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52results about How to "There will be no stratification" patented technology

Method for preparing water-soluble high-temperature corrosion inhibitor

The invention discloses a method for preparing a water-soluble high-temperature corrosion inhibitor, which comprises the following steps: (1) antirust complex preparation: accurately weighting water, a boric acid and glycerin in proportion, adding the weighted water, boric acid and glycerin into a reaction kettle, heating the reaction kettle and adding monoethanolamine into the reaction kettle, heating the obtained mixture until the obtained mixture is boiled, flowing back and then cooling the obtained object so as to obtain an anti-rust complex; and (2) dosing: pumping sulfonated castor oil and the antirust complex obtained in the step (1) into a reaction kettle, heating and stirring the obtained mixture, cooling the obtained mixture and adding water into the obtained mixture, uniformly stirring the obtained product so as to obtain a water-soluble high-temperature corrosion inhibitor. The water-soluble high-temperature corrosion inhibitor prepared by using the method disclosed by the invention is good in water-solubility, no cosolvent is not required to be added when the corrosion inhibitor is used in a formula, and no laying phenomenon occurs when the corrosion inhibitor is compounded with any organic amine, thereby facilitating a neutralization reaction between the corrosion inhibitor and a naphthenic acid in raw oil; and the antirust complex of the corrosion inhibitor in the invention and the sulfonated castor oil can form a dense and firm protective film in a high-temperature tower, thereby effectively preventing the raw oil from eroding the inner wall of the tower.
Owner:江苏汉光实业股份有限公司 +1

Blood simulation method based on PBF

The embodiment of the invention discloses a blood simulation method based on PBF, wherein the method comprises the following steps of acquiring information data of particles and performing initialization processing; performing discretization on blood in the blood vessel according to the blood vessel position of each part of the human body, and obtaining discrete particles; conducting calculation processing on the multiple particles, and obtaining the dynamic information of the field particles of each particle; correcting the position of the particles through the PBD framework according to thedata information of the field particles of each particle, and carrying out iteration until the particles are finished. By implementing the embodiment of the invention, the limitation of a traditionalfluid simulation technology can be broken through, so that a larger time step is achieved in the simulation process, and has better real-time performance. The blood is simulated by combining multipleparticles, and appropriate modification can be carried out according to different application scenes by using the number of the particles, and meanwhile, the distribution conditions of the particles with different densities are constrained by using the density of the blood. The distribution condition of different types of particles in a unit volume is guaranteed, and the phenomenon of layering isavoided.
Owner:SUN YAT SEN UNIV

Washable anti-counterfeiting hot stamping film and preparation method thereof

The washable anti-counterfeiting hot stamping film comprises a base material layer, a release layer, an imaging layer, a metal reflecting layer and an adhesive layer which are arranged in sequence, a wear-resistant protective layer is arranged between the release layer and the imaging layer; a wear-resistant protective layer is arranged between the imaging layer and the release layer, and a buffer layer is arranged between the wear-resistant protective layer and the imaging layer, so that the wear-resistant protective layer has good wear-resistant, waterproof, weather-resistant and acid and alkali corrosion-resistant effects, and can protect the imaging layer; according to the anti-counterfeiting hot stamping film, the anti-counterfeiting layer is arranged on the anti-counterfeiting hot stamping film, so that the imaging layer can effectively express patterns in a longer time, the buffer layer has good elasticity and plays a role in blocking and buffering, and the phenomenon that the anti-counterfeiting hot stamping film is subjected to negative influence on the release effect and the wear-resisting effect of the finished anti-counterfeiting hot stamping film due to deformation damage of the anti-counterfeiting hot stamping film and the release layer in the imaging process is avoided; and the imaging effect of the finished hot stamping film can be improved.
Owner:江苏泰佳新材料科技有限公司

Chip packaging method and packaging structure

Provided are a chip packaging method and a packaging structure. The chip packaging method includes the steps of providing a substrate, wherein the substrate comprises a substrate body and a client layer on the surface of the substrate body, the surface of the client layer is a first surface, the surface, opposite to the first surface, of the substrate body is a second surface, and multiple welding pads are formed in the client layer; etching the second surface of the substrate to form a first groove, wherein the welding pads and a part of the surface of the client layer are exposed from the bottom of the first groove; forming an insulating layer on the surface of the inner wall of the first groove; forming a second groove which sequentially penetrates through the adjacent welding pads and the client layer between the adjacent welding pads in the arrangement direction of the welding pads; forming wiring metal layers on the surface of the first groove, the surface of the second groove and the surface of the insulating layer; forming solder mask layers on the surfaces of the wiring metal layers, wherein openings are formed in the solder mask layers, and partial surfaces of the wiring metal layers are exposed from the openings; forming solder balls located on the surfaces of the wiring metal layers in the openings. The chip packaging method can improve reliability of the packaging structure.
Owner:CHINA WAFER LEVEL CSP

Discharging and packaging mechanism capable of uniformizing material components in food material bags

The discharging and packaging mechanism comprises a discharging mechanism and a packaging mechanism, the discharging mechanism comprises a feeding pipeline, a transmission shaft is arranged in the feeding pipeline, a rotating plate is fixedly arranged on the transmission shaft, one end of the feeding pipeline extends into a plastic packaging bag, and the other end of the feeding pipeline extends into the packaging bag. The feeding pipeline is provided with a plurality of sets of feeding outlets penetrating through the interior and the exterior, the side face of the end, located outside the plastic packaging bag, of the feeding pipeline communicates with an external feeding pipe, the discharging mechanism can evenly convey and store materials into the plastic packaging bag, and the phenomena that the materials in the plastic packaging bag are layered and separated from one another are avoided; the phenomenon that in the prior art, even utilization of ingredients in the sauce cannot be guaranteed when people eat part of the sauce in a plastic packaging bag is solved, the sauce in the plastic packaging bag is evenly distributed after the discharging mechanism is used, even distribution of the ingredients can be guaranteed when people eat part of the sauce in the plastic packaging bag, and the taste is not affected.
Owner:HUAINAN YISHENG FOOD

Multilayer proton exchange membrane for water electrolysis and preparation method thereof

The invention discloses a multi-layer proton exchange membrane for water electrolysis, the multi-layer proton exchange membrane comprises a five-layer structure which sequentially comprises a long side chain perfluorinated sulfonic acid resin layer, a short side chain perfluorinated sulfonic acid resin layer, a microporous layer, a short side chain perfluorinated sulfonic acid resin layer and a long side chain perfluorinated sulfonic acid resin layer, and the preparation method comprises the following steps: firstly, dissolving long side chain resin and short side chain resin to prepare a membrane casting solution; secondly, filling the long-side-chain perfluorinated sulfonic acid resin solution and the short-side-chain perfluorinated sulfonic acid resin solution into a coating die head for layered coating and film forming; laying a polytetrafluoroethylene microporous membrane again, and carrying out layered coating on the long and short side chain perfluorinated sulfonic acid resin solution to obtain a composite structure; and rolling and laminating the prepared composite layer II to obtain the multi-layer proton exchange membrane for water electrolysis. The proton exchange membrane disclosed by the invention is better in uniformity; the long side chain resin and the short side chain resin are alternated, so that high conductivity under low IEC can be realized, the proton exchange composite membrane has relatively good chemical stability, dimensional stability and relatively high conductivity, and the problems of poor proton conductivity and short service life in the operation process are solved.
Owner:DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI

Piezoelectric ceramic with laminated structure and preparation method and application thereof

ActiveCN114149258AImproving temperature stability of electrostrainHigh electrostrainPiezoelectric/electrostrictive/magnetostrictive devicesCeramicCeramic materials
The invention discloses piezoelectric ceramic with a laminated structure as well as a preparation method and application of the piezoelectric ceramic. The preparation method of the piezoelectric ceramic with the laminated structure comprises the following steps: obtaining raw material powder: obtaining piezoelectric ceramic powder of at least two systems with different Curie temperature points, taking corresponding components of multiphase coexistence points of the respective systems as cores, and respectively selecting the cores and components floating within 15% on the two sides of the cores as the piezoelectric ceramic powder; and preparing a finished product: superposing the piezoelectric ceramic powder layer by layer to form a semi-finished product with a laminated structure, sintering, cleaning, cutting and sputtering to prepare the finished product. The electrostrictive strain of the piezoelectric ceramic with the laminated structure prepared by the invention almost expresses relatively high electrostrictive strain in a single component at different temperatures, that is, the peak value of the piezoelectric ceramic with the laminated structure in the temperature range interval is equal to or even higher than the peak values of BTS0.105 piezoelectric ceramic and BTH0.11 piezoelectric ceramic, and the piezoelectric ceramic has a comprehensive effect.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +1

Multilayer step PCB manufacturing method, PCB and electronic equipment

The invention relates to the field of PCB manufacturing, and particularly discloses a multi-layer step PCB manufacturing method, a PCB and electronic equipment, the inner layer of the layer where a step layer is located is machined, and the method comprises the steps that firstly, an inner layer pattern of a step groove area is manufactured, and then an inner layer pattern except the step groove area is manufactured; inner layers of other common layers are processed; the manufactured layers are subjected to board matching and pressing, and then an outer layer pattern is manufactured; according to the depths of different layers, the layers are milled in a depth-controlled milling mode; and after depth-controlled milling is completed, redundant resin is removed in a drilling dirt removing mode. In the manufacturing process, the inner layer of the layer where the step layer is located is manufactured firstly, the depth is controlled during outer side depth-controlled milling, it is guaranteed that no adhesive residue exists, then redundant resin is removed in a drilling dirt removing mode, finally, the PCB is manufactured in a one-time pressing mode, machining of the step PCB of any layer can be achieved, the layering situation is avoided, and reliability is good; the process is short, the cost is low, and any manual operation is not needed; and gummosis at the step can be completely avoided.
Owner:SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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