The invention relates to the field of PCB manufacturing, and particularly discloses a multi-layer step PCB manufacturing method, a PCB and
electronic equipment, the inner layer of the layer where a step layer is located is machined, and the method comprises the steps that firstly, an inner layer pattern of a step groove area is manufactured, and then an inner layer pattern except the step groove area is manufactured; inner
layers of other common
layers are processed; the manufactured
layers are subjected to board matching and pressing, and then an outer layer pattern is manufactured; according to the depths of different layers, the layers are milled in a depth-controlled milling mode; and after depth-controlled milling is completed, redundant resin is removed in a drilling
dirt removing mode. In the manufacturing process, the inner layer of the layer where the step layer is located is manufactured firstly, the depth is controlled during outer side depth-controlled milling, it is guaranteed that no
adhesive residue exists, then redundant resin is removed in a drilling
dirt removing mode, finally, the PCB is manufactured in a one-time pressing mode,
machining of the step PCB of any layer can be achieved, the layering situation is avoided, and reliability is good; the process is short, the cost is low, and any manual operation is not needed; and
gummosis at the step can be completely avoided.