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Multilayer step PCB manufacturing method, PCB and electronic equipment

A technology of PCB board and manufacturing method, which is applied in the direction of removing conductive materials, printed circuits, electrical components, etc. by chemical/electrolytic methods, and can solve problems such as low reliability, many times of pressing, and high cost, so as to avoid steps. The effect of glue flow, good reliability and short process

Pending Publication Date: 2022-04-05
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process has the following defects: the number of pressing times is too high, and if you encounter a 3-10-level stepped PCB board, it is completely impossible to realize, and due to the number of pressing times, the PCB board is easy to delaminate, and the reliability is not high; the process is long and the cost is high , Too many manual operations are required; it is impossible to completely avoid the generation of glue flow at the steps

Method used

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  • Multilayer step PCB manufacturing method, PCB and electronic equipment

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Effect test

Embodiment 1

[0031] Such as figure 1 Shown is a schematic flow chart of a method for manufacturing a multi-level ladder PCB provided in Embodiment 1, including the following steps.

[0032] S101. Processing the inner layer of the layer where the step layer is located includes first making the inner layer graphics in the stepped groove area, and then making the inner layer graphics except the stepped groove area.

[0033] Firstly, the inner layer of the layer where the step layer is located is processed. The layer where the step layer is located includes the step groove area and the non-step groove area. These two types of areas use different processes to make the inner layer graphics, so they should be produced separately. Specifically, the inner layer graphics in the stepped groove area are made first, and then the inner layer graphics except the stepped groove area are made.

[0034] S102, processing other common layer inner layers.

[0035] In S103, the prepared layers are matched and...

Embodiment 2

[0041] This embodiment 2 provides a method for manufacturing a multi-layer ladder PCB board. First, process the inner layer of the layer where the ladder layer is located, including first making the inner layer graphics in the stepped groove area, and then making the inner layer graphics except the stepped groove area; and then processing other common For the inner layer of the layer, the prepared layers are matched and pressed together, and then the outer layer graphics are made, and then according to the depth of different layers, milling is carried out to the corresponding layer by means of controlled depth milling; after the controlled depth milling is completed, use the drill to remove dirt way to remove excess resin. Wherein, when processing the inner layer of the layer where the stepped layer is located, the inner layer graphics in the stepped groove area are firstly made, and then the inner layer graphics except the stepped groove area are made. Among them, different p...

Embodiment 3

[0060] In the method for manufacturing a multi-layered stepped PCB board provided in Embodiment 3, firstly process the inner layer of the layer where the stepped layer is located, including first making the inner layer graphics in the stepped groove area, and then making the inner layer graphics except the stepped groove area; and then processing other For the inner layer of the ordinary layer, the prepared layers are matched and pressed together, and then the outer layer graphics are made, and then according to the depth of different layers, the method of controlled depth milling is used to mill to the corresponding layer; after the controlled depth milling is completed, use de-drilling Remove excess resin in a dirty manner.

[0061] Wherein, when processing the inner layer of the layer where the stepped layer is located, the inner layer graphics in the stepped groove area are firstly made, and then the inner layer graphics except the stepped groove area are made. Among them,...

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Abstract

The invention relates to the field of PCB manufacturing, and particularly discloses a multi-layer step PCB manufacturing method, a PCB and electronic equipment, the inner layer of the layer where a step layer is located is machined, and the method comprises the steps that firstly, an inner layer pattern of a step groove area is manufactured, and then an inner layer pattern except the step groove area is manufactured; inner layers of other common layers are processed; the manufactured layers are subjected to board matching and pressing, and then an outer layer pattern is manufactured; according to the depths of different layers, the layers are milled in a depth-controlled milling mode; and after depth-controlled milling is completed, redundant resin is removed in a drilling dirt removing mode. In the manufacturing process, the inner layer of the layer where the step layer is located is manufactured firstly, the depth is controlled during outer side depth-controlled milling, it is guaranteed that no adhesive residue exists, then redundant resin is removed in a drilling dirt removing mode, finally, the PCB is manufactured in a one-time pressing mode, machining of the step PCB of any layer can be achieved, the layering situation is avoided, and reliability is good; the process is short, the cost is low, and any manual operation is not needed; and gummosis at the step can be completely avoided.

Description

technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a method for manufacturing a multi-layer ladder PCB board, a PCB board and electronic equipment. Background technique [0002] In the fields of communication and servers, multi-level ladder PCBs are often used. At present, the conventional production process of such PCBs is very complicated: taking two-level ladder PCB products as an example, it is first necessary to press the inner layer of the ladder groove where the first level is located. Protect it by means of gaskets and tapes, and then press the inner layer of the stepped groove where the second layer is located, protect it by pasting gaskets and tapes, and finally press the outer PCB board. After three times of lamination, the controlled depth milling method is used to mill out different levels of stepped grooves, and the gasket and tape are torn off to form a multi-level stepped PCB board. This process has the fol...

Claims

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Application Information

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IPC IPC(8): H05K3/10H05K3/06H05K3/18H05K3/26
Inventor 张永甲宋玉娜汪亚军
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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