Multilayer step PCB manufacturing method, PCB and electronic equipment

A technology of PCB board and manufacturing method, which is applied in the direction of removing conductive materials, printed circuits, electrical components, etc. by chemical/electrolytic methods, and can solve problems such as low reliability, many times of pressing, and high cost, so as to avoid steps. The effect of glue flow, good reliability and short process

Pending Publication Date: 2022-04-05
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process has the following defects: the number of pressing times is too high, and if you encounter a 3-10-level stepped PCB board, it is completely impossible to realize, and due to the number of pressing times, the PCB

Method used

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  • Multilayer step PCB manufacturing method, PCB and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example one

[0031] Such as figure 1 A multi-hierarchical step PCB board manufacturing method is shown in the present embodiment, including the following steps.

[0032] S101, the hierarchy of the processing step layer, including first in the ladder groove region, and then produces an inner layer pattern except the step area.

[0033] First, the inner layer of the hierarchy of the step layer is processed, and the level of the stepper is located includes a stepwise area and a non-step slot area. The two types of regions are used to use different processes when the inner layer graphics is used, so it is necessary to separate. Specifically, the inner layer pattern in the ladder tank region is produced, and then the inner layer pattern except the step area is produced.

[0034] S102, processing other ordinary hierarchies.

[0035] S103, the production of a good layer is pressed, and the outer layer pattern is produced.

[0036] It should be noted that the bobbin is performed u...

Example Embodiment

[0040] Example 2

[0041] The second embodiment provides a multi-hierarchical step PCB plate fabrication method, first processed the horizontal layer of the step layer, including first layers of the ladder area, and then produce inner layer graph outside the step area; Inside the hierarchy, the producing layers are pressed, and the outer graphics are produced, and the depth of different levels is made, and the method of controlling and deep milling is made to the level; after the control and deep milling is completed, the drill stain is used. The excess resin is removed. Among them, in the hierarchy of the stepped layer, the inner layer pattern in the step groove region is first produced, and the inner layer pattern except the step area is produced. The inner layer graphics production and inner layer graphics in the ladder tank region use different processes. Specifically, in the inner layer pattern of non-ladder grooves, the traditional inner graphic processing process is used. T...

Example Embodiment

[0059] Example three

[0060] In this first embodiment, a multi-hierarchical step PCB plate fabrication method is provided, first processed the horizontal layer of the stepper, including first in the ladder groove region, and then produces an inner layer pattern outside the step area; In the normal hierarchy, the production of a good layer is pressed, and then the outer graph is produced, and according to the depth of different levels, it is used to use the control and deep milling to the hierarchy; after the control of the depth mill, use to drill Excessive resin is removed.

[0061] Among them, in the hierarchy of the stepped layer, the inner layer pattern in the step groove region is first produced, and the inner layer pattern except the step area is produced. The inner layer graphics production and inner layer graphics in the ladder tank region use different processes. In addition, the traditional processing process can be used when processing other ordinary hierarchical layer...

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Abstract

The invention relates to the field of PCB manufacturing, and particularly discloses a multi-layer step PCB manufacturing method, a PCB and electronic equipment, the inner layer of the layer where a step layer is located is machined, and the method comprises the steps that firstly, an inner layer pattern of a step groove area is manufactured, and then an inner layer pattern except the step groove area is manufactured; inner layers of other common layers are processed; the manufactured layers are subjected to board matching and pressing, and then an outer layer pattern is manufactured; according to the depths of different layers, the layers are milled in a depth-controlled milling mode; and after depth-controlled milling is completed, redundant resin is removed in a drilling dirt removing mode. In the manufacturing process, the inner layer of the layer where the step layer is located is manufactured firstly, the depth is controlled during outer side depth-controlled milling, it is guaranteed that no adhesive residue exists, then redundant resin is removed in a drilling dirt removing mode, finally, the PCB is manufactured in a one-time pressing mode, machining of the step PCB of any layer can be achieved, the layering situation is avoided, and reliability is good; the process is short, the cost is low, and any manual operation is not needed; and gummosis at the step can be completely avoided.

Description

technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a method for manufacturing a multi-layer ladder PCB board, a PCB board and electronic equipment. Background technique [0002] In the fields of communication and servers, multi-level ladder PCBs are often used. At present, the conventional production process of such PCBs is very complicated: taking two-level ladder PCB products as an example, it is first necessary to press the inner layer of the ladder groove where the first level is located. Protect it by means of gaskets and tapes, and then press the inner layer of the stepped groove where the second layer is located, protect it by pasting gaskets and tapes, and finally press the outer PCB board. After three times of lamination, the controlled depth milling method is used to mill out different levels of stepped grooves, and the gasket and tape are torn off to form a multi-level stepped PCB board. This process has the fol...

Claims

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Application Information

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IPC IPC(8): H05K3/10H05K3/06H05K3/18H05K3/26
Inventor 张永甲宋玉娜汪亚军
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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