Clamping device for diode automatic sliver

Abstract

The invention discloses a clamping device of an automatic diode carding machine. The clamping device is characterized in that the clamping device comprises a connecting plate, two grabbing components and two locating components. The two grabbing components comprise the left grabbing component and the right grabbing component according to the left-right positions of the two grabbing components. The left grabbing component and the right grabbing component are identical in structure and are symmetrically arranged at the left end and the right end of the connecting plate in a left-right mode with the axis of a rotating shaft as the symmetry axis. The two locating components comprise the left locating component and the right locating component according to the left-right positions of the two locating components. The left locating component and the right locating component are identical in structure and are symmetrically arranged at the left side and the right side of a machine frame in a left-right mode with the axis of the rotating shaft as the symmetry axis. The locating components are used for locating the grabbing components and controlling grabbing and releasing actions of the grabbing components.

Description

Technical field [0001] The technical field of machinery of the present invention specifically relates to a clamping device of an automatic sliver machine for quickly transferring diodes from a template of the previous process to the template of the next process on a production line. Background technique [0002] There are several processes in the production and processing of diodes that must be converted to templates. For example, hundreds of diodes need to be inserted into the plastic tray (template) during pickling. After the pickling, they are transferred to the gluing and drying process, and the diodes should be transferred to Metal tray (template). The pallet transfer work of these diodes is currently done manually, the workload is very large, and the work efficiency is low, resulting in a significant increase in the manufacturing cost of the diodes. Based on the above reasons, some secondary tube manufacturers have considered relocating their companies to provinces or citi...

AI Technical Summary

Problems solved by technology

The tray transfer of these diodes is currently done manually, with a very heavy workload and low work efficiency, which greatly increases the manufacturing cost of the diodes.

Based on the above reasons, some diode manufacturers have considered relocating their enterprises to provinces or cities with lower labor wages. Although it can alleviate the pressure on costs, the efficiency is still very low.

[0003] There have also been technicians who tried to use a vacuum suction cup to transfer the entire diode diode at one time. Because the diode pins are soft and easy to bend, there are 1,500 diodes inserted in a tray, and it is impossible for them all to be parallel to each other. Erection, there is a considerable amount of lodging during the transfer process, and the lodging diode is more difficult to handle manually, and the actual operation is less efficient and unfeasible

Images