Automatic dispensing and curing system for silicon rods
A technology of automatic glue dispensing and silicon rods, which is applied to the device and coating of the surface coating liquid, which can solve the problems of high labor cost, low production efficiency of silicon wafers, and lower qualified rate of silicon wafers, so as to save labor costs , to achieve the effect of repeated use
Active Publication Date: 2021-05-18
SIP GOLDWAY TECH
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Problems solved by technology
At present, generally the bonding of the fixing fixtures, substrates and silicon rods is done manually, which makes the production efficiency of silicon wafers low and the labor cost is relatively high, which is not conducive to the realization of large-scale production of silicon wafers;
[0003] At the same time, when the silicon wafer has just been produced, the glue has not yet completely solidified. At this time, the silicon wafer bonded on the substrate is easily affected by external forces (such as accidental touch by the operator, light collision with other objects during the handling process) The role of skew, reduce the yield of silicon wafers
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[0022] The present invention will be described in detail below in conjunction with various embodiments shown in the accompanying drawings, please refer to Figure 1 to Figure 5 Shown is a preferred embodiment of the present invention.
[0023] The present invention provides an automatic dispensing and curing system 100 for silicon rods, which is used to realize the fully automated production of silicon wafers, thereby reducing labor costs and avoiding damage to newly produced silicon wafers due to human operations during the production process. cause loss.
[0024] The automatic dispensing and curing system 100 for silicon rods includes a silicon rod body feeding device 1 providing a silicon rod body 11, a substrate feeding device 2 providing a substrate 21, a fixing fixture feeding device 3 providing a fixing fixture 31, and The substrate 21 and the silicon rod body 11 that are positioned in the fixing fixture 31 are bonded together to form the dispensing chamber 4 of the si...
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The invention provides an automatic dispensing and curing system for silicon rods, which includes a silicon rod body feeding device, a substrate feeding device, a fixing fixture feeding device, a dispensing room, a primary curing device, a secondary curing device, a control unit, and The dismantling transfer device between the preliminary curing outlet of the preliminary curing device and the fixed fixture feeding end of the fixed fixture feeding device, the dismantling and transferring device includes disassembling the silicon rod from the fixing fixture and transporting the silicon rod to the secondary curing device. A manipulator unit, the first conveying unit that transports the fixed jig to the feeding end of the fixed jig, the first manipulator unit, and the first conveying unit are connected to the control unit in communication; Automatic dispensing and curing of silicon rods saves labor costs and avoids damage to newly produced silicon wafers due to human operations during the production process; on the other hand, it can realize the reuse of fixing fixtures.
Description
technical field [0001] The invention relates to a single crystal silicon bonding machine, in particular to an automatic dispensing and curing system for silicon rods. Background technique [0002] When manufacturing silicon wafers, it is necessary to sequentially bond the fixtures for fixing the silicon rods, the substrate and the silicon rods with glue. At present, generally the bonding of the fixing fixtures, substrates and silicon rods is done manually, which makes the production efficiency of silicon wafers low and the labor cost is relatively high, which is not conducive to the realization of large-scale production of silicon wafers; [0003] At the same time, when the silicon wafer has just been produced, the glue has not yet completely solidified. At this time, the silicon wafer bonded on the substrate is easily affected by external forces (such as accidental touch by the operator, light collision with other objects during the handling process) The role of skewed, re...
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IPC IPC(8): B05C5/02B05C9/14B05C13/02
CPCB05C5/0212B05C9/14B05C13/02
Inventor沈皓然
OwnerSIP GOLDWAY TECH