Camera module

A camera module and lens technology, applied in image communication, television, optics, etc., which can solve the problems of space occupation, limited tolerance gap and fit, and large volume of supporting objects

Pending Publication Date: 2018-06-29
SHENZHEN E WELLY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology can be disassembled, which is convenient for maintenance, but the size is large, especially the side of the support 2 takes up space, and the support 2 is too large, which is limited by the tolerance gap and fit of the conventional assembly method

Method used

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] A camera module, comprising a lens 101, an integrated lens 102, a capacitor 103, a connector 104, a circuit board 105, a gold wire 106, a chip 107, and an optical filter 108, the lens 101 is arranged on the integrated lens 102 Inside. The integrated lens 102 is provided with a lens support part 201 , a space-avoiding part 202 , and a filter support part 203 , and the chip 107 is directly embedded in the lens support part 201 of the inner cavity at the bottom of the integrated lens 102 . The optical filter 108 is directly embedded in the optical filter support portion 203 of the inner cavity at the bottom of the integrated lens 102 .

[0023] The filter 108 , the chip 107 are kept parallel to the integrated lens 102 . The central symmetry axes of the filter 108 , the chip 107 and the integrated lens 102 are coincident.

[0024] The circuit board 105 and the ch...

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PUM

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Abstract

The invention provides a camera module comprising an integrated lens, a chip and an optical filter. The integrated lens is provided with a lens supporting part and an optical filter supporting part, the chip is directly disposed on the lens supporting part in the inner cavity at the bottom of the integrated lens, the optical filter is directly disposed on the optical filter supporting part in theinner cavity at the bottom of the integrated lens, and the optical filter and the chip are kept in parallel with the integrated lens. By adoption of the scheme, the conventional mode of packaging a gold wire and a capacitor in a support is broken through, the chip is directly embedded on the lens supporting part in the inner cavity at the bottom of the integrated lens, thereby ensuring the parallel situation between the lens and the chip, and meanwhile, after the lens and the chip are packaged, clear focusing is directly performed, therefore non-focus assembly is achieved. The distance betweenthe lens and the chip is directly controlled by both, thus eliminating a base and reducing the size.

Description

technical field [0001] The invention relates to the conceived field, in particular to a camera module. Background technique [0002] Such as figure 1 As shown, the names of the components in the figure are as follows: lens assembly 1, holder 2, gold wire 3, capacitor 4, chip 5, and optical filter 6. The holder 2 positions the distance between the chip 5 , the optical filter 6 and the lens assembly 1 . Conventional mobile phone camera module: the main feature is that it is connected by gold wire 3 , and the sensor, gold wire 3 , and capacitor 4 are packaged inside the holder 2 . The prior art can be disassembled to facilitate maintenance, but the size is large, especially the side of the support 2 takes up space, and the support 2 is too large, which is limited by the tolerance gap and fit of conventional assembly methods. The soldering of IC, gold wire, capacitor, resistor and other devices is easy to produce debris and dust to pollute the photosensitive area of ​​the sen...

Claims

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Application Information

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IPC IPC(8): H04N5/225G03B17/12
CPCG03B17/12H04N23/54H04N23/55
Inventor 李东
Owner SHENZHEN E WELLY ELECTRONICS
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