Method for manufacturing substrate, substrate and display device

A manufacturing method and substrate technology, applied in the fields of substrate manufacturing, substrates, and display devices, can solve problems such as open circuit and signal line short circuit

Inactive Publication Date: 2016-09-28
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a method for manufacturing a substrate, a substrate, and a display device to solve the problem in the prior art that a signal line is short-circuited or disconnected due to mechanical damage to the signal line by an etching process.

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  • Method for manufacturing substrate, substrate and display device
  • Method for manufacturing substrate, substrate and display device
  • Method for manufacturing substrate, substrate and display device

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] The technical solution involved in the present invention will be described in detail through specific examples below, and the present invention includes but is not limited to the following examples.

[0040] Such as figure 1 As shown, it is a schematic flow chart of the manufacturing method of the substrate provided by the embodiment of the present invention, the method mainly includes the following steps:

[0041] Step 11: Prov...

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Abstract

The invention relates to the technical field of display, in particular to a method for manufacturing a substrate, the substrate and a display device and aims at solving the problem that in the prior art, when a signal line is formed, due to the mechanical damage of the etching process to the signal line, the signal line is in a short circuit or an open circuit. According to the embodiment, when a needed metal pattern is manufactured, the needed metal pattern can be formed without adopting the etching way, a photoresist layer is firstly deposited and then patterned, a photoresist pattern is formed and utilized for blocking, a metal film layer is deposited, finally the photoresist pattern is stripped, and the needed metal pattern is kept. Therefore, the manufacturing process is simplified, the mechanical damage caused by the etching process is avoided, and the problem that the short circuit or open circuit of the signal line caused by the etching process is avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a substrate, a substrate, and a display device. Background technique [0002] Thin Film Transistor Liquid Crystal Display (TFT-LCD) is a kind of active matrix liquid crystal display, which has the advantages of small size, low power consumption, no radiation, and relatively low manufacturing cost. The display market dominates. The liquid crystal display panel includes an active display area (Active Area) and a peripheral circuit area (Peripheral Circuit Area), each pixel includes a thin film transistor and a pixel electrode connected to the thin film transistor, and each pixel is scanned by two adjacent line and surrounded by two adjacent data lines. Usually, these scan lines and data lines extend from the effective display area to the peripheral circuit area to form fan-out lines, and are connected to the driving chip. As people have higher and hig...

Claims

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Application Information

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IPC IPC(8): G02F1/13G03F7/20G02F1/1362
CPCG02F1/1303G02F1/136286G03F7/20G02F1/136295
Inventor史高飞许徐飞刘承娜
OwnerBOE TECH GRP CO LTD