Integrated electronic apparatus and production method therefor

Abstract

The invention discloses an integrated electronic apparatus. The integrated electronic apparatus comprises a bottom plate, an active device, a passive device, a plastic packaging material and a switch-on part; the active device is arranged on the bottom plate; the plastic packaging material covers the active device and the part, not covered by the active device, of the bottom plate; the passive device is arranged on the plastic packaging material; and the switch-on part penetrates the plastic packaging material and switches on and connects the active device below the coverage of the plastic packaging material and the passive device arranged on the plastic packaging material. An embodiment of the invention also provides a corresponding production method. According to the technical scheme, the active device and the passive device are stacked on the same plane, so that the flat layer area of the integrated electronic apparatus is reduced, and the power density of the integrated electronic apparatus is improved; in addition, by virtue of the switch-on part, the active device and the passive device on the upper and lower layers are switched on directly, so that the switch-on path is shortened, and current flowing can be promoted; furthermore, a frame used for placing the passive device is not needed, so that simple processing is realized; and convenience in filling the plastic packaging material also can be achieved.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to an integrated electronic device and a production method thereof. Background technique [0002] Electronic products are usually integrated with active devices and passive devices, and the active devices and passive devices are connected through circuits. Active devices are devices that need power supply to work normally, and passive devices are devices that can work normally without additional power supply in the circuit. Electronic products can be optical modules, mobile phones, wearable devices, communication power supplies and other products that require volume and power density. Taking communication power supplies as an example, Power Supply InPackage (PSIP) modules include integrated circuits (Integrated Circuit, IC ), Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) and other active devices, as well as passive devices such as inductors and capacitors...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems in the prior art that the floor area of ​​electronic products is too large due to tiled layout, the processing of overhead layout is complicated, and the filling is difficult, the embodiment of the present application provides an integrated electronic device that arranges passive devices and active devices on the The upper and lower layers, the passive device and the active device are separated by the molding compound, and the passive device and the active device of the upper and lower layers are connected through the connector, which not only reduces the flat layer area of ​​the integrated electronic device, but also makes the processing simple. Easy to fill

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