Curable resin composition
A technology of curable resin and composition, which is applied in the direction of coating, etc., and can solve the problem of insufficient grindability of the cured product
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[0092] Hereinafter, although an Example demonstrates this invention further, this invention is not limited to these Examples. In addition, unless otherwise specified, "part" and "%" in an Example are based on a mass basis.
Synthetic example 1
[0093] [Synthesis Example 1] Component (A): Synthesis of Compound A1
[0094] In a reaction vessel equipped with a nitrogen introduction tube, a thermometer, a cooling tube and a stirring device, 48.0 g (0.20 mol) of 2,4,6,8-tetramethylcyclotetrasiloxane, 26.0 g (0.20 mol) of divinylbenzene mol), 0.002 g of a platinum-divinyltetramethyldisiloxane complex as a catalyst, and 150 g of toluene as a solvent were reacted at 105° C. for 2 hours. Thereafter, the solvent was distilled off under reduced pressure at 70° C. to obtain Compound A1. The weight average molecular weight determined by GPC analysis of compound A1 was 10,000, and the content of SiH groups per 1 g determined by H-NMR analysis was 5.40 mmol.
Synthetic example 2
[0095] [Synthesis Example 2] Component (A): Synthesis of Compound A2
[0096] Except having changed the compounding quantity of 1, 4- divinylbenzene into 18.2 g (0.14 mol) from 26.0 g (0.20 mol), it carried out similarly to the synthesis example 1, and obtained the compound A2. The weight average molecular weight determined by GPC analysis of compound A2 was 14000, and the content of SiH groups per 1 g determined by H-NMR analysis was 7.85 mmol.
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