A printed circuit board and its full additive manufacturing method

Abstract

The invention discloses a printed circuit board. The printed circuit board mainly comprises multiple first structures and second structures which are overlapped in a lamination manner, wherein the first structures and the second structures are arranged at intervals; the first structures and the second structures are formed in a hot-pressing manner; the first structures mainly consist of circuit carriers; conductive convex blocks and circuit layers are embedded in the circuit carriers; the conductive convex blocks are electroplated on the circuit layers; the second structures mainly consist of insulating dielectric plates; conductive blocks are embedded in the insulating dielectric plates; and the circuit layers on the adjacent two first structures are connected through the conductive blocks. Compared with the prior art, the printed circuit board provide by the invention enables fine circuits to satisfy special impendence characteristic requirement; meanwhile, the prepared circuit is high in conductivity and low in cost; the first structures and the second structures are overlapped in a crossed manner in sequence, so that the printed circuit at any layer can be formed by one-time lamination; and therefore, the printed circuit board is high in production efficiency and capable of reducing the production time and the production cost.

Description

technical field [0001] The invention relates to the electronic field, in particular to a printed circuit board and a full-additive manufacturing method thereof. Background technique [0002] With the development of society and science and technology, electronic products are increasingly miniaturized. This development trend has also led to the development of printed circuit boards for connecting different devices and substrates for semiconductor chip packaging under the premise of ensuring good electrical and thermal properties. Develop in the direction of light, thin, short and small. In order to meet the above requirements, finer lines with smaller dimensions and thinner insulating layers are technical conditions that must be met. According to the classification of circuit formation methods, there are mainly three types of methods for circuit production, which are subtractive method, semi-additive method and full additive method. [0003] ① subtraction method. That is, o...

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