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Power measurement via bond wire coupling

A technology of power measurement and bonding wire, which is applied in the direction of measuring devices, measuring electrical variables, measuring electrical power, etc., and can solve the problem of RF power coupler space consumption

Active Publication Date: 2022-06-14
NXP USA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For these reasons, RF power couplers have consumed a lot of space on printed circuit boards, for example
RF power couplers can also introduce undesirably long time delays in the output signal when used for power control or linearization

Method used

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  • Power measurement via bond wire coupling
  • Power measurement via bond wire coupling
  • Power measurement via bond wire coupling

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Embodiment Construction

[0071] Embodiments of a power measurement device with a bond wire based coupler are described, along with a method of measuring power using coupled bond wires. The devices include power measurement (or monitoring) devices, or power sensors, and power amplifier devices including such power measurement devices or power sensors. The power measurement device includes two couplers: one for monitoring forward power and the other for monitoring reflected power. Each coupler includes a coupling bond wire inductively coupled to a set of bond wires connecting the input port and the output port of the power measurement device.

[0072] The wire bond-based coupler of the disclosed device allows for a two-way coupler to be implemented in a compact and efficient manner. For example, both forward and reflected power are monitored with high directivity or isolation between forward and reflected power output ports. Efficient monitoring of both forward and reflected power is also achieved wit...

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PUM

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Abstract

An apparatus includes an output circuit comprising: an input port at which a signal is received; an output port at which an impedance adjusted representation of the signal is provided; and a set of bond wires, The combination wire connects the input port and the output port. The apparatus additionally includes a first coupler and a second coupler each including a corresponding coupling along the set of bond wires for inductively coupling with the set of bond wires. bonding wire. The first coupler is oriented relative to a distributed element output circuit to measure forward power provided through the output port by the impedance adjusted representation of the signal. The second coupler is oriented relative to the output circuit to measure reflected power received through the output port.

Description

technical field [0001] Embodiments of the present invention relate to amplifiers. Background technique [0002] The amplifier uses power transistor devices to produce an amplified version of the input signal. The input signal is often modulated to carry information. To avoid distortion or other loss of information, the power transistor arrangement is configured and operated to amplify the input signal in a linear fashion. [0003] Power transistor devices are often controlled to improve operating characteristics. For example, the power transistor device may be controlled to limit the input signal or bias voltage to a level at which the power transistor device operates in an efficient and linear manner. In linearization control schemes, the output power of the power transistor arrangement is often monitored. Output monitoring is used to ensure that the modulation component of the input signal in the amplified output signal is acceptably linear. [0004] Radio frequency (...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R21/00
CPCG01R21/00H01L24/49H01P5/185H03F1/565H03F2200/465H03F2203/21139H03F2203/21163H01L24/45H01L24/48H01L2224/45015H01L2224/45124H01L2224/45144H01L2224/48091H01L2224/4813H01L2224/49175H03F3/195H01L2924/13091H05B6/686H01L2924/00014H01L2924/20755H01L2924/00H05B6/6467H03H7/38H03F3/213H01L23/66H05B6/68H05B6/681G01R21/12H03F2200/451H01L2223/6655H01L2223/6611
Inventor 邱小飞利昂内尔·蒙然皮埃里·马里·让·皮埃尔
Owner NXP USA INC