Fingerprint module and terminal

Abstract

The invention relates to the terminal manufacturing field and particularly relates to a fingerprint module and a terminal. The fingerprint module comprises a silica gel supporting member, a first supporting face of the silica gel supporting member is provided with a first reinforcing board, the first reinforcing board is provided with a first flexible circuit board electrically connected with the fingerprint module, the first flexible circuit board is provided with a fingerprint sensor module electrically connected with the first flexible circuit board, the first flexible circuit board is provided with a fingerprint identification processing chip, and a second supporting face of the silica gel supporting member is provided with a switch. According to the fingerprint module, a silica gel structure which has a complex structure and is used for completely wrapping the fingerprint module is not required, processing difficulty of silica gel parts is reduced, parts are reduced, the structure is simplified, assembly is easy, the yield is improved, the switch can be directly positioned on the assembled terminal, so no deviation occurs, and thereby pressing feeling of the fingerprint module can be improved.

Description

technical field [0001] The invention relates to the field of terminal manufacturing, in particular to a fingerprint module and a terminal. Background technique [0002] With the rapid development of smart terminals, fingerprint recognition is more and more applied to smart terminals due to its convenient operation mode and very strong security performance. [0003] Due to the limited space structure of smart terminals, optical fingerprint sensor modules cannot be used, but smaller semiconductor fingerprint sensor modules are used. This type of semiconductor sensor, whether capacitive or inductive, has a similar principle. On the "flat plate" of tens of thousands of semiconductor devices, the finger is attached to it and forms the other side of the capacitance (inductance). Due to the unevenness of the finger plane, the actual distance between the convex point and the concave point touching the flat plate is different. , the resulting capacitance / inductance values ​​are also...

AI Technical Summary

Problems solved by technology

[0005] However, the precision of the silicone structure containing all fingerprint module components is very high, even if the deviation is 0.1mm, it will cause bad hand feeling, and after the flexible circuit board is bent 180 degrees, in order to ensure the electrical performance of the flexible circuit board and In terms of durability, it is necessary to design a support structure for the flexible circuit board, which makes the structure of the fingerprint membrane group more complex and more difficult to assemble, resulting in a low final yield. It is easy to shift, which can easily lead to bad hand feeling

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