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Electronic packaging structure and manufacturing method thereof

A technology of electronic packaging and manufacturing method, which is applied in the electronic packaging structure and its manufacturing field that can improve system integration, and can solve the problem that the size of substrates or electronic products cannot be further miniaturized, functional modules cannot be effectively integrated, and the integration rate of modules cannot be achieved. Improvement and other issues to achieve the effect of improving integration and good process quality

Inactive Publication Date: 2010-01-27
ANHUI HAIHUA CHEM
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Problems solved by technology

[0003] However, no matter how the size of components or modules is reduced, their connection to the system substrate will result in a rather large-area arrangement, making it impossible to further miniaturize the size of the substrate or electronic products; in addition, when multiple functions are integrated into a single product, A large number of functional modules cannot be effectively integrated, so that the module integration rate cannot be improved

Method used

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  • Electronic packaging structure and manufacturing method thereof
  • Electronic packaging structure and manufacturing method thereof
  • Electronic packaging structure and manufacturing method thereof

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Embodiment Construction

[0023] see figure 2 , shown in the figure is an electronic packaging structure and a manufacturing method thereof provided by the present invention. The manufacturing method can form conductive lines on the side of the electronic component module to achieve the purpose of vertical circuit connection, and then achieve the stacked packaging of electronic components. The function of the module, and the manufacturing method of the electronic packaging structure includes the following steps (please refer to figure 1 and Figure 1A ):

[0024] Step 1: Provide an electronic component module, the electronic component module has a bottom surface (such as Figure 1A ), a top surface opposite to the bottom surface and a side surface connecting the bottom surface and the top surface. The electronic component module can be a Bluetooth module, a wireless communication module or other modules.

[0025] The electronic component module can be manufactured by the first manufacturing method...

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Abstract

The invention discloses an electronic packaging structure and a manufacturing method thereof. The electronic packaging structure comprises a main substrate, wherein a plurality of circuit wires are arranged on the main substrate; and an electronic element module, wherein at least one conducting solder pad is arranged on the bottom face of the electronic element module and a plurality of conducting circuits are arranged on one side face of the electronic element module. The conducting solder pad and the conducting circuits are electronically connected with the circuit wires. By using the structure, the electronic element module can be repeatedly stacked upwards to form an ultra-integrated electronic packaging structure.

Description

technical field [0001] The invention relates to an electronic packaging structure and a manufacturing method thereof, in particular to an electronic packaging structure and a manufacturing method thereof which can improve system integration. Background technique [0002] With the continuous improvement of the technical capabilities of the semiconductor process, the functions of the semiconductor chips are becoming more and more powerful, so that the signal transmission volume of the semiconductor chip gradually increases, and the number of pins of the chip also increases, so that the packaging technology must be continuously improved with the advancement of technology. . As the development of information technology tends to be light, thin and short, especially when notebook computers, mobile communication products, digital cameras, etc. have gradually become indispensable mobile devices for modern people, in order to be suitable for the high spatial density of mobile device ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/50H01L23/48H05K3/32H05K1/18
CPCH01L2924/0002
Inventor 黄忠谔郭明泰
Owner ANHUI HAIHUA CHEM
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