1: taking several portions of dense mixed aggregate of the same volume, each portion containing a different proportion of aggregates of various particle sizes; S2: weighing the selected mixed aggregates to obtain a total weight; S3: sieving the selected mixed aggregates and weighing the sieved aggregates of each particle size grade; S4: determining whether to retain the current group of mixed aggregates based on the weight of all or part of the sieved aggregates of each particle size grade, as well as the maximum and minimum weights corresponding to each grade; when the aggregate weights all meet the requirements... y min < y j < y max S5. Select the group with the largest total weight from the retained mixed aggregates and use the ratio corresponding to that group as the preferred ratio. This invention can automatically obtain the blending ratio of each grade of material in a closely packed continuous gradation.

The invention relates to a projectile (10), in particular a medium-caliber projectile for mobile and stationary air, naval and tank guns, comprising: - several subprojectiles (12), each having a longitudinal axis S and a shape that is essentially cylindrically symmetric about this axis; - a shell (14) comprising a payload chamber (16) which is substantially coaxial to a longitudinal axis G of the projectile (10) and in which the subprojectiles (12) are received; where - the subprojectiles (12) in a first position, which is essentially perpendicular to the longitudinal axis G, are arranged rotationally symmetric to the longitudinal axis G such that no subprojectile (12) is located on the longitudinal axis G. In order to improve the utilization of the specified payload chamber in such a projectile (10), it is provided that: - for the number N1 of subprojectiles (12) N1 = 3n1, where n1 is a positive integer; - the subprojectiles (12) are arranged in a densest packing with threefold rotational symmetry about the longitudinal axis G such that each subprojectile (12) touches at least two adjacent subprojectiles (12).

The present application relates to the technical field of electronic packaging interconnection, and discloses a multi-scale copper sintering paste, a preparation method and application thereof.A multi-scale copper sintering paste is composed of 85wt.% of multi-scale copper particles and 15wt.% of raw materials of an organic system.The multi-scale is a mixture of nano-scale, sub-micron scale and micron scale; and the organic system includes a solvent, a diluent, a dispersant and a binder.The multi-scale copper sintering paste of the present application realizes low-temperature dense sintering interconnection by using multi-scale copper particles for dense packing, and can obtain an interconnection head with high strength (≥90MPa), high thermal conductivity (≥300W / m·K) and high electrical conductivity (≥1×10 7 S / m), which meets the process and performance requirements of third-generation semiconductor chips and electronic packaging interconnection.

A dynamic robotic packaging approach places a set of objects in a containment or shipping container based on dynamic, or real time evaluation and imaging of the set of objects for placement. Predefined object dimensions need not be provided, as an RGB-D or similar imaging provides a representation of each object in a set of objects for packaging. A sensed point cloud of each object is employed to compute a sphere tree, which is ordered according to sequencing logic for placing the object in the containment. Placement order is based on a prioritized score for tightly packing the most unwieldy or largest objects first. A no-fit volume is computed around each object, including accommodations for object orientation and deformation against adjacent objects. A final placement disposes the irregularly shaped objects in a close adjacency for optimal utilization of containment volume.

This application relates to the field of semiconductor packaging technology, and particularly to modified copper paste, its preparation method, and its application. The modified copper paste comprises a copper coordination compound, submicron-sized copper powder, micron-sized copper powder, resin, resin curing agent, and solvent. The copper coordination compound exhibits high dispersibility, and during the subsequent sintering process, nano-sized copper particles are generated in situ throughout the copper paste, leveraging the nanoscale effect to effectively reduce the required sintering temperature and pressure. Through the multi-scale particle size distribution of micron-sized, submicron-sized, and nano-sized copper powder, effective filling between particles is achieved during sintering, forming a gradient particle size distribution and achieving the densest packing. This not only significantly improves the density of the solder layer and the interfacial bonding strength, enhancing connection strength and reliability, but also optimizes the conductive path. As a semiconductor bonding material, this modified copper paste exhibits high bonding strength, lifespan, and conductivity after sintering, significantly improving the quality of power packaging.