Port-protecting circuit integrating and packaging element and manufacturing method thereof

A protection circuit and integrated packaging technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of time-consuming port circuits, low production efficiency, and poor product stability.

Active Publication Date: 2015-11-11
SHENZHEN BENCENT ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a port protection circuit integrated package and its manufacturing method, which solves the problems of the existing port circuit, such as time-consuming implementation, many processes, large area occupied by PCB, low production efficiency, and poor product stability.

Method used

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  • Port-protecting circuit integrating and packaging element and manufacturing method thereof
  • Port-protecting circuit integrating and packaging element and manufacturing method thereof
  • Port-protecting circuit integrating and packaging element and manufacturing method thereof

Examples

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Embodiment approach

[0158] Such as Figure 4b As shown, when the first resistor R is interconnected with the first capacitor C, the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C are connected through the same conductive connector (the third conductive connection 130) for interconnection.

[0159] And, the port protection circuit integrated package provided in this embodiment further includes a first interconnection, and the first resistor R and the first capacitor C are interconnected with the circuit protection component through the first interconnection when they are respectively interconnected. Specifically, the first interconnect is Figure 1a and Figure 1b Two first vertical interconnects (respectively first vertical interconnect 160 and first vertical interconnect 161 ) are shown in . For the first resistance R and the circuit protection element that are distributed between different adjacent substrates and have a circuit int...

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Abstract

The invention discloses a port-protecting circuit integrating and packaging element and a manufacturing method thereof. A plurality of circuit modules are packaged by longitudinally distributed base structures and conductive connectors of the bases; the superficial area of a printed circuit board which is occupied by elements when transversely distributed is reduced; the distribution distance among the elements and the distribution distance among printed circuit board (PCB) lines are reduced; the integrated structure is simple; the accommodating space of electronic equipment is reduced; in addition, the welding produces of application clients can be reduced through connection of the conductive connectors; the chip production time of the PCB can be shortened; and the production efficiency is high. In addition, the distribution volume of a protecting circuit is reduced; and at least one circuit protecting element is integrated to improve the port protection property, so that the development of equipment miniaturization in the field of port protection is realized. By regular integrated distribution of the longitudinal connectors, parasitic inductance and capacitance caused by external welding are reduced; the overall performance of a protection module and the product stability are improved; and the port-protecting circuit integrating and packaging element is applied to the field of overvoltage protection of port circuits, so that the contradiction between the small space and required high through-flow can be solved.

Description

technical field [0001] The present application relates to the field of port circuit protection, in particular to a port protection circuit integrated package and a manufacturing method thereof. Background technique [0002] At present, advanced electronic equipment such as computer networks, measurement, monitoring, and protection with large-scale integrated circuits as core components are widely used in electric power, aviation, national defense, security, communications, radio and television, finance, transportation, petrochemical, medical and other industries, as well as a wide range of Applied to other fields of modern life, the reliability of products has increasingly become the focus of attention. However, in order to meet the market demand, many equipment manufacturers are constantly shrinking their equipment, especially the size of the devices used on the equipment. Choosing miniaturized equipment will bring advantages to equipment manufacturers in transportation, ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/538H01L23/49H01L21/48H01L21/60
CPCH01L23/49H01L23/498H01L21/48H01L23/538
Inventor 苟引刚王久高桂丽
Owner SHENZHEN BENCENT ELECTRONICS CO LTD
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