2results about How to "Shorten the detection process" patented technology

The application provides a leakage detection method of a fuel evaporation system and an electronic device, and is applied to a fuel evaporation system of a vehicle. The method comprises the following steps: when the parking time of the vehicle exceeds a first preset time length, and the enabled working condition of the fuel evaporation system is normal, the vacuum degree of a first space in which a first electric control valve is in a closed state is obtained; a first diagnosis strategy or a second diagnosis strategy is selected according to the vacuum degree, and leakage detection is performed on the first space and a second space to obtain a detection result, wherein the first diagnosis strategy is a diagnosis strategy corresponding to that the first space has no leakage when the absolute value of the vacuum degree is greater than a first preset threshold. In this way, an air pump does not need to be additionally arranged, so that the hardware cost of the system is reduced. In addition, different diagnosis strategies are beneficial to improving the diagnosis completion rate. Since the first space of the fuel evaporation system rarely leaks, the frequency of using the first diagnosis strategy is usually high, and the detection process of the first diagnosis strategy is less, so that the diagnosis efficiency is improved.

This invention proposes a transfer device and a front-end module including the same. The transfer device is used to transport a wafer and includes a body and a pickup component. The pickup component is movably connected to the body and can switch between a first detection state and a second detection state. The pickup component includes a first toothed element and a second toothed element. When the pickup component is in the first detection state, the first toothed element supports the wafer and the second toothed element is not in contact with the wafer. When the pickup component is in the second detection state, the second toothed element supports the wafer and the first toothed element is not in contact with the wafer.