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A combined data center and heat dissipation method thereof

A data center and combined technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of poor cooling backup mechanism, difficult to build in indoor space, occupying cabinet space, etc.

Inactive Publication Date: 2017-12-29
CHUNGHWA TELECOM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The container-type data center box structure is integrally formed and cannot be disassembled and assembled, and is limited by the frame size of 20 feet and 40 feet, which reduces the expansion flexibility of the internal cabinets and is not easy to build in the indoor space.
The cooling devices of the container-type data center, such as cabinet-type air conditioners, ceiling-mounted air conditioners, and evaporative cooling devices, are all installed in the container. The overall cooling backup mechanism is poor, and the equipment will occupy the space of the indoor computer cabinet

Method used

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  • A combined data center and heat dissipation method thereof
  • A combined data center and heat dissipation method thereof
  • A combined data center and heat dissipation method thereof

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[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

[0027] Below, the present invention is further described in conjunction with accompanying drawing:

[0028] see figure 1 , figure 2 ,and image 3 As shown, it is a three-dimensional front view, a sectional view, and a side view of the combined data center and its heat dissipation method of the present invention. The modularized cabinet 100 of the present invention is designed, and longitudinally combined and expanded according to the use requirements of the cabinet 131. Each cabinet 100 The capacity of the box 100 can be extended moderately by connecting with the link buckle; the size of ea...

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Abstract

The invention discloses a combined data center and a heat dissipation method thereof. The data center is designed with a modular box as a unit, has a simple and compact structure, and can expand the box according to the actual use requirements of the cabinet. The modular cabinet design completely isolates the hot and cold aisles, directly cools the information and communication equipment (Information and Communication, IT) equipment in the cabinet, and reduces the cooling energy loss of the air conditioner. The size of the box body conforms to the specifications of the container truck, which is convenient for hoisting and transportation. The cabinets are connected by connecting buckles, which can be combined and expanded vertically according to the needs of the cabinet.

Description

technical field [0001] The invention relates to the technical field of data centers, in particular to a combined data center and a heat dissipation method thereof. Background technique [0002] At present, the existing data centers are all based on a modular design built in a large indoor space. All the infrastructure such as electricity, air conditioning, lighting, and fire protection need to be in place at one time, and the expansion flexibility is low. The required construction time and initial design The cost is very high. The construction area of ​​the data center makes the solar radiation heat load of the outer wall high, and compared with the area required for each computer cabinet, the required lighting energy consumption and space cooling requirements are also large, which will increase the cooling demand of the air conditioning cooling system. energy consumption. [0003] In order to solve the above-mentioned shortcomings of the existing data center built in a la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 吴武杰
Owner CHUNGHWA TELECOM CO LTD
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