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A kind of metamaterial laminated board and preparation method thereof

A technology of metamaterials and laminates, applied in chemical instruments and methods, lamination, layered products, etc., can solve problems affecting the performance of laminates, layer failure, etc., to enhance stability, reduce thermal expansion stress, reduce metal The effect of the material carrier

Active Publication Date: 2021-01-01
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The supermaterial laminates prepared according to the above method have the following disadvantages: 1. The thermal stress caused by the thermal expansion coefficient mismatch between the material panel, the metal structure and the carrier makes the delamination fail at high temperature; 2. The composite material panel and the metal If the bonding strength between the structures does not meet the requirements, it is easy to generate stress concentration and lead to product delamination; 3. The performance of the carrier (soft board) itself will also affect the overall performance of the laminate

Method used

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  • A kind of metamaterial laminated board and preparation method thereof
  • A kind of metamaterial laminated board and preparation method thereof

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preparation example Construction

[0023] Fabrication method of metamaterial laminate

[0024] Such as figure 1 As shown in step S101 of , the composite material substrate, composite material prepreg and metal foil are laminated and laminated in sequence. In step S101 , lamination molding is performed at a temperature between 60° C. and 100° C., preferably, lamination molding is performed at a temperature between 80° C. and 100° C., which improves the efficiency of lamination molding. In step S101, use a hot roller press to implement lamination molding, and the pressure of the roller press is 2 to 30 kg / cm 2 , the rolling speed is 1-10m / min. In step S101 , the composite material substrate has a thickness of 0.5mm˜2mm. In step S101, the thickness of the composite material prepreg is 0.1mm-1mm.

[0025] Such as figure 1 As shown in step S103 of , a predetermined conductive geometric structure is processed on the metal foil. In step S103, a predetermined conductive geometric structure is processed on the met...

Embodiment 1

[0030] A composite material substrate with a thickness of 0.5 mm, a composite material prepreg with a thickness of 0.1 mm, and a silver foil with a thickness of 10 μm are laminated in sequence and laminated with a hot roller press at 80 ° C. 30kg / cm for roll pressure 2 , the rolling speed is 10m / min; laser engraving is used to process a predetermined conductive geometric structure on the silver foil; the surface of the silver foil is covered with transparent polyethylene terephthalate ( PET) release film to obtain a supermaterial layer; the composite material prepreg and the supermaterial layer are cured for 8 hours under the conditions of a pressure of -0.1MPa and a temperature of 260°C to obtain a supermaterial laminate.

Embodiment 2

[0032] A composite material substrate with a thickness of 2 mm, a composite material prepreg with a thickness of 1 mm, and a copper foil with a thickness of 200 μm are stacked in sequence and laminated with a hot roll press at 60 ° C. The roll pressure is The pressure is 18kg / cm 2 , the rolling speed is 5m / min; the predetermined conductive geometric structure is processed on the copper foil by micro-etching technology; the polyethylene terephthalate ( PET) release film to obtain a metamaterial layer, and the composite material prepreg and the metamaterial layer are cured for 5 hours under the conditions of a pressure of -0.6MPa and a temperature of 200°C to obtain a supermaterial laminate.

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Abstract

The invention provides a metamaterial laminate and a preparing method thereof. The method comprises the steps of conducting lamination, laying and laminating forming on a composite material substrate, a composite material prepreg and tinsel in sequence; machining a predetermined conductive geometric structure on tinsel; covering the upper portion of the surface of tinsel with transparent thin film to prepare a metamaterial layer; conducting curing molding on the composite material prepreg and the metamaterial layer to prepare the metamaterial laminate. In the metamaterial laminate prepared through the method, the binding areas among different layers of the metamaterial laminate are broadened, the thermal expansion stress among different materials is reduced, the structural stability of the metamaterial laminate is strengthened, and thus the situation that the laminate is layered cannot occur; meanwhile, metal material carriers are reduced, and the strength of the laminate is drastically improved on the condition that important performance of electrical performance, stealth performance and the like is not changed.

Description

technical field [0001] The invention relates to the field of supermaterial laminated boards, and more specifically relates to a supermaterial laminated board and a preparation method thereof. Background technique [0002] The panels of laminated boards in the prior art use material interfaces with different properties. When there is no adhesive between the panels, the bonding degree is weak, especially the fiber polymer composite material panel and the metal material structure, and the composite material panel and the metal material structure. The bonding strength between material carriers will directly affect the strength of the laminate, and even cause delamination during use. [0003] Existing metamaterial laminates generally obtain the carrier soft board with the required metal structure by etching the carrier (soft board) material with the metal material panel, and then combine it with the composite material prepreg in a certain order Perform stack curing. The superma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06B32B15/09B32B33/00
CPCB32B15/09B32B33/00B32B37/06B32B37/10
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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