An environment control device for a projection system of extreme ultraviolet lithography equipment

Abstract

An environment control device of an extreme ultraviolet lithography device projection system is provided. The environment control device comprises a cavity structure, a gas supplying device, a pumping set and a monitoring device, wherein the gas supplying device can store and clean treatment gas, and can adjust and control the mass flow rate of the gas; the pumping set can vacuumize the cavity structure and maintain the vacuum environment of the cavity structure; and the monitoring device is used for monitoring the vacuum degree of the cavity structure and partial pressure of each component in the cavity structure. The environment control device is characterized in that: the cavity structure comprises a main cavity, a working bench cavity and a connecting path, the cavities are separated from each other, and both ends of the connecting path are respectively connected to the main cavity and the working bench cavity in a detachable and sealing manner. The environment control device can be used for EUV radiation lithography devices, and effectively controls environments of a light source cavity, the main cavity and the working bench cavity. By adoption of a manner of airflow separation, cross contamination in different device zones is effectively prevented, the device is protected, and the airflow separation manner can effectively increase transmissivity of light beams.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular to an environment control device for a projection system of extreme ultraviolet lithography equipment. Background technique [0002] Extreme Ultraviolet Lithography uses extreme ultraviolet light with a wavelength of 13.5nm, which is suitable for the industrial production of ultra-large-scale integrated circuits with a feature size of 22nm and below. Any substance has a strong absorption effect on this band. In order to reduce EUV energy loss, EUV lithography equipment adopts a high vacuum environment system. The vacuum level of the chamber varies according to the specific use of the chamber. In addition, water molecules and hydrocarbons decompose under EUV, causing oxidation and carbon deposition on the surface of optical components, resulting in a decrease in reflectivity. Therefore, the isolation device between the chambers is particularly importan...

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