Transparent conducting layer laminate plate

A transparent conductive layer and laminate technology, which is applied in the input/output process of electrical digital data processing, instruments, and data processing, etc., can solve the problems of unsatisfactory bending deformation effect of conductive layers and substrates, complicated processes, etc., to eliminate deformation. , the effect of simple processing technology

Active Publication Date: 2015-08-05
SHANTOU WANSHUN NEW MATERIAL GROUP CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] In order to overcome the unsatisfactory effect of the prior art on solving the problem of bending deformation of the conductive layer and the substrate due to uneven stress, and the relatively complicated process, the purpose of the present invention is to provide an improved transparent conductive laminate body, which can overcome the existing have technical flaws

Method used

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  • Transparent conducting layer laminate plate

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Embodiment Construction

[0017] refer to figure 1 , the conductive transparent laminate body, including a transparent substrate 1 and a transparent conductive layer 2 stacked on the transparent substrate 1, the transparent conductive layer is etched into a specific pattern 3, characterized in that: the transparent substrate 1 and the transparent conductive layer A transparent buffer layer 4 with an elastic modulus of 10-30 GPa and a thickness of 1-10 μm is laid between the two.

[0018] In addition, the preferred modulus of elasticity of the transparent buffer layer 4 is 10-20 GPa, and the preferred thickness of the transparent buffer layer is 2-4 μm. The thickness of the transparent conductive layer 2 is 10-30 nm, preferably 20-25 nm. The thickness of the transparent substrate 1 is 2-300 μm, preferably 10-250 μm. The material of the transparent buffer layer 4 is acrylic resin or hardened acrylic resin, and is laid by a wet coating method of roller coating or spin coating. The material of the trans...

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Abstract

The invention discloses a transparent conducting layer laminate plate. An object of the present invention is to overcome the defects that existing similar techniques have unsatisfactory effects in solving the problem of bending deformation of a conducting layer and a substrate caused by uneven stress, and are complicated in technology. The transparent conducting layer laminate plate adopts the technical scheme that the transparent conducting layer laminate plate comprises a transparent substrate and a transparent conducting layer laminated on the transparent substrate, wherein the transparent conducting layer is etched with a specific pattern. The transparent conducting layer laminate plate is characterized in that a transparent buffer layer with an elastic modulus of 10-30GPa and a thickness of 1-10 micrometers is laid between the transparent substrate and the transparent conducting layer.

Description

technical field [0001] The invention relates to a raw material of a touch panel of a touch technology product, in particular to a transparent conductive laminate body. Background technique [0002] Touch technology has been widely used in flat panel display, screen touch technology, solar panels, solar control film, anti-fog and defrost glass, ice glass, anti-static coating and many other fields. The structure of a touch panel of a touch technology product generally includes a substrate and a conductive layer attached to the substrate. In the process of producing the projected capacitive touch panel, the transparent conductive layer on the transparent conductive laminate body is generally etched into a specific pattern to obtain a patterned conductive transparent laminate. When the transparent conductive laminate body is heated in the etching step, there is often a difference in residual stress between the part with the transparent conductive layer and the part without the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
Inventor 杜成城
Owner SHANTOU WANSHUN NEW MATERIAL GROUP CO LTD
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