Circuit board, display component and air conditioner

Abstract

The invention provides a circuit board, a display component and an air conditioner. The circuit board comprises a substrate of an integrated structure, n through grooves are formed in the face of the substrate, the two ends of each through groove are communicated with the edges of the substrate, the n through grooves divide the substrate into n+1 sub circuit boards, the bottom face of each through groove is an arc face, and two sub circuit boards on the two sides of each through groove do not share a common face. When n is larger than 1, the through grooves do not intersect. According to the circuit board, the through grooves are formed in the circuit board, the thickness of a part of the circuit board is reduced, the circuit board is bent from the positions of the through grooves, so that the folded non-straight circuit board is manufactured, the circuit board can be used in cooperation with display panels in different shapes better, the requirement for the shape of the circuit board of a product is met, the manufacture circuit board is stable in performance, and assembling efficiency of the circuit board can be improved.

Description

technical field [0001] The present invention relates to the field of home appliances, more specifically, to a circuit board, a display assembly including the circuit board, and an air conditioner including the display assembly Background technique [0002] Currently, the display panels of household appliances have various shapes and appearances. For example, the surface of the display panel is curved or folded and non-planar. However, the circuit board used in conjunction with it is still made of hard flat materials due to the limitation of production cost. Due to the thickness of the board, it cannot be bent (it will break when bent), that is, it cannot be bent. Non-straight circuit boards with curved or folded surfaces (and also based on the consideration of the convenience of soldering pads on the circuit board, the processes commonly used for batch soldering on circuit boards are basically common to straight boards). There is also a method for making non-straight boards...

AI Technical Summary

Problems solved by technology

There is also a method for making non-straight boards: increase the thickness of the base of the board, and obtain curved boards or folded boards by means of grinding and cutting. This method is complex in process and costly also very high

Another is to use multiple substrates to connect through wires. The circuit boards produced by this method are prone to problems such as disconnection and disconnection during production and use, and their practicability is very poor.

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