High bandwidth organic substrate antenna structure and manufacturing method

An organic substrate and antenna structure technology, applied in the field of communication antennas, can solve the problems of restricting large-scale market application, difficult process, complex process, etc., and achieve the effect of reducing the equivalent dielectric constant, mature process, and reducing costs

Active Publication Date: 2019-06-18
NAT CENT FOR ADVANCED PACKAGING CO LTD
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Disadvantages: Using LTCC materials as substrate materials, the cost is too high, which limits large-scale market applications
[0010] Disadvantages: complex process, difficult process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High bandwidth organic substrate antenna structure and manufacturing method
  • High bandwidth organic substrate antenna structure and manufacturing method
  • High bandwidth organic substrate antenna structure and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0050] The high bandwidth organic substrate antenna structure is fabricated through the following steps,

[0051] Step S1, such as image 3 As shown, an upper organic substrate 1 and a lower organic substrate 2 are provided;

[0052] The upper organic substrate 1 includes a first inner core board 101, and a first copper layer 104 and a second copper layer laminated on the upper and lower surfaces of the first inner core board 101 through the first PP layer 102 and the second PP layer 103, respectively. 105;

[0053] The PP layer is the prepreg layer. Prepreg is a prepreg material, which is a thin sheet material impregnated with resin and cured to an intermediate level (B stage);

[0054] The lower organic substrate 4 includes a second inner core board 201, and a third copper layer 204 and a fourth copper layer laminated on the upper and lower surfaces of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a high-bandwidth organic substrate antenna structure and a manufacturing method. The high-bandwidth organic substrate antenna structure comprises an upper organic substrate layer and a lower organic substrate layer, wherein the upper organic substrate layer comprises a first inner core plate, and a first copper layer and a second copper layer which are laminated on the upper and lower surfaces of the first inner core plate through a first PP layer and a second PP layer respectively; a microstrip antenna structure is etched in the upper organic substrate layer through the first copper layer; a feeder line, which runs through the upper organic substrate layer, is arranged in the upper organic substrate layer; one end of the feeder line is connected with the microstrip antenna structure; a hollow cavity structure is arranged on the other surface, deviating from the microstrip antenna structure, of the upper organic substrate layer; the lower organic substrate layer comprises a second inner core plate, a third PP layer on the upper surface of the second inner core plate, and a fourth copper layer which is laminated on the lower surface of the second inner core plate through a fourth PP layer; a phase connecting end, which is corresponding to the position of the feeder line in the upper organic substrate layer, is arranged in the lower organic substrate layer; and a third through hole is also formed in the high-bandwidth organic substrate antenna structure for forming a ventilating structure. By adoption of the high-bandwidth organic substrate antenna structure, the bandwidth of the microstrip antenna can be improved, and the cost is low.

Description

technical field [0001] The invention relates to a communication antenna, in particular to a high-bandwidth organic substrate antenna. Background technique [0002] With the wide popularization of modern wireless communication equipment, it is of great significance to realize the portability and multi-functionality of the communication system. The antenna is an important component module of the wireless communication system, which receives and radiates electromagnetic waves, so the miniaturization of the antenna is particularly important. Microstrip patch antenna has many advantages such as small size, light weight, thin profile, easy integration, etc. It has broad application prospects in wireless communication, remote control, aerospace and other fields. [0003] However, the microstrip antenna is a resonant antenna with high-Q characteristics, and the input impedance is very sensitive to frequency changes, so the frequency bandwidth of the microstrip antenna is generally ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/50
CPCH01Q1/38H01Q1/50
Inventor 王启东陈诚邱德龙曹立强
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap